The invention relates to a method for machining a transparent workpiece (4) by generating non-linear absorption of laser radiation in a laser beam focus located in a volume of the workpiece (4). The object of the invention is that of providing a method of improved precision and quality, and a corresponding device, for laser machining of workpieces. In particular, it is also intended for it to be possible for workpieces made of composite materials or of other special materials, such as filter glass, to be machined at an improved level of quality. For this purpose, the method according to the invention comprises the following steps: spectroscopic measurement of the linear absorption of the laser radiation in the workpiece (4), selecting a working wavelength at which the linear absorption is low, and machining the workpiece (4) by means of application of laser radiation at the working wavelength. The invention furthermore relates to a corresponding device for machining a transparent workpiece (4).

A laser processing apparatus for processing a plate-shaped workpiece by applying a laser beam to the workpiece, includes a cassette table for placing thereon a cassette in which a plurality of workpieces are accommodated, a carrying-out unit for carrying out the workpiece from the cassette placed on the cassette table, and a laser beam applying unit including a focusing unit for applying the laser beam to the workpiece held on the chuck table. The carrying-out unit carries out the workpiece having been processed by the laser beam applying unit from the chuck table, and accommodates the workpiece into the cassette placed on the cassette table.

A laser processing apparatus for processing a plate-shaped workpiece by applying a laser beam to the workpiece, includes a cassette table for placing thereon a cassette in which a plurality of workpieces are accommodated, a carrying-out unit for carrying out the workpiece from the cassette placed on the cassette table, and a laser beam applying unit including a focusing unit for applying the laser beam to the workpiece held on the chuck table. The carrying-out unit carries out the workpiece having been processed by the laser beam applying unit from the chuck table, and accommodates the workpiece into the cassette placed on the cassette table.

Systems, methods, and devices of the various embodiments may enable simultaneous preparation of a substrate for adhesive bonding and detection of minute contaminants on the substrate. Various embodiments may enable detection of contaminants on a surface of a substrate while the surface of the substrate is being prepared for adhesive bonding by laser ablation. Various embodiments may provide an integrated laser treatment and measurement system.

Systems, methods, and devices of the various embodiments may enable simultaneous preparation of a substrate for adhesive bonding and detection of minute contaminants on the substrate. Various embodiments may enable detection of contaminants on a surface of a substrate while the surface of the substrate is being prepared for adhesive bonding by laser ablation. Various embodiments may provide an integrated laser treatment and measurement system.

A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. A wafer producing method includes a separation start point forming step of applying a laser beam to the ingot to form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer, thus forming a separation start point. The focal point of the laser beam is relatively moved in a first direction perpendicular to a second direction where a c-axis in the ingot is inclined by an off angle with respect to a normal to the upper surface. The off angle is formed between the upper surface and a c-plane perpendicular to the c-axis, thereby linearly forming the modified layer extending in the first direction. The laser beam is applied to the ingot with the direction of the polarization plane of the laser beam set to the first direction.

The embodiments disclosed herein relate to methods, systems, and system components for creating and arranging small (micron and smaller) defects or perforations in transparent materials in a particular manner, and, more particularly, to the arrangement of these defects, each of which has an average crack length, in a predetermined spaced-apart relation (each defect separated from an adjacent defect by a predetermined distance) defining a contour in a transparent material to lower the relative interface fracture toughness for subsequent planned induced separation.

The embodiments disclosed herein relate to methods, systems, and system components for creating and arranging small (micron and smaller) defects or perforations in transparent materials in a particular manner, and, more particularly, to the arrangement of these defects, each of which has an average crack length, in a predetermined spaced-apart relation (each defect separated from an adjacent defect by a predetermined distance) defining a contour in a transparent material to lower the relative interface fracture toughness for subsequent planned induced separation.

The present disclosure provides a device and a method for laser-based separation of a transparent, brittle workpiece, comprising a laser that emits a laser beam having an intensity (I.sub.L) along an optical axis (P), and an optical device. The optical device has at least one one-piece double axicon. The double axicon has an entrance surface and the optical device has an exit surface. The entrance surface is such that in the double axicon, a ring beam is formed. The intensity (I.sub.L) in the double axicon is lower than the threshold intensity (I.sub.S) of the material of the double axicon. The exit surface is such that a line focus having a maximum intensity (I.sub.max) and a length (L.sub.T) is generated in the direction of the laser beam behind the exit.

A method of forming a separator for a lithium-ion battery includes arranging a polymer film in contact with a sacrificial layer to form a cutting stack. The method includes disposing the cutting stack between a first vitreous substrate and a second vitreous substrate. The method includes applying an infrared laser to the cutting stack through the first vitreous substrate to generate heat at the sacrificial layer. The method also includes transferring heat from the sacrificial layer to the polymer film to thereby cut out a portion of the polymer film and form the separator. A method of cutting a polymer film and a cutting system are also explained.