An automatic spin coating system includes a dispensing assembly and a base assembly. The dispensing assembly comprises a dispensing device that contains a coating material, a pulley assembly, a drive gear, and a smooth wheel. The base assembly includes a coating plate for receiving the coating material, a chuck plate for securing the coating plate, a stepper pin capable of engaging the drive gear of the dispensing assembly, and an electric motor for spinning the chuck plate. The dispensing device further comprises a vessel assembly to provide immobilization of the dispensing device, and a tubing assembly to control the flow of the coating material. The dispensing device is connected to the pulley assembly, which in turn is connected to the drive gear and the smooth wheel. When the chuck plate spins, the stepper pin revolves and touches the drive gear so as to rotate the pulley assembly, and meanwhile, the coating material is dispensed and coated on the coating plate in different circles without overlap between circles. In one embodiment, the stepper pin has a gear with different sizes of teeth that allow different degrees of movements of the dispensing device. The coating material is then dispensed from a first circle to a second circle.

An automatic spin coating system includes a dispensing assembly and a base assembly. The dispensing assembly comprises a dispensing device that contains a coating material, a pulley assembly, a drive gear, and a smooth wheel. The base assembly includes a coating plate for receiving the coating material, a chuck plate for securing the coating plate, a stepper pin capable of engaging the drive gear of the dispensing assembly, and an electric motor for spinning the chuck plate. The dispensing device further comprises a vessel assembly to provide immobilization of the dispensing device, and a tubing assembly to control the flow of the coating material. The dispensing device is connected to the pulley assembly, which in turn is connected to the drive gear and the smooth wheel. When the chuck plate spins, the stepper pin revolves and touches the drive gear so as to rotate the pulley assembly, and meanwhile, the coating material is dispensed and coated on the coating plate in different circles without overlap between circles. In one embodiment, the stepper pin has a gear with different sizes of teeth that allow different degrees of movements of the dispensing device. The coating material is then dispensed from a first circle to a second circle.

The present disclosure proposes an apparatus for coating photoresist and a method for coating photoresist. The apparatus for coating photoresist comprises a gas supply unit (10) configured to supply gas to a photoresist application unit (20); wherein the photoresist application unit (20) comprises: a device cavity (202) enclosed by sidewalls, a bottom plate and a cover plate (206), a rotation platform (204) configured to carry a substrate (205) and bring the substrate to rotate; a guide unit conformal with the substrate, and configured to uniformly blow the gas supplied by the gas supply unit over a surface of the substrate on which the photoresist is coated; and a gas extraction unit (203) configured to extract gas from the device cavity (202). The present disclosure realizes uniformly and rapidly coating the photoresist on a large substrate.

A coating film forming method includes: rotating a substrate at a first rotation speed in a coating cup with an upper surface open, and supplying and diffusing a coating solution for forming a coating film on the substrate; and after the supplying and diffusing the coating solution, drying the substrate by exhausting air through a gap between an annular member arranged above the substrate with centers thereof being located on a same axis and the front surface of the substrate, while rotating the substrate at a second rotation speed lower than the first rotation speed, wherein at the drying the substrate, a flow velocity of the air exhausted through the gap is higher than a flow velocity of air supplied from above the substrate in the coating cup to the substrate.

A coating film forming method includes: rotating a substrate at a first rotation speed in a coating cup with an upper surface open, and supplying and diffusing a coating solution for forming a coating film on the substrate; and after the supplying and diffusing the coating solution, drying the substrate by exhausting air through a gap between an annular member arranged above the substrate with centers thereof being located on a same axis and the front surface of the substrate, while rotating the substrate at a second rotation speed lower than the first rotation speed, wherein at the drying the substrate, a flow velocity of the air exhausted through the gap is higher than a flow velocity of air supplied from above the substrate in the coating cup to the substrate.

A method for fabricating a semiconductor device, including forming a lower structure on a substrate. The lower structure includes a first sacrificial layer and a first insulating layer alternately and repeatedly stacked. A first hole is formed in the lower substrate. The first hole exposes an upper surface of the substrate. A sacrificial pattern is formed in the first hole. A porosity of the sacrificial pattern increases toward the substrate. An upper structure is formed on the lower structure and the sacrificial pattern. The upper structure includes a second sacrificial layer and a second insulating layer alternatively and repeatedly stacked. A second hole is formed in the upper structure. The second hole exposes the sacrificial pattern. The sacrificial pattern is removed.

Apparatus for forming a protective member on a wafer includes a stage for mounting a sheet, the stage having a frame and a chuck table supported to and surrounded by the frame, the frame having a plurality of air supply holes opening to the upper surface of the frame. A holding unit is adapted to be moved to a position opposed to the stage for holding the wafer, and a resin supply unit supplies a liquid resin to the upper surface of the sheet placed on the stage. The liquid resin is formed into the protective member. A sheet pressing pad vertically movably supported so as to be opposed to the sheet is placed on the stage. The sheet pressing pad comes into contact with a part of the sheet placed on the stage in an area inside the air supply holes, thereby pressing the sheet.

Apparatus for forming a protective member on a wafer includes a stage for mounting a sheet, the stage having a frame and a chuck table supported to and surrounded by the frame, the frame having a plurality of air supply holes opening to the upper surface of the frame. A holding unit is adapted to be moved to a position opposed to the stage for holding the wafer, and a resin supply unit supplies a liquid resin to the upper surface of the sheet placed on the stage. The liquid resin is formed into the protective member. A sheet pressing pad vertically movably supported so as to be opposed to the sheet is placed on the stage. The sheet pressing pad comes into contact with a part of the sheet placed on the stage in an area inside the air supply holes, thereby pressing the sheet.

According to an embodiment, the substrate treatment device includes a dilutor configured to dilute a first liquid containing a metal ion and exhibiting acidity. The device further includes a pH changer configured to change a pH of the first liquid before or after being diluted by the dilutor. The device further includes a substrate conditioner configured to treat the substrate using the first liquid, which is diluted by the dilutor and with the pH changed by the pH changer.

A spin coating device includes a base plate, a spin chuck on which a substrate material is placed, and an actuator mechanism to engage the base plate with the spin chuck such that the base plate synchronously spins along with the spin chuck. The substrate material includes a top surface coated with a film-forming substance and a bottom surface. The cleaning mechanism is below the base plate and out of optimal exposure to the bottom surface and edges of the substrate material in a state of base plate engagement. In response to disengagement of a lid configured to synchronously co-rotate with the base plate, the actuator mechanism is further configured to disengage the base plate from the spin chuck and to enable the optimal exposure of the cleaning mechanism to the bottom surface and the edges of the substrate material.