The present invention relates to the use of a fluorinated copolymer in the manufacture of a solid polymer film, to give said film properties of adhesion to a metal surface or to glass. It also relates to a process for improving the adhesion of a fluoropolymer to a metal, polymer or glassy substrate, and also to a composite part comprising a solid polymer film in direct contact with at least one metal or glassy element.

A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

A casing material for a power storage device, including a laminate that includes, in order, at least a base material layer, a barrier layer, and a heat-fusible resin layer. The heat-fusible resin layer includes a single layer or a plurality of layers. The heat-fusible resin layer includes at least one layer having a hardness of at least 70 MPa from a cross-section in the lamination direction of the laminate, measured using a nanoindentation method using an indentation load of 100 μN.

This polyolefin micro-porous film includes a multilayered structure, wherein the multilayered structure contains a first layer composed of polypropylene resin, a second layer composed of polyethylene resin and provided on the first layer, and a third layer composed of polypropylene resin and provided on the second layer. Furthermore, a thickness of the first layer is thinner than a thickness of the second layer, a thickness of the third layer is thinner than the thickness of the second layer, and in the multilayered structure, a thickness is 16 μm or less, a porosity is 40 to 70%, and a surface opening ratio is 10 to 30%.

This polyolefin micro-porous film includes a multilayered structure, wherein the multilayered structure contains a first layer composed of polypropylene resin, a second layer composed of polyethylene resin and provided on the first layer, and a third layer composed of polypropylene resin and provided on the second layer. Furthermore, a thickness of the first layer is thinner than a thickness of the second layer, a thickness of the third layer is thinner than the thickness of the second layer, and in the multilayered structure, a thickness is 16 μm or less, a porosity is 40 to 70%, and a surface opening ratio is 10 to 30%.

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.

A laminate comprising a heat-resistant polymer film, an inorganic substrate, and a polyamine compound layer formed using a polyamine compound, wherein the polyamine compound layer is formed between the heat-resistant polymer film and the inorganic substrate.

A power storage device packaging material has good flexibility, and has electrolytic solution resistance. A power storage device packaging material in which a plurality of films are laminated, the packaging material including a heat-sealable resin layer, a gas barrier film layer laminated and disposed on one surface of the heat-sealable resin layer, and a plurality of adhesive layers, wherein the gas barrier film layer includes a resin base material and a gas barrier film disposed on one surface or both surfaces of the resin base material, and of the plurality of adhesive layers, at least an adhesive layer disposed between the heat-sealable resin layer and the gas barrier film layer has electrolytic solution resistance.

A polyolefin micro-porous film containing a polypropylene resin, in which a meltdown temperature of the polyolefin micro-porous film is 195° C. to 230° C. A weight-average molecular weight of the polypropylene resin is 500,000 to 800,000. Furthermore, a molecular weight distribution of the polypropylene resin is 7.5 to 16.

A multi-layered structural element and a method for producing a multi-layered structural element are disclosed. In an embodiment dielectric green sheets, at least one ply containing an auxiliary material which contains at least one copper oxide and layers containing electrode material are provided and arranged alternately one above another. These materials are debindered and sintered. The copper oxide is reduced to form the copper metal and the at least one ply is degraded during debindering and sintering.