A microelectromechanical component including, vertically at a distance from one another, a substrate device, a first, a second, and a third functional layer, a vertical stop being formed between the second and third functional layer, the vertical stop having a stop area on a surface of the second functional layer facing the third functional layer, wherein the second functional layer is connected to the first functional layer in a connecting area allocated to the stop area.

Described is a micro-lattice damping material and a method for repeatable energy absorption. The micro-lattice damping material is a cellular material formed of a three-dimensional interconnected network of hollow tubes. This material is operable to provide high damping, specifically acoustic, vibration or shock damping, by utilizing the energy absorption mechanism of hollow tube buckling, which is rendered repeatable by the micro-lattice architecture.

A MEMS switch contains an RF electrode 102, pull-down electrodes 104 and anchor electrodes 108 located on a substrate 101. A plurality of islands 226 are provided in the pull-down electrode and electrically isolated therefrom. On top of the RF electrode is the RF contact 206 to which the MEMS-bridge 212, 214 forms an ohmic contact in the pulled-down state. The pull-down electrodes 104 are covered with a dielectric layer 202 to avoid a short-circuit between the bridge and the pull-down electrode. Contact stoppers 224 are disposed on the dielectric layer 202 at locations corresponding to the islands 226, and the resulting gap between the bridge and the dielectric layer in the pulled-down state reduces dielectric charging. In alternative embodiments, the contact stoppers are provide within the dielectric layer 202 or disposed on the islands themselves and under the dielectric layer. The switch provides good controllability of the contact resistance of MEMS switches over a wide voltage operating range.

A display device includes: a translucent substrate; a light-shielding film provided on the translucent substrate; first transparent insulating films that are provided on the translucent substrate so as to cover the covering the light-blocking film; and a plurality of thin film transistors (TFTs) that are provided on the first transparent insulation films and include a portion of lines made of conductive films. The light-shielding film is arranged so as to overlap at least the TFTs, when viewed in a direction vertical to the translucent substrate.

Systems and Apparatus for micromirror designs with electrode contact. In some examples, a micromirror including a mirror, a mirror via coupled to the mirror, a hinge coupled to the mirror via, the hinge including a springtip associated with a first side of the micromirror, the springtip associated with a first terminal, and an electrode associated with the first side of the micromirror, the electrode having a dielectric coating in contact with the springtip, the electrode associated with a second terminal different than the first terminal.

A method for making an actuator includes forming a substantially planar actuator device of an electrically conductive material, the device incorporating an outer frame, a fixed frame attached to the outer frame, a moveable frame disposed parallel to the fixed frame, a motion control flexure coupling the moveable frame to the outer frame for coplanar, rectilinear movement relative to the outer frame and the fixed frame, and an actuator incorporating a plurality of interdigitated teeth, a fixed portion of which is attached to the fixed frame and a moving portion of which is attached to the moveable frame, moving the moveable frame to a deployed position that is coplanar with, parallel to and spaced at a selected distance apart from the fixed frame and fixing the moveable frame at the deployed position for substantially rectilinear, perpendicular movement relative to the fixed frame.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A circuit for biasing a transducer including a first plate and a second plate includes a front-end buffer and a charge pump. The front-end buffer generates an internal signal at an internal node in response to a voltage signal of the second plate. The transducer receives the incident sound wave at the first plate to generate the voltage signal at the second plate. The charge pump boosts the internal signal into a boost voltage at the first plate according to a first clock signal.

A MEMS micromirror device comprising, a reflective movable mirror, and a surrounding substrate coplanar to the mirror. A physical gap between the mirror and the surrounding substrate filled with fluid and finger structures extend from a perimeter of the movable mirror into the physical gap.

A MEMS acceleration sensor comprising: a frame, a plurality of proofmasses; a plurality of flexures; a plurality of hinges and a plurality of gauges. The frame, proofmasses, flexures, hinges and gauges designed to measure acceleration in a direction perpendicular to the device plane while being generally resistant to motions parallel to the device plane. The measurement of the acceleration is accomplished through the piezoresistive effect of the strain in the gauges.