Patent classifications
B25J15/0014
HAND UNIT AND TRANSFER METHOD
A hand unit of a robot arm includes a U-shaped placement portion on which a semiconductor wafer is placed. The hand unit includes, on one end side of the placement portion, a first support portion configured to support the semiconductor wafer at a first support height and a second support portion configured to support the semiconductor wafer at a second support height, and includes, on the other end side of the placement portion, a third support portion configured to support the semiconductor wafer at the first support height and a fourth support portion configured to support the semiconductor wafer at the second support height. The hand unit further includes a first driving unit configured to move the third support portion and/or the fourth support portion forward and backward with respect to the first support portion and the second support portion.
Handling Method and Apparatus for Stacked Box
A handling method and apparatus for a stacked box can pull vertically upward and take out a stacked box having an open top surface. The handling method and apparatus gripes and moves the stacked box having an open top surface with the handling apparatus attached to a robot arm. The handling apparatus is moved to above a stacked uppermost box, a wedge member having a flat plate shape is inserted along outer surfaces of two opposite edges of an upper box, a claw provided to the wedge member is projected in a direction approaching the box and engaged with a lower surface of an outer flange of the box, and the box is lifted vertically upward and then a fall prevention hanger is driven on a lower side of the box to cause the box to be gripped by the handling apparatus and then moved by the robot arm.
Techniques to support multiple interconnect protocols for a common set of interconnect connectors
Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.
Bin packing system and method
A single robot of a two-lane bin packing system has an end of arm tool (EOAT) that interfaces with two infeed lines and two bins on an ongoing basis so that the robot can pick a group of bags from a first bag group staging area on the first infeed line while a group of bags is being formed in a second bag group staging area by the second infeed line. In addition, by interfacing with two separate bins, one bin can be filled while another, full bin is being replaced with an empty bin. The EOAT thus operates constantly. The bag groups can be formed in layers by discharging bags on a reciprocating shuttle of a pick table assembly.
ELECTROSTATIC CAPACITANCE SENSOR
Provided is an electrostatic capacitance sensor which can remove an influence of a noise occurring from a static eliminator or a driving source and accurately perform measurement even on electrostatic capacitance detected by a thin-type detection unit which can be passed to a finger surface of a wafer transfer robot. The present invention is provided with an AC supply source which supplies an AC voltage to a detection unit, a parasitic capacitance compensation circuit, an operational amplifier, a differential amplifier, a phase detection means, and a low pass filter. An operational amplification output terminal is connected to an inversion input terminal of the differential amplifier through a first band pass filter, the AC supply source is connected to a non-inversion input terminal of the differential amplifier through a second band pass filter, an output terminal of the differential amplifier is connected to an input terminal of the phase detection means, and the phase detection means takes, as a reference signal, an AC signal output from the AC supply source.
HOT STAMP CELL
A hot stamp cell has a source of blanks, an oven to elevate the temperature of the blank, and a press to form the blank to the required shape. The oven has a pair of access doors located on opposite sides. A first robot is provided to move a blank from the source to the oven through one of the doors and a further robot provided to remove the blank from the oven through the other door. Each of the robots has a material handling tool that includes a fork with tines to carry a blank and a gripping mechanism to secure the blank to the tines. The floor of the oven has a support surface to allow stable support of the blank during heating. The floor is provided with channels extending between the doors dimensioned to receive the tines. The channels permit placement of the blank on to the surface by lowering of the fork and subsequent removal of the fork from the oven.
Maintenance Apparatus
A maintenance apparatus, in particular for lifting and moving components of a system for processing semiconductor devices. The apparatus comprises a beam and an arm with means for lifting a component, the arm being mounted to the beam via a connecting unit and so as to be pivotable in a horizontal plane, wherein the connecting unit is displaceable along the beam, and wherein the arm is displaceable perpendicularly to the beam, and wherein a load accommodation means is provided on the pivotable arm.
TRANSFER DEVICE
A transfer device, in particular as a robot gripper, for picking up at least one product disposed on a base section of a product carrier and the product carrier from a conveying and/or processing device for the product and/or for the product carrier and for delivering the product together with the product carrier to a device, in particular a packaging machine, arranged downstream, is characterized in that the transfer device has a pivoting device for pivoting a cover section connected to the base section about a kink line extending between the cover section and the base section.
Pivot rack
Racks and rack systems to support a plurality of sleds are disclosed herein. A rack comprises an elongated support post and a plurality of support chassis. The elongated support post extends vertically. The plurality of support chassis are coupled to the elongated support post. Each support chassis of the plurality of support chassis is sized to house a corresponding sled of the plurality of sleds.
ROBOT SUBASSEMBLIES, END EFFECTOR ASSEMBLIES, AND METHODS WITH REDUCED CRACKING
A robot subassembly including roll, pitch, and/or vertical orientation adjustability capability of a ceramic or glass end effector. The robot subassembly includes a robot component, a mounting plate coupled to the robot component, wherein the mounting plate includes adjustable orientation relative to the robot component, and a brittle ceramic or glass end effector coupled to the mounting plate. Methods of adjusting orientation between a robot component and the end effector, as well as numerous other aspects are disclosed.