A component arrangement and a method for producing the component arrangement are provided. The component arrangement includes a first component and a second component, which are arranged in an overlapping arrangement and are connected by a laser fillet weld and at two fixing points arranged laterally offset from the laser fillet weld, one of the components is provided with at least one projection, which projects in the direction of the other component and which is arranged and formed such that, when the components are positioned correctly in relation to one another and are pressed together at the fixing points, a flange portion of the first component, set at an angle in the region of the laser fillet weld to be formed, is pressed onto the second component by way of the component edge. For sealing the component arrangement, the fixing points are arranged set back into the overlapping region with respect to the laser fillet weld, and at least between the fixing points there is formed a continuous bonding region, in which the first and second components are bonded to one another.

Embedded die packaging for semiconductor devices and methods of fabrication wherein conductive vias are provided to interconnect contact areas on the die and package interconnect areas. Before embedding, a protective masking layer is provided selectively on regions of the electrical contact areas where vias are to be formed by laser drilling. The material of the protective masking layer is selected to protect against over-drilling and/or to control absorption properties of surface of the pad metal to reduce absorption of laser energy during laser drilling of micro-vias, thereby mitigating physical damage, overheating or other potential damage to the semiconductor device. The masking layer may be resistant to surface treatment of other regions of the electrical contact areas, e.g. to increase surface roughness to promote adhesion of package dielectric.

Embedded die packaging for semiconductor devices and methods of fabrication wherein conductive vias are provided to interconnect contact areas on the die and package interconnect areas. Before embedding, a protective masking layer is provided selectively on regions of the electrical contact areas where vias are to be formed by laser drilling. The material of the protective masking layer is selected to protect against over-drilling and/or to control absorption properties of surface of the pad metal to reduce absorption of laser energy during laser drilling of micro-vias, thereby mitigating physical damage, overheating or other potential damage to the semiconductor device. The masking layer may be resistant to surface treatment of other regions of the electrical contact areas, e.g. to increase surface roughness to promote adhesion of package dielectric.

This method of manufacturing a stator includes a step of removing insulating coatings on first surfaces of lead wire portions that are surfaces to be welded, and a step of welding together the first surfaces by a green laser with the insulating coatings on the first surfaces being removed and with insulating coatings on second surfaces opposite the first surfaces being unremoved.

This method of manufacturing a stator includes a step of removing insulating coatings on first surfaces of lead wire portions that are surfaces to be welded, and a step of welding together the first surfaces by a green laser with the insulating coatings on the first surfaces being removed and with insulating coatings on second surfaces opposite the first surfaces being unremoved.

A rechargeable battery pack. The rechargeable battery pack includes a housing, at least one rechargeable battery cell including a cell connector, and a circuit board. The at least one rechargeable battery cell being electrically connected to the circuit board via the cell connector. The circuit board includes a connection point for the materially bonded connection of the cell connector to the circuit board, the connection point being situated on a side of the circuit board facing away from the rechargeable battery cells.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.

A composite member is manufactured by a manufacturing method including adding, on a surface of a base member composed of a first material, a second material different from the first material, using additive manufacturing employing directed energy deposition as an additive manufacturing process. The manufacturing method is performed by placing the base member in a machining area of a machine tool configured to perform subtractive machining. Accordingly, a composite member can be obtained that is manufactured through additive manufacturing and that is in a state in which the composite member can be promptly machined.