The present disclosure relates to a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a machine comprises a machine frame, a grinding head 2, supported by and being rotatable relative to the machine frame, a grinding head hood 2, which defines a space in which the grinding head 1 is rotatable, a hollow and resilient member 4, arranged in the space, and a pressurized fluid source, operatively connected to the hollow member 4 to supply said pressurized fluid, whereby the hollow member 4 is resiliently expandable upon supply of said fluid.

The present disclosure relates to a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a machine comprises a machine frame, a grinding head 2, supported by and being rotatable relative to the machine frame, a grinding head hood 2, which defines a space in which the grinding head 1 is rotatable, a hollow and resilient member 4, arranged in the space, and a pressurized fluid source, operatively connected to the hollow member 4 to supply said pressurized fluid, whereby the hollow member 4 is resiliently expandable upon supply of said fluid.

A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.

A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.

A polishing device configured to polish a glass substrate is disclosed, including a polishing wheel fixedly arranged, a cooling pipe, and a movable platform. The polishing wheel has an outer peripheral polishing surface, the glass substrate is placed on the platform and is driven by the platform to move so as to make the outer peripheral polishing surface polish the predetermined polishing surface of the glass substrate; the polishing wheel further has a chamber, and the cooling pipe containing a coolant is disposed in the chamber to decrease a temperature of the chamber and then to make temperatures of the outer peripheral polishing surface and the predetermined polishing surface during polishing is lower than a preset temperature. The disclosure solves the problem of high polishing temperature of the polishing wheel and the glass substrate, thereby enhancing the service life of the polishing wheel and the yield of the glass substrate.

A polishing pad material purification system includes a melting device configured to melt a solid material put therein, and a homogenizer configured to homogenize the material melted in the melting device. The homogenizer is configured to have a processable amount of material to be homogenized larger than a processable amount of material to be melted by the melting device and configured to stir the material melted in the melting device so as to homogenize it.

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

A machine tool includes a main shaft unit; a polishing head for processing a workpiece; and an unnecessary byproduct leakage preventing unit for preventing leakage of abrasive resulting from processing at or around a part of the workpiece, the part being processed, and wherein the unnecessary byproduct leakage preventing unit includes a cover provided separately from the polishing head, the cover having a structure that is open in three directions and that has walls in another three directions such that a protection space where to hold a part of the workpiece is defined, the cover for receiving the abrasive, and a movement mechanism for moving the cover so as to stay apart from the workpiece while the workpiece is not being processed and so as to have a part of the workpiece held in the protection space while the workpiece is being processed.

Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.