A grinding wheel assembly has a tool holder, a mounting shaft connected to the tool holder, and a grinding wheel mounted on the mounting shaft. The tool holder has a first coolant passage defined through the tool holder. The mounting shaft has a second coolant passage communicating with the first coolant passage. The grinding wheel has multiple third coolant passages defined through the grinding wheel and communicating with the second coolant passage. The first coolant passage, the second coolant passage, and the multiple third coolant passages are utilized for a coolant to flow through. Thereby, the grinding wheel and a workpiece can be cooled down without setting up any pipeline and nozzle for the coolant in a grinding machine.

A chip suction cover is used for a machine tool including: a spindle configured to rotate a tool; and a suction mechanism unit configured to suck chips of a workpiece that are produced in accordance with rotation of the tool. The chip suction cover includes: a hollow body that is provided with an opening through which a rotation central axis of the spindle extends and that is arranged so as to surround the tool; and a cover body that is provided in the hollow body so as to partially close the opening and that is configured to cover a part of a tip end portion of the tool while exposing a remaining part of the tip end portion of the tool. A chip suction cover having such a configuration that improves the efficiency of sucking chips produced due to workpiece machining is provided.

The present disclosure generally relates to methods and system used to collect waste fluids. A system controller is disclosed to control the operation of at least a portion of the system. The controller has a CPU. The fabrication facility includes a first processing system having fluid dispensed therein for processing a material on a part. A first drain is configured to collect the processing fluid as waste fluid after processing the part. The fabrication facility also includes a waste collection system fluidly coupled to the system drain. The waste collection system has two or more valves configured to couple the system drain and two or more facility drains. Each facility drain is uniquely coupled to one of the two or more valves. The CPU is configured to operate the valves between an open and a closed state in response to the fluid entering the system drain.

It is provided a device with a container for collecting machining suspensions, in particular polishing suspension, used during the machining of workpiece parts in a machine tool for machining workpiece parts, and a machine tool with at least one tool spindle for receiving tools and at least one workpiece spindle for receiving and holding a workpiece part to be machined, wherein this collecting device is provided between the workpiece spindle and the tool spindle.

It is provided a device with a container for collecting machining suspensions, in particular polishing suspension, used during the machining of workpiece parts in a machine tool for machining workpiece parts, and a machine tool with at least one tool spindle for receiving tools and at least one workpiece spindle for receiving and holding a workpiece part to be machined, wherein this collecting device is provided between the workpiece spindle and the tool spindle.

A substrate processing apparatus includes a chuck configured to hold a substrate horizontally; a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate; and a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate. The lower cup is provided with a discharge opening through which the processing residue is discharged.

A substrate processing apparatus includes a chuck configured to hold a substrate horizontally; a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate; and a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate. The lower cup is provided with a discharge opening through which the processing residue is discharged.