A cutting apparatus is provided with a cutting unit. The cutting unit includes a spindle on which a cutting blade is mounted for rotation, a spindle housing that rotatably supports the spindle, a blade cover that is attached to the spindle housing and covers the cutting blade, a cutting water supply nozzle that supplies cutting water to the cutting blade, and a blade monitor that has an end face configured to monitor a cutting edge of the cutting blade. The end face of the blade monitor has a recessed portion to which rinsing water is supplied to rinse the end face.

A cutting apparatus is provided with a cutting unit. The cutting unit includes a spindle on which a cutting blade is mounted for rotation, a spindle housing that rotatably supports the spindle, a blade cover that is attached to the spindle housing and covers the cutting blade, a cutting water supply nozzle that supplies cutting water to the cutting blade, and a blade monitor that has an end face configured to monitor a cutting edge of the cutting blade. The end face of the blade monitor has a recessed portion to which rinsing water is supplied to rinse the end face.

A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

A space-saving centerless grinding machine having high operability is obtained by devising the configuration of component units around the basic configuration of the machine. A dressing means for performing a dressing process for a grinding wheel and a regulating wheel comprises a single dressing unit. The dressing unit is located at a lower position between the grinding wheel and the regulating wheel, and thus eliminates the need for right and left dresser spaces for grinding wheels that have most seriously affected the breadthwise dimension of a conventional centerless grinding machine, leading to space saving and a considerable reduction in the breadthwise dimension of the centerless grinding machine.

A space-saving centerless grinding machine having high operability is obtained by devising the configuration of component units around the basic configuration of the machine. A dressing means for performing a dressing process for a grinding wheel and a regulating wheel comprises a single dressing unit. The dressing unit is located at a lower position between the grinding wheel and the regulating wheel, and thus eliminates the need for right and left dresser spaces for grinding wheels that have most seriously affected the breadthwise dimension of a conventional centerless grinding machine, leading to space saving and a considerable reduction in the breadthwise dimension of the centerless grinding machine.

A chemical mechanical polishing (CMP) apparatus is provided, including a polishing pad and a polishing head. The polishing pad has a polishing surface. The polishing head is configured to hold a wafer in contact with the polishing surface during the polishing process. The polishing head includes a retaining ring, at least one fluid channel, and a vacuum pump. The retaining ring is arranged along the periphery of the polishing head and configured to retain the wafer. The at least one fluid channel is provided inside the polishing head, wherein the retaining ring includes a bottom surface facing the polishing surface and a plurality of holes in fluid communication with the bottom surface and the at least one fluid channel. The vacuum pump is fluidly coupled to the at least one fluid channel.

A self-cleaning device of the present disclosure includes: a cleaning member configured to clean a cleaning tool that cleans a substrate; and an injection unit configured to inject a liquid toward the cleaning member or the cleaning tool. The cleaning member has a cleaning surface that cleans the cleaning tool when the cleaning tool is pressed thereagainst, and the cleaning surface is inclined with respect to a horizontal plane.

An apparatus, system, and a method for sharpening a cutting tool. The system sharpens cutting tools by manipulating the tool, measuring the three dimensional profile of the tool, and then grinding the tool. The apparatus consists of a robot capable of six degrees of motion, a gripping mechanism, a force-torque sensor capable of at least two directions of force and/or torque, a three dimensional scanning subsystem, a loading subsystem, a user interface, an initial orientation scan subsystem, a data processing and robot control subsystem, and at least one grinding system comprising two counter-rotating grinding wheels. The method automates the grinding process so that dull cutting tools can be placed into the loading system, sharpened by the system, and then ejected fully honed.

An apparatus, system, and a method for sharpening a cutting tool. The system sharpens cutting tools by manipulating the tool, measuring the three dimensional profile of the tool, and then grinding the tool. The apparatus consists of a robot capable of six degrees of motion, a gripping mechanism, a force-torque sensor capable of at least two directions of force and/or torque, a three dimensional scanning subsystem, a loading subsystem, a user interface, an initial orientation scan subsystem, a data processing and robot control subsystem, and at least one grinding system comprising two counter-rotating grinding wheels. The method automates the grinding process so that dull cutting tools can be placed into the loading system, sharpened by the system, and then ejected fully honed.

Disclosed herein is an attachment removing device for a diamond tool used in a machining process such as cutting, grinding, polishing, drilling, or the like, for removing an attachment attached to the diamond tool. The attachment removing device for a diamond tool for removing an attachment attached to the diamond tool includes a cylindrical member; and a plurality of bristles each having one end connected to the cylindrical member.