A grinding apparatus conveys a wafer from a first rough grinding unit and a first finish grinding unit to a first laser beam irradiation unit by a turntable. Thus, in one grinding apparatus, the wafer can be ground and damage of the wafer caused due to the grinding can be repaired easily and rapidly. Therefore, it is possible to execute the grinding of the wafer and the repair of the damage efficiently and favorably.

The present disclosure provides a device and a method for laser-based separation of a transparent, brittle workpiece, comprising a laser that emits a laser beam having an intensity (I.sub.L) along an optical axis (P), and an optical device. The optical device has at least one one-piece double axicon. The double axicon has an entrance surface and the optical device has an exit surface. The entrance surface is such that in the double axicon, a ring beam is formed. The intensity (I.sub.L) in the double axicon is lower than the threshold intensity (I.sub.S) of the material of the double axicon. The exit surface is such that a line focus having a maximum intensity (I.sub.max) and a length (L.sub.T) is generated in the direction of the laser beam behind the exit.

A device for laser heating of a mechanical part of the turbine blade or turbine blade element type, including: one or more laser emitters, for respectively emitting at least a first laser radiation at a first predetermined power towards a first target area of the part and for emitting a second laser radiation at a second predetermined power towards a second target area of the part, different from the first target area, the second predetermined power being different from the first predetermined power.

A device for laser heating of a mechanical part of the turbine blade or turbine blade element type, including: one or more laser emitters, for respectively emitting at least a first laser radiation at a first predetermined power towards a first target area of the part and for emitting a second laser radiation at a second predetermined power towards a second target area of the part, different from the first target area, the second predetermined power being different from the first predetermined power.

A method of fabricating an optical element comprises providing a substrate of a transparent material; and applying one or more focused femtosecond pulses of laser light with an elliptical polarisation to a volume within the substrate to create at least one nanostructure in the volume.

A method of forming a separator for a lithium-ion battery includes arranging a polymer film in contact with a sacrificial layer to form a cutting stack. The method includes disposing the cutting stack between a first vitreous substrate and a second vitreous substrate. The method includes applying an infrared laser to the cutting stack through the first vitreous substrate to generate heat at the sacrificial layer. The method also includes transferring heat from the sacrificial layer to the polymer film to thereby cut out a portion of the polymer film and form the separator. A method of cutting a polymer film and a cutting system are also explained.

The present disclosure provides a laser lift-off method for separating substrate and semiconductor-epitaxial structure, which includes: providing at least one semiconductor device, wherein the semiconductor device includes a substrate and at least one semiconductor-epitaxial structure disposed in a stack-up manner; irradiating a laser onto an edge area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the edge area; and pressing against the edge area of the semiconductor device vis a pressing device, then irradiating the laser onto an inner area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the inner area wherein gas is generated during separating the portions of the substrate and the semiconductor-epitaxial structure in the inner area and evacuated from the edge area, to prevent damage of the semiconductor-epitaxial structure during the separating process.

The present disclosure provides a laser lift-off method for separating substrate and semiconductor-epitaxial structure, which includes: providing at least one semiconductor device, wherein the semiconductor device includes a substrate and at least one semiconductor-epitaxial structure disposed in a stack-up manner; irradiating a laser onto an edge area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the edge area; and pressing against the edge area of the semiconductor device vis a pressing device, then irradiating the laser onto an inner area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the inner area wherein gas is generated during separating the portions of the substrate and the semiconductor-epitaxial structure in the inner area and evacuated from the edge area, to prevent damage of the semiconductor-epitaxial structure during the separating process.

A laser beam irradiation unit of a laser beam irradiation apparatus includes a laser beam source that emits a laser beam and a spatial light modulator that modulates the laser beam emitted from the laser beam source, according to a phase pattern, and that emits the laser beam. A controller has a storing section that stores the phase pattern to be displayed in the spatial light modulator and a rotation instructing section that rotates the phase pattern stored in the storing section. The controller uniformizes the power density of the laser beam with which a plate-shaped workpiece is irradiated, by rotating the phase pattern while the plate-shaped workpiece is irradiated with the laser beam.

A laser beam irradiation unit of a laser beam irradiation apparatus includes a laser beam source that emits a laser beam and a spatial light modulator that modulates the laser beam emitted from the laser beam source, according to a phase pattern, and that emits the laser beam. A controller has a storing section that stores the phase pattern to be displayed in the spatial light modulator and a rotation instructing section that rotates the phase pattern stored in the storing section. The controller uniformizes the power density of the laser beam with which a plate-shaped workpiece is irradiated, by rotating the phase pattern while the plate-shaped workpiece is irradiated with the laser beam.