Embodiments of the present disclosure can include a method for frequency trimming a microelectromechanical resonator, the resonator comprising a substrate and a plurality of loading elements layered on a surface of the substrate, the method comprising: selecting a first loading element of the plurality of loading elements, the first loading element being layered on a surface of a region of interest of the substrate; heating the first loading element and substrate within the region of interest to a predetermined temperature using an optical energy source, causing the first loading element to diffuse into the substrate; and cooling the region of interest to form a eutectic composition layer bonding the loading element and the substrate within the region of interest.

Embodiments of the present disclosure can include a method for frequency trimming a microelectromechanical resonator, the resonator comprising a substrate and a plurality of loading elements layered on a surface of the substrate, the method comprising: selecting a first loading element of the plurality of loading elements, the first loading element being layered on a surface of a region of interest of the substrate; heating the first loading element and substrate within the region of interest to a predetermined temperature using an optical energy source, causing the first loading element to diffuse into the substrate; and cooling the region of interest to form a eutectic composition layer bonding the loading element and the substrate within the region of interest.

A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.

A polarizing layer includes a base film and a deformation part provided in an edge of the base film. The deformation part includes first deformation parts formed as the base film is deformed by heat, and at least one second deformation part provided between the first deformation parts adjacent to each other.

The present invention provides a method of manufacturing a spark plug which is capable of securing a bonding strength at the middle of a chip while suppressing an occurrence of scattering. The method of manufacturing the spark plug having a ground electrode to which a bonding surface of a chip is welded, has a machining process of machining the ground electrode such that an area located inside an edge of a welding-planned part where the chip is welded on the ground electrode and including a center of the welding-planned part is rougher than a section except the area of the welding-planned part, and a bonding process of bonding the chip to the welding-planned part of the ground electrode after undergoing the machining process by resistance welding.

The present invention provides a method of manufacturing a spark plug which is capable of securing a bonding strength at the middle of a chip while suppressing an occurrence of scattering. The method of manufacturing the spark plug having a ground electrode to which a bonding surface of a chip is welded, has a machining process of machining the ground electrode such that an area located inside an edge of a welding-planned part where the chip is welded on the ground electrode and including a center of the welding-planned part is rougher than a section except the area of the welding-planned part, and a bonding process of bonding the chip to the welding-planned part of the ground electrode after undergoing the machining process by resistance welding.

A peeling method at low cost with high mass productivity is provided. A silicon layer having a function of releasing hydrogen by irradiation with light is formed over a formation substrate, a first layer is formed using a photosensitive material over the silicon layer, an opening is formed in a portion of the first layer that overlaps with the silicon layer by a photolithography method and the first layer is heated to form a resin layer having an opening, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, a conductive layer is formed to overlap with the opening of the resin layer and the silicon layer, the silicon layer is irradiated with light using a laser, and the transistor and the formation substrate are separated from each other.

A peeling method at low cost with high mass productivity is provided. A silicon layer having a function of releasing hydrogen by irradiation with light is formed over a formation substrate, a first layer is formed using a photosensitive material over the silicon layer, an opening is formed in a portion of the first layer that overlaps with the silicon layer by a photolithography method and the first layer is heated to form a resin layer having an opening, a transistor including an oxide semiconductor in a channel formation region is formed over the resin layer, a conductive layer is formed to overlap with the opening of the resin layer and the silicon layer, the silicon layer is irradiated with light using a laser, and the transistor and the formation substrate are separated from each other.

The present disclosure is directed to processes for forming or otherwise creating a transparent, conductive film from a heavy hydrocarbon material. It allows for what is often considered to be waste material to be transformed into a useful product, such as a heating element. Such heating elements can be incorporated into many contexts where it can be important to have transparency and/or a thin heating element, such as in windshields. The process involves dissolving a heavy hydrocarbon material in a solvent, casting the heavy hydrocarbon solution that results from the dissolving onto a substrate to form a film, and then annealing the film. The disclosure also provides for objects in which such resulting films can be used, such as Joule heaters.

The present disclosure is directed to processes for forming or otherwise creating a transparent, conductive film from a heavy hydrocarbon material. It allows for what is often considered to be waste material to be transformed into a useful product, such as a heating element. Such heating elements can be incorporated into many contexts where it can be important to have transparency and/or a thin heating element, such as in windshields. The process involves dissolving a heavy hydrocarbon material in a solvent, casting the heavy hydrocarbon solution that results from the dissolving onto a substrate to form a film, and then annealing the film. The disclosure also provides for objects in which such resulting films can be used, such as Joule heaters.