A method of field shaping a laminated glass structure is provided. The method includes providing the laminated glass structure comprising a flexible glass sheet having a thickness of no greater than about 0.3 mm laminated to a non-glass substrate by an adhesive material. The laminated glass structure is field cut using a handheld power tool thereby forming a shaped laminated glass structure. An edge strength of a cut edge of the shaped laminated glass structure at least about 20 MPa.

A wafer is processed by irradiating a region to be divided with a pulse laser beam with a wavelength having absorbability to generate a thermal stress wave and propagate the wave to the inside of the region to be divided. A crushed layer is formed by executing irradiation, with a pulse laser beam with a wavelength having transmissibility with respect to the wafer, matching with a time when the thermal stress wave is generated and reaching a depth position at which a point of origin of dividing is to be generated at a sonic speed according to the material of the wafer. Absorption of the pulse laser beam with the wavelength having the transmissibility in a region in which the band gap is narrowed due to a tensile stress of the thermal stress wave forms a crushed layer that serves as the point of origin of dividing.

Disclosed is a manual ceramics cutter with detachable accessories, comprising: a base (1) for supporting a ceramic piece to be cut; a manually actuatable cutting head (2); guides (3) for moving the cutting head; and at least one detachable accessory (4a, 4b) for laterally supporting the ceramic piece to be cut and which is provided with fastening means (41) for fastening to the base (1) in an operative use position in which the detachable accessory (4a, 4b) is arranged transversely with respect to the base (1) and projects laterally from the base (1). The cutter comprises magnetic means (11, 42) for fastening the detachable accessory (4a, 4b) to the base of the cutter in an inoperative or transport position, wherein the accessory (4a, 4b) is arranged in a longitudinal direction on the base (1) and does not project practically from the base.

Disclosed is a manual ceramics cutter with detachable accessories, comprising: a base (1) for supporting a ceramic piece to be cut; a manually actuatable cutting head (2); guides (3) for moving the cutting head; and at least one detachable accessory (4a, 4b) for laterally supporting the ceramic piece to be cut and which is provided with fastening means (41) for fastening to the base (1) in an operative use position in which the detachable accessory (4a, 4b) is arranged transversely with respect to the base (1) and projects laterally from the base (1). The cutter comprises magnetic means (11, 42) for fastening the detachable accessory (4a, 4b) to the base of the cutter in an inoperative or transport position, wherein the accessory (4a, 4b) is arranged in a longitudinal direction on the base (1) and does not project practically from the base.

A manual ceramic cutter with an adjustable set-square, having a set-square (1) installed at one of the longitudinal extremities of a base (2) for supporting the ceramic items to be cut, and a manually-operated cutting head (3) installed with the possibility of displacement along a number of longitudinal guides (4). This cutter comprises adjustment means (13, 14) of the perpendicularity of the set-square (1) with regard to a cutting line (L1) of the cutter, and fixing means (11, 12) of the set-square (1) to the base (2). It further comprises visual verification means of the perpendicularity of the set-square (1) with regard to the cutting line (L1).

A manual ceramic cutter with an adjustable set-square, having a set-square (1) installed at one of the longitudinal extremities of a base (2) for supporting the ceramic items to be cut, and a manually-operated cutting head (3) installed with the possibility of displacement along a number of longitudinal guides (4). This cutter comprises adjustment means (13, 14) of the perpendicularity of the set-square (1) with regard to a cutting line (L1) of the cutter, and fixing means (11, 12) of the set-square (1) to the base (2). It further comprises visual verification means of the perpendicularity of the set-square (1) with regard to the cutting line (L1).

In a method, substrate elements are provided wherein each substrate element has a first side and a second side meeting at a corner point. The substrate elements are picked and then placed on a support device in alignment. A cutting operation is then performed where each of the substrates elements are cut along a cut line having a common first direction which intersects the first and second sides of each of the substrate elements in order to create a third side on each substrate element. The third side of each of the substrate elements meets the first and the second sides at corresponding corner points.

A portable cutting machine is provided. The portable cutting machine comprises: a cutting portion including a disc-shaped cutting blade that cuts an object to be cut by rotating, and a first rotation axis that serves as a rotation center of the cutting blade; a drive portion including a drive source and a second rotation axis rotating by drive of the drive source; a transmission portion including a first pulley fixed to the first rotation axis, a second pulley fixed to the second rotation axis, and a belt looped around the first pulley and the second pulley, and configured to transmit a rotational force by the drive portion to the cutting portion; and a case including a storage space for storing the transmission portion and at least one communication portion that connect to the storage space and open to outside.

A machining centre is disclosed for cutting an object in the form of a slab including a support plane arranged to support the object, a machining unit provided with a cutting tool that is rotatable to cut the object, and with a fluid jet cutting device that is also drivable to cut the object; the machining unit is movable with respect to the support plane along a first axis, a second axis and a third axis of a triad of orthogonal axes to move the cutting tool and the fluid jet cutting device to/from said support plane, the machining unit is further rotatable about a first rotation axis to rotate the cutting tool and the fluid jet cutting device with respect to the support plane; the machining unit is provided with a handling device arranged to support and to move the fluid jet cutting device with respect to the fluid jet cutting device at least along a direction that is transverse to the first axis of rotation.

A method for cutting off at least one portion, in particular a wafer, from a solid body is contemplated. The method includes: modifying the crystal lattice of the solid body by means of a modifier, wherein a number of modifications are produced to form a nonplanar, in particular convex, detachment region in the interior of the solid body, wherein the modifications are produced in accordance with predetermined parameters, wherein the predetermined parameters describe a relationship between a deformation of the portion and a defined further treatment of the portion, detaching the portion from the solid body.