A drag and/or dip finishing machine has at least one workpiece holder for the releasable fastening of the workpieces to be machined and a container, disposed beneath the workpiece holder, for accommodating the grinding and/or polishing granules, wherein the workpiece holder and the container are movable relative to each other in that at least the container is rotationally driven. The container has a chamber, which extends around the whole of the periphery thereof and is fluidically connected to the inside, accommodating the grinding and/or polishing granules, of the container, at least on a lower portion thereof, the chamber being equipped with a liquid discharge unit in order to be able to discharge the machining agent from the chamber in the event of an excess of machining agent in the container.

A drag and/or dip finishing machine has at least one workpiece holder for the releasable fastening of the workpieces to be machined and a container, disposed beneath the workpiece holder, for accommodating the grinding and/or polishing granules, wherein the workpiece holder and the container are movable relative to each other in that at least the container is rotationally driven. The container has a chamber, which extends around the whole of the periphery thereof and is fluidically connected to the inside, accommodating the grinding and/or polishing granules, of the container, at least on a lower portion thereof, the chamber being equipped with a liquid discharge unit in order to be able to discharge the machining agent from the chamber in the event of an excess of machining agent in the container.

The invention relates to a filter device for treating a rinsing liquid for material-removing machining, said filter device having a filter element through which the rinsing liquid can be conducted for separating removed material particles. In order to increase the service life, the filter element is provided with a filter fabric, on the filtration upper side of which are formed fabric pores in the form of distinctive longitudinal slots which have a ratio of length to width of 4:1.

The invention relates to a filter device for treating a rinsing liquid for material-removing machining, said filter device having a filter element through which the rinsing liquid can be conducted for separating removed material particles. In order to increase the service life, the filter element is provided with a filter fabric, on the filtration upper side of which are formed fabric pores in the form of distinctive longitudinal slots which have a ratio of length to width of 4:1.

Embodiments of the present disclosure generally provide apparatus for collecting and reuse polishing fluids and methods related thereto. In particular, the apparatus and methods provided herein feature a polishing fluid collection system used to collect and reuse polishing fluids dispensed during the chemical mechanical polishing (CMP) of a substrate in an electronic device manufacturing process. In one embodiment, a polishing fluid catch basin assembly includes a catch basin sized to surround at least a portion of a polishing platen and to be spaced apart therefrom. The catch basin features an outer wall, an inner wall disposed radially inward of the outer wall, and a base portion connecting the inner wall to the outer wall. The outer wall, the inner wall, and the base portion collectively define a trough. A radially inward facing surface of the inner wall is defined by an arc radius which is greater than a radius of the polishing platen the catch basin is sized to surround.

Embodiments of the present disclosure generally provide apparatus for collecting and reuse polishing fluids and methods related thereto. In particular, the apparatus and methods provided herein feature a polishing fluid collection system used to collect and reuse polishing fluids dispensed during the chemical mechanical polishing (CMP) of a substrate in an electronic device manufacturing process. In one embodiment, a polishing fluid catch basin assembly includes a catch basin sized to surround at least a portion of a polishing platen and to be spaced apart therefrom. The catch basin features an outer wall, an inner wall disposed radially inward of the outer wall, and a base portion connecting the inner wall to the outer wall. The outer wall, the inner wall, and the base portion collectively define a trough. A radially inward facing surface of the inner wall is defined by an arc radius which is greater than a radius of the polishing platen the catch basin is sized to surround.

A grinding apparatus includes a holding unit including a holding table having a holder for holding a workpiece and a grinding water suction part for drawing in grinding water outside of the holder, a rotational shaft having an end fixed centrally to a bottom surface of the holding table, a tubular rotary joint surrounding the rotational shaft, and a motor rotating the rotational shaft about its own axis. The rotational shaft has a first suction channel held in fluid communication with the holder of the holding table and a second suction channel held in fluid communication with the grinding water suction part. The rotary joint has a communication channel by which the first suction channel and the second suction channel are held in fluid communication with at least a suction source.

A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon. The method comprises (1) recovering polishing material slurry including the used diamond abrasive; (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation to the recovered polishing material slurry to aggregate the diamond abrasive and separating a supernatant liquid from a diamond abrasive included dispersion medium; and (3) extracting diamond abrasive from the separated diamond abrasive included dispersion medium using a low polarity dispersion medium.

A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon. The method comprises (1) recovering polishing material slurry including the used diamond abrasive; (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation to the recovered polishing material slurry to aggregate the diamond abrasive and separating a supernatant liquid from a diamond abrasive included dispersion medium; and (3) extracting diamond abrasive from the separated diamond abrasive included dispersion medium using a low polarity dispersion medium.

A grinding wheel assembly has a tool holder, a mounting shaft connected to the tool holder, and a grinding wheel mounted on the mounting shaft. The tool holder has a first coolant passage defined through the tool holder. The mounting shaft has a second coolant passage communicating with the first coolant passage. The grinding wheel has multiple third coolant passages defined through the grinding wheel and communicating with the second coolant passage. The first coolant passage, the second coolant passage, and the multiple third coolant passages are utilized for a coolant to flow through. Thereby, the grinding wheel and a workpiece can be cooled down without setting up any pipeline and nozzle for the coolant in a grinding machine.