A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.

A cellulose fiber-dispersing resin composite material, containing a cellulose fiber dispersed in a resin, wherein the cellulose fiber-dispersing resin composite material contains aggregates of the cellulose fiber, and at least a part of the aggregates is an aggregate having an area of 2.0×10.sup.4 to 1.0×10.sup.6 μm.sup.2 in a plan view; a formed body using this composite material; and a composite member using this formed body.

An insert molding sheet to be used for insert molding has a positioning rib to be fixed to a mold facing a cavity.

The process disclosed herein is method of recovering aluminum from multilayered packaging. The process comprises subjecting multilayered packaging to a reactor with aqueous formic acid, wherein the solution is sonicated using sonic horns. This process allows the recovery of aluminum in its pure metal form. PP/PE components of the multilayered packaging are recovered utilizing density separation, while ink and PET components require further treatment in a toluene reactor which may include sonication.

A material system may include: an aluminum layer; a glass composite layer adjacent to the first aluminum layer; and a carbon composite layer adjacent to the first glass composite layer, and opposite to the first aluminum layer. A method of manufacturing a material system may include: stacking an aluminum layer, glass composite layer that may include thermoplastic prepreg plies, and carbon composite layer so that the aluminum layer is adjacent to the glass composite layer, and the glass composite layer is adjacent to the carbon composite layer; and consolidating the thermoplastic prepreg plies to soften the aluminum layer. A method of manufacturing a material system may include: stacking an aluminum layer, glass composite layer that comprises thermoplastic resin, and carbon composite layer so that the glass composite layer is between the aluminum and carbon composite layers; and adjusting temperature and pressure to consolidate the stack.

An electrochemical cell includes a housing, and an electrode assembly disposed in the housing. The electrode assembly comprises a positive electrode, a negative electrode and a separator disposed between the positive electrode and the negative electrode. The housing is formed of a first case half and a second case half. Each case half is formed of a metal foil laminate material and includes a wedge-shaped central recess that is surrounded by a flange. The flange of the first case half is joined to the flange of the second case half along a seal line that surrounds the respective central recesses. The central recesses cooperate to define an interior space of the housing that contains the electrode assembly, and the interior space has the shape of a rectangular prism. The seal line extends along a diagonal of a side of the rectangular prism. A method of forming the housing is described.

A method of extrusion additive manufacturing for veneer applications may include, but is not limited to, loading material into an extruder, generating a mixture from the material, and fabricating the veneer product. Fabricating the veneer product may include depositing a first portion of the mixture on a working surface of the extruder, actuating the working surface, and depositing an additional portion of the mixture on the working surface of the extruder proximate to the first position of the mixture deposited on the working surface. Where the first portion of the mixture and the additional portion of the mixture form a first layer of the veneer product, fabricating the veneer product may include actuating a nozzle of the extruder and depositing an additional layer of the mixture on the first layer of the veneer product. The material may include wood product and a binder.

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.

A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.

According to one aspect of the present invention, there is provided a chemical conversion coated metal sheet for non-condensed thermoplastic resin bonding, the chemical conversion coated metal sheet including a metal substrate and a chemical conversion coating film disposed on at least one surface of the metal substrate, in which the chemical conversion coating film is obtained by coating the metal substrate with a coating liquid that contains an ethylene-acrylic acid copolymer, colloidal silica, and a silane coupling agent. The ethylene-acrylic acid copolymer has an acrylic acid content of 10 mass % or more and a melt flow rate of 80 g/10 min or less.