A transfer and coating apparatus transfers a component from a conveyor to a coating station for application of a coating. The transfer apparatus includes a mast that can move about orthogonal axes in a horizontal plane and a mast having a carriage that can move vertically. The carriage includes a hook that swings about a horizontal axis relative to the mast for movement of the component in the horizontal direction. A sway bar extends between the hook and component to inhibit movement about a horizontal axis. The component is delivered to an upper compartment of a coating apparatus where it can be lowered in to a lower compartment containing coating material. Excess coating material is removed by an array of nozzles in the upper compartment as the component is raised from the coating material.

A semiconductor processing station including a central transfer chamber, a load lock chamber disposed adjacent to the central transfer chamber, and a cooling stage disposed adjacent to the load lock chamber and the central transfer chamber is provided. The load lock chamber is adapted to contain a wafer carrier including a plurality of wafers. The central transfer chamber communicates between the cooling stage and the load lock chamber to transfer a wafer of the plurality of wafers between the cooling stage and the load lock chamber.

A semiconductor processing station including a central transfer chamber, a load lock chamber disposed adjacent to the central transfer chamber, and a cooling stage disposed adjacent to the load lock chamber and the central transfer chamber is provided. The load lock chamber is adapted to contain a wafer carrier including a plurality of wafers. The central transfer chamber communicates between the cooling stage and the load lock chamber to transfer a wafer of the plurality of wafers between the cooling stage and the load lock chamber.

A method and a device for coating a metal strip with a coating material that is still liquid at first. During the coating, the coated metal strip runs through a roller pair. One of the rollers of the roller pair can be adjusted toward the other as a correction roller in order to eliminate a possible curvature of the metal strip. Then the metal strip runs through a blow-off apparatus for blowing off surplus coating. In order to prevent an uneven thickness distribution of the coating on the metal strip even when the correction roller of the roller pair has been adjusted, the actual position of the metal strip is controlled to a specified setpoint center position in the slot of the blow-off apparatus by an appropriate movement of the blow-off apparatus.

A method and a device for coating a metal strip with a coating material that is still liquid at first. During the coating, the coated metal strip runs through a roller pair. One of the rollers of the roller pair can be adjusted toward the other as a correction roller in order to eliminate a possible curvature of the metal strip. Then the metal strip runs through a blow-off apparatus for blowing off surplus coating. In order to prevent an uneven thickness distribution of the coating on the metal strip even when the correction roller of the roller pair has been adjusted, the actual position of the metal strip is controlled to a specified setpoint center position in the slot of the blow-off apparatus by an appropriate movement of the blow-off apparatus.

A continuous ceramic matrix composite strip is produced by passing a dry ceramic fiber strip through a ceramic slurry bath. Impregnation wheels within the bath guide the fiber strip through the bath and force the ceramic slurry into the fiber strip, thereby impregnating the strip. The impregnation wheels stir the ceramic slurry to maintain a homogeneous mixture. Air knives remove excess slurry from the strip. Thickness and width controls squeeze the impregnated strip to desired thickness and width dimensions.

A coating apparatus includes: a supply frame for supplying slurry into channels from one end of a honeycomb substrate; and a blower for evacuating a wind box. An annular resistive member is attached to the circumference of the opening of the wind box, and the honeycomb substrate is arranged, with a spacer placed on the resistive member. When the blower is operated and the slurry is supplied, the coat width of the slurry coated on the inner surfaces of the channels in an outer circumferential area is less than the coat width of the slurry coated on the inner surfaces of the channels in a center area.

A coating apparatus includes: a supply frame for supplying slurry into channels from one end of a honeycomb substrate; and a blower for evacuating a wind box. An annular resistive member is attached to the circumference of the opening of the wind box, and the honeycomb substrate is arranged, with a spacer placed on the resistive member. When the blower is operated and the slurry is supplied, the coat width of the slurry coated on the inner surfaces of the channels in an outer circumferential area is less than the coat width of the slurry coated on the inner surfaces of the channels in a center area.

A transfer and coating apparatus transfers a component from a conveyor to a coating station for application of a coating. The transfer apparatus includes a mast that can move about orthogonal axes in a horizontal plane and a mast having a carriage that can move vertically. The carriage includes a hook that swings about a horizontal axis relative to the mast for movement of the component in the horizontal direction. A sway bar extends between the hook and component to inhibit movement about a horizontal axis. The component is delivered to an upper compartment of a coating apparatus where it can be lowered in to a lower compartment containing coating material. Excess coating material is removed by an array of nozzles in the upper compartment as the component is raised from the coating material.

A semiconductor manufacturing device has an outer cup and inner cup with a wafer suction mount disposed within the outer cup. A photoresist material is applied to a first surface of a semiconductor wafer disposed on the wafer suction mount while rotating at a first speed. A gas port is disposed on the inner cup for dispensing a gas oriented toward a bottom side of the semiconductor wafer. The gas port purges a second surface of the semiconductor wafer with a gas to remove contamination. The second surface of the semiconductor wafer is rinsed while purging with the gas. The gas can be a stable or inert gas, such as nitrogen. The contamination is removed from the second surface of the semiconductor wafer through an outlet between the inner cup and outer cup. The semiconductor wafer rotates at a second greater speed after discontinuing purge with the gas.