Patent classifications
B29C33/0022
Gas-based material compression and portioning
An apparatus includes a fixed assembly and a reciprocating assembly. The fixed assembly includes a hopper, a first gas manifold, and a dispensing chamber, and the reciprocating assembly includes a channel assembly defining a channel conduit, a shield plate vertically aligned therewith, and a second gas manifold. The reciprocating assembly may move, in relation to the fixed assembly, to a first position to enable the channel conduit to be filled with bulk compressible material from the hopper, a second position to enable compressible material to be pushed from the channel conduit to the dispensing conduit and to be compressed in the dispensing chamber according to a first gas directed through the channel conduit by the first gas manifold, and a third position to enable the compressed material to be pushed out of the dispensing conduit according to a second gas directed through the dispensing conduit by the second gas manifold.
Movable mold insert adjuster
A mold assembly may include a mold frame having an opening extending in a plane and a movable mold insert adjuster to move a mold insert having a slot forming protrusion within the plane within opening.
Article of footwear having a flexible fluid-filled chamber
An article of footwear may include an upper forming a void within the footwear, a sole structure secured to the upper, and a chamber that encloses a pressurized fluid. The sole structure includes a depression. The chamber is located within the void of the upper and located on the depression of the sole structure. The chamber may include a plurality of fluid-filled subchambers, a manifold, and a connection fluidically-connected at least one of the subchambers to the manifold. The subchambers may enclose the pressurized fluid at different pressures. The subchambers may be separated from one another by a bonded area in the direction extending between the heel and toe of the chamber.
Device for moulding lenses and method of manufacturing lenses
A moulding device, for forming lenses by moulding, includes: a moulding element including indentations formed in a face of the moulding element; a transparent plate held with respect to the moulding element so as to form, with the indentations, a cavity intended to allow the formation of a plurality of lenses; at least one injection passage intended to allow moulding product to be introduced into the cavity, the injection passage being arranged between the transparent plate and the moulding element; a moulding product injector arranged so as to allow moulding product to be introduced into the injection passage. The injector is removable, and the moulding device is configured so as to allow the injector to be removed while at the same time keeping the transparent plate held with respect to the moulding element.
Mould for injecting thermoplastics and method for using said mould
Mould for producing plastic items obtained by the injection of thermoplastic material of the “hot melt” or polyamide type, the mould being made of flexible vulcanised silicone, rubber or other elastomers, the mould being formed by two parts which, when facing each other and attached, generate a series of compartments and channels that allow for the introduction of the melted thermoplastic material and the filling of the cavities with the shape of the item desired, and, in turn, allow for a vacuum to be generated, also removing the inside air from the mould by means of a series of conduits and channels; and a method or methodology for producing said plastic items by means of said mould, allowing for the reproduction of short and medium series of items produced with plastic materials, and in which a control system and a mould incorporating a means to be identified can be added to the method.
MOVABLE MOLD INSERT ADJUSTER
A mold assembly may include a mold frame having an opening extending in a plane and a movable mold insert adjuster to move a mold insert having a slot forming protrusion within the plane within opening.
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
In accordance with at least one example of the disclosure, a system comprises a semiconductor package, comprising a first side surface having a first set of metal contacts extending therefrom; a second side surface having a second set of metal contacts extending therefrom; a top surface; a bottom surface; and an end surface meeting at least one of the first side surface, the second side surface, the top surface, and the bottom surface at a non-rounded edge.
APPARATUS FOR THE MANUFACTURE OF SUPPOSITORIES AND METHOD OF USE
The present invention is directed toward an apparatus and method for consumer manufacture of suppositories for rectal or vaginal delivery allowing for the removal of formed suppositories while mitigating the deformation or damage to the formed suppositories when removed.
Multi-cavity compression molding
An assembly for compression molding includes an insert housing defining a plurality of apertures having stop surfaces. The assembly includes a plurality of inserts disposed within the apertures and in engagement with the stop surfaces. The assembly further includes a plurality of gas springs in biased engagement with the inserts. Individual gas springs of the plurality of gas springs are adapted to independently compress under load to permit independent movement of individual inserts within the apertures relative to the insert housing.
System and method for making microneedles
Systems and methods for creating microneedle arrays capable of delivering a suitable drug dosages to subjects are provided. In one aspect, a method comprises creating at least one forming mold using laser ablation in a cross-over line pattern. The method further comprises casting a first material onto the at least one forming mold to create at least one microneedle mold. The method further comprises casting a second material onto the at least one microneedle mold to create at least one hollow microneedle.