Patent classifications
B24B7/06
Machine and method for processing a screen printing frame
A machine for processing a screen printing frame includes an upstream end and an opposed downstream end, a grinding assembly located between the upstream and downstream locations, wherein the grinding assembly includes a first grinder configured to grind a first pattern into the screen printing frame and a second grinder configured to grind a second pattern into the screen printing frame different from the first grinding pattern.
GRINDING APPARATUS AND GRINDING METHOD
A grinding apparatus includes grinding wheel side vibrational displacement calculation devices that obtain a vibrational displacement of a grinding wheel resulting from a vibration in an approaching/separating direction of the grinding wheel; main spindle side vibrational displacement calculation devices that obtain a vibrational displacement of a workpiece generated by propagation of the vibration in the approaching/separating direction of the grinding wheel; a relative vibrational displacement calculation unit that obtains a relative vibrational displacement between the grinding wheel and the workpiece based on the vibrational displacement of the grinding wheel and the vibrational displacement of the workpiece that have been obtained; a position change unit that creates, based on the obtained relative vibrational displacement between the grinding wheel and the workpiece, a position change command to change a position of the wheel spindle stock; and a processing controller that grinds the workpiece W based on the created position change command.
GRINDING MACHINE FOR GRINDING A SURFACE OF A WORKPIECE
The invention relates to a grinding machine for grinding a surface of a workpiece, wherein the grinding machine comprises a plurality of grinding elements (2) and at least one drive device, by means of which the plurality of grinding elements (2) can be set in oscillatory motion, wherein the grinding machine comprises at least two supporting structures (4), on which at least one grinding element (2) is arranged and which can be moved in an oscillatory manner in directions opposite each other by the at least one drive device.
GRINDING MACHINE FOR GRINDING A SURFACE OF A WORKPIECE
The invention relates to a grinding machine for grinding a surface of a workpiece, wherein the grinding machine comprises a plurality of grinding elements (2) and at least one drive device, by means of which the plurality of grinding elements (2) can be set in oscillatory motion, wherein the grinding machine comprises at least two supporting structures (4), on which at least one grinding element (2) is arranged and which can be moved in an oscillatory manner in directions opposite each other by the at least one drive device.
Device and Method for Processing Brake Linings Mounted on Carriers
The invention relates to a device (10) and a method for processing brake linings (44) which are mounted on lining supports (46), comprising a conveying device (16) for the continuous and automated displacement of brake linings (44) to be processed and at least one processing station (12). The conveying device (16) of a device according to the invention (10) comprises a plurality of support surfaces, which are driven by the conveying device (16) and are circumferentially arranged, for the arrangement of lining supports (46) of the brake linings (44) to be processed and positioning means rotating with the support surfaces, said positioning means counteracting a rotation of the lining carriers (46).
Grinding machine
The present invention comprises a grinding machine (1) for grinding a surface of a workpiece (6), wherein the grinding machine (1) has at least one abrasive holder (2), on which at least one abrasive (4) is arranged, and at least one drive device for moving the abrasive holder (2),
wherein the drive device has at least one drive shaft (12), on which an eccentric element (16) is arranged and which can be rotated about an axis of rotation (18), wherein the eccentric element (16) is arranged on the abrasive holder (2) at a distance from the axis of rotation (18), wherein it is possible to adjust the distance.
GRINDING MACHINE FOR GRINDING A SURFACE OF AN OBJECT
A grinding machine for grinding a surface of an object has at least one grinding tool with a movably mounted abrasive carrier, and a plurality of abrasive elements attached to the abrasive carrier. An abrasive driving device drives the grinding tool in a first relative movement to the object. A conveying device conveys the object with a second relative movement to the grinding tool through the grinding machine. The plurality of abrasive elements each have a plurality of first surfaces provided with first abrasive bodies for lying against the surface of the object in a first direction of movement of the abrasive carrier and a plurality of second surfaces provided with second abrasive bodies for lying against the surface of the object in a second direction of movement of the abrasive carrier opposite to the first direction of movement of the abrasive carrier. The abrasive drive device is adapted to be operated in the first direction of movement in which the first surfaces of the abrasive elements are in grinding engagement with the surface of the object and in the second direction of movement in which the second surfaces of the abrasive elements are in grinding engagement with the surface of the object.
GRINDING MACHINE FOR GRINDING A SURFACE OF AN OBJECT
A grinding machine for grinding a surface of an object has at least one grinding tool with a movably mounted abrasive carrier, and a plurality of abrasive elements attached to the abrasive carrier. An abrasive driving device drives the grinding tool in a first relative movement to the object. A conveying device conveys the object with a second relative movement to the grinding tool through the grinding machine. The plurality of abrasive elements each have a plurality of first surfaces provided with first abrasive bodies for lying against the surface of the object in a first direction of movement of the abrasive carrier and a plurality of second surfaces provided with second abrasive bodies for lying against the surface of the object in a second direction of movement of the abrasive carrier opposite to the first direction of movement of the abrasive carrier. The abrasive drive device is adapted to be operated in the first direction of movement in which the first surfaces of the abrasive elements are in grinding engagement with the surface of the object and in the second direction of movement in which the second surfaces of the abrasive elements are in grinding engagement with the surface of the object.
MACHINE FOR PROCESSING SHEET METAL PARTS
A machine for processing sheet metal parts includes a brush unit having at least one horizontally rotating abrasive brush for brushing the surface of the sheet metal parts to be processed. In order to adjust the processing gap or the infeed, the brush unit is movable in the vertical direction. A measuring device for measuring the diameter of the freely turning abrasive brush at different speeds may be designed as an optical measuring unit, in particular a light barrier. A calibration device is used to calculate the correct vertical position of the abrasive brush depending on a selected speed and the associated diameter of the abrasive brush.
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
Embodiments of the present disclosure relate a CMP tool and methods for planarization a substrate. Particularly, embodiments of the present disclosure provide a substrate transporter for use in a CMP tool. The transporter may be used transport and/or carry substrates among various polishers and cleaners in a CMP tool while preventing the substrates from drying out during transportation. By keeping surfaces of the substrates wet during substrate waiting time or idle time in the CMP tool, embodiments of the present disclosure prevent many types of defects, such as byproducts, agglomerated abrasives, pad debris, slurry residues, from accumulate on the substrate surface during CMP processing, thus improve yields and device performance.