A LED display fabrication tool includes first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, first and second curing stations to cure the workpiece to form first and second color conversion layers over a first and second set of LEDs on the workpiece, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors from the workpiece and then dry the workpiece. Each of the chambers is independently sealable. A controller controls a workpiece transport system to move the workpiece sequentially between the chambers.

A LED display fabrication tool includes a plurality of chambers including an initial chamber, a final chamber, and a plurality of intermediate chambers, and the plurality of chambers are arranged to form a transfer line from the initial chamber to the final chamber with each intermediate chamber coupled by a first sealable port to a prior chamber in the transfer line and by a second sealable port to a subsequent chamber in the transfer line. The plurality of chambers include first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors. First and second curing stations cure the precursors.

An LED display fabrication tool includes a plurality of process chambers and a plurality of transfer chambers. The plurality of process chambers include first and second dispensing chambers to deliver first and second color conversion precursors onto a workpiece for fabrication of a light emitting diode (LED) displays, and first and second washing/drying chambers to remove uncured portions of the first and second color conversion precursors from the workpiece and then dries the workpiece. The plurality of transfer chambers are coupled to two process chambers by two respective sealable ports. First and second curing stations cure the precursors to form the first and second color conversion layers over a first set of LEDs on the workpiece.

A method for plating by means of a through-hole on a semiconductor wafer at least comprising the steps: providing a semiconductor wafer having a top side and a bottom side, wherein the semiconductor wafer has a plurality of solar cell stacks and comprises a substrate on the bottom side, and each solar cell stack has at least two III-V subcells, disposed on the substrate, and at least one through-hole, extending from the top side to the bottom side of the semiconductor wafer, with a continuous side wall, wherein the through-hole has a first edge region on the top side and a second edge region on the bottom side; applying an insulating layer to part of the first edge region, the side wall, and to the second edge region by means of a first printing process; and applying an electrically conductive layer.

Provided is an inkjet recording medium for an organic semiconductor device including a base material, an electrode, and ink receiving layer in this order, wherein the ink receiving layer has an ink penetration prevention area on an electrode side that prevents ink which permeates from a surface far from the electrode toward the electrode from reaching the electrode.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

A sensing decal (400) for use in the production of a sensor, includes a flexible release layer (401), a conductive ink layer (402) and an adhesive layer (403). The conductive ink layer is printed onto a first surface (404) of the flexible release layer and the adhesive layer is printed onto the conductive ink layer. The first surface includes a substantially non-uniform surface (405) and the conductive ink layer includes at least one patterned element (503-509) providing a predetermined set of electrical properties for formation of a sensor.

A laser panel, a laser array device, and a laser display. The laser panel and the laser array device separately comprise multiple groups of independent laser light source modules; each group of laser light source modules comprises plural light sources; the plural light sources are all produced by inkjet printing; the laser display and a voltage-driven laser display separately comprise the laser panel. Producing a laser panel by inkjet printing provides a novel technical solution for cheap and industrial manufacturing of laser panels. It is difficult to generate laser coherent superposition between the light emitted by the laser light source module, and therefore, speckles caused by laser coherence in conventional laser display technologies are greatly eliminated. The present invention achieves a voltage-driven laser display, and facilitates achieving a better display effect while reducing the volume of the display.

An active energy ray curable-type ink jet ink containing: titanium black; and a monomer A which is a non-aromatic heterocyclic compound having an ethylenically unsaturated double bond, a light shielding film, and a method of manufacturing the light shielding film.

Disclosed is a method for printing a silver nanowire harness network structure by using a glue dispenser, including the following: 1) constructing an induced PET substrate: modifying a PET substrate by a surface hydrophobic treatment method to enhance the binding force between nanowires and the PET substrate and enhance the conductivity of a nanowire network structure; 2) constructing a glue dispensing printing system and printing the nanowire harness network structure: fixing the glue dispenser to a worktable, fixing a printed PET substrate to a ufab three-dimensional moving platform for controlling the movement of the PET substrate, adjusting the moving speed of the ufab three-dimensional moving platform and the distance between a needle head and the PET substrate, controlling the glue dispensing air pressure and the glue dispensing amount of silver nanowire glue by the glue dispenser, and obtaining the nanowire harness network structure on the PET substrate.