A vacuum hold-down apparatus retains a wafer in a desired position and orientation. A vacuum chuck assembly of the vacuum hold-down apparatus has a vacuum chuck surface with a vacuum communication aperture. A venturi vacuum generator is fixed with respect to the vacuum chuck assembly and communicates with the vacuum chuck surface via the vacuum communication aperture. A positive pressure fluid line communicates with the venturi vacuum generator.

The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

A device for clamping a workpiece (P) to a workbench (T) includes a body (1) containing a vacuum-generating element. The body (1) has a lower cavity (2) open at the bottom and positioned in the vicinity of a face for securing to the workbench (T). The lower cavity (2) forms a vacuum reserve, this vacuum reserve being connected by a substantially straight duct (6) to an upper face for securing a workpiece (P).

A system for supporting a workpiece is disclosed, wherein several heads with a suction cup define an engaging and supporting surface that is at least partially shaped like the workpiece. Each each head with suction cup is coupled by a bail joint with a first movable element of a vertical linear actuator and is couplable by a removable fitting with a fork carried by a second movable element that rotates around a rotation axis that is coaxial with the axis of the linear actuator. The second movable element carries an abutment, spaced from the center of the ball joint against which the suction cup head abuts and moved by the linear actuator to perform the adjustment of the orientation thereof around the ball joint.

The invention relates to a vacuum chuck for clamping workpieces (19), in particular wafers, and a measuring device and a method for checking workpieces, in particular wafers, by means of X-ray fluorescent radiation.

An apparatus and method for uniformly holding a substrate without flexure or bending of the substrate, thereby enabling accurate shape measurements of the substrate such as wafer curvature, z-height values and other surface characteristics. Techniques include using a liquid as a supporting surface for a substrate thereby providing uniform support. Liquid used has a same specific gravity of a substrate being supported so that the substrate can float on the liquid without sinking. Uniform support of the substrate enables precision metrology.

An object stage and a hot pressing apparatus are disclosed. The object stage includes a base (1) and a support device (2) fixed on the base (1), wherein the support device (2) includes a plurality of detachable support sub-devices (21): the support device is configured to allow a printed circuit board (3) with at least one protruding structure (4) to be placed thereon, and no support sub-device (21) is disposed at a position on the support device (2) corresponding to the protruding structure (1). The object stage reduces manufacture cost, saves production time and improves production efficiency.

Disclosed are a negative pressure driven sucking apparatus and a preparation method thereof. The sucking apparatus comprises a sucking disc body, wherein a negative pressure cavity is formed in the middle of the sucking disc body, and the negative pressure cavity is connected with a vacuum line, and the bottom of the negative pressure cavity having a flexible section, and an annular wedge-shaped microstructure is formed at the bottom of the body surrounding the flexible section. Stable loading and release processes of the annular wedge-shaped microstructure are realized.

A vacuum suction nozzle is provided, including a first housing, a second housing, an accommodating space, a gap, and a clamping assembly. The first housing includes a first lateral wall, a first lower surface, a channel, and a through hole. The through hole is formed on the first lateral wall. The second housing is fixedly connected to the first housing, and includes a second lateral wall and a second lower surface. The accommodating space is formed between the first lateral wall and the second lateral wall, and the through hole is opened onto the channel and the accommodating space. The gap is formed between the first lower surface and the second lower surface, and is opened onto the accommodating space. The clamping assembly is disposed in the accommodating space.

A holding apparatus, in particular a chuck, for a substrate comprises a main body with a upper side, a carrier element arranged in a recess of the main body so as to be vertically movable such that it can be adjusted between a protruding loading position and a retracted clamping position, the carrier element comprising a support surface for placement of the substrate. The support surface has a smaller diameter than the main body. A lifting element lifts the carrier element to the loading position. The carrier element seals the recess such that a sealed cavity is provided between the main body and the carrier element, which cavity can have a negative pressure applied thereto which counteracts the effect of the lifting element.