Patent classifications
B24B49/08
Machining machine and method for operating a machining machine
A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.
Machining machine and method for operating a machining machine
A machining machine includes an annular bottom working disk and a top counter bearing element. The bottom working disk and top counter bearing element are driven to rotate relative to each other. A working gap is defined between the bottom working disk and the top counter bearing to machine flat work pieces on at least one side. A means for generating a local deformation of the bottom working disk are also provided.
DOUBLE-SIDE OR ONE-SIDE MACHINING MACHINE
A machining machine comprises a first support disk, a first working disk coupled to the first support disk, and a counter bearing element positioned to define a working gap between the first working disk and the counter bearing element. The first working disk and the counter bearing element are configured to rotate relative to each other to machine at least one side of a flat workpiece. A pressure volume is positioned between the first support disk and the first working disk and is configured to hold a pressure fluid, which generates a pressure configured to deform the first working disk. One or more temperature-controlling channels are positioned within the first working disk and configured to hold a temperature-controlling fluid that is configured to control a temperature of the first working disk, wherein the one or more temperature-controlling channels are fluidly separate from the pressure volume.
ENDPOINT DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECTROMETRY
A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.
ENDPOINT DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECTROMETRY
A method of detecting a polishing endpoint includes storing a plurality of library spectra, measuring a sequence of spectra from the substrate in-situ during polishing, and for each measured spectrum of the sequence of spectra, finding a best matching library spectrum from the plurality of library spectra to generate a sequence of best matching library spectra. Each library spectrum has a stored associated value representing a degree of progress through a polishing process, and the stored associated value for the best matching library spectrum is determined for each best matching library spectrum to generate a sequence of values representing a progression of polishing of the substrate. The sequence of values is compared to a target value, and a polishing endpoint is triggered when the sequence of values reaches the target value.
SPINDLE UNIT AND PROCESSING APPARATUS
A spindle unit includes a spindle having a processing tool fitted to a distal end of the spindle; and a spindle housing having a thrust bearing and a radial bearing configured to support the spindle by air in a rotatable and noncontact manner, the thrust bearing including an air supply portion configured to supply air to a gap between an outer surface of the spindle, the outer surface being in a direction orthogonal to an axial direction of the spindle, and an inner surface of the spindle housing, and an adjusting unit capable of adjusting a distance of the gap in a direction perpendicular to the outer surface of the spindle.
SPINDLE UNIT AND PROCESSING APPARATUS
A spindle unit includes a spindle having a processing tool fitted to a distal end of the spindle; and a spindle housing having a thrust bearing and a radial bearing configured to support the spindle by air in a rotatable and noncontact manner, the thrust bearing including an air supply portion configured to supply air to a gap between an outer surface of the spindle, the outer surface being in a direction orthogonal to an axial direction of the spindle, and an inner surface of the spindle housing, and an adjusting unit capable of adjusting a distance of the gap in a direction perpendicular to the outer surface of the spindle.
DETECTION METHOD AND DETECTION APPARATUS FOR POLISHING PAD OF CHEMICAL MECHANICAL POLISHING DEVICE
Disclosed are a detection method and a detection apparatus for a polishing pad of a chemical mechanical polishing device, particularly a detection method and a detection apparatus for detecting a surface of a polishing pad dynamically. An isolation region isolated by a gas to expose the polishing pad is formed by the detecting device, and a detection is performed on the isolation region, such that the chemical mechanical polishing device is capable of detecting the polishing pad without interrupting a manufacturing process and the detection results with more accurate can be achieved. Thereby, the polishing pad can be repaired and replaced more timely.
DETECTION METHOD AND DETECTION APPARATUS FOR POLISHING PAD OF CHEMICAL MECHANICAL POLISHING DEVICE
Disclosed are a detection method and a detection apparatus for a polishing pad of a chemical mechanical polishing device, particularly a detection method and a detection apparatus for detecting a surface of a polishing pad dynamically. An isolation region isolated by a gas to expose the polishing pad is formed by the detecting device, and a detection is performed on the isolation region, such that the chemical mechanical polishing device is capable of detecting the polishing pad without interrupting a manufacturing process and the detection results with more accurate can be achieved. Thereby, the polishing pad can be repaired and replaced more timely.
Device for machining surfaces
The invention relates to a device (100) for machining a surface of a workpiece (200a). According to one embodiment, the device (100) comprises a frame (160) and a roller carrier (401), on which a first roller (101) is rotatably supported and which is supported on the frame (160) in such a way that the roller carrier can be moved in a first direction (x). The device (100) comprises at least a second roller (103), which is supported on the frame (160), and a belt (102), which is guided at least around the two rollers (101, 103) and because of the tension of which a resulting belt force (102) acts on the roller carrier (401). The device (100) also comprises an actuator (302), which is mechanically coupled to the frame (160) and the roller carrier (401) in such a way that an adjustable actuator force (FA) acts between the frame (160) and the first roller (101) in the first direction (x). The belt (102) is guided by means of the second roller (103), or by means of the second roller (103) and further rollers (101a, 101b, 121a, 121b, 105), in such a way that the resulting belt force (FB, FB′) acting on the roller carrier (401) acts approximately in a second direction (y) orthogonal to the first direction (x) in the case of a target deflection of the actuator (302).