Patent classifications
B05D1/005
Resist dispensing system and method of use
In a method, a resist material is dispensed through a tube of a nozzle of a resist pump system on a wafer. The tube extends from a top to a bottom of the nozzle and has upper, lower, and middle segments. When not dispensing, the resist material is retracted from the lower and the middle segments, and maintained in the upper segment of the tube. When retracting, a first solvent is flown through a tip of the nozzle at the bottom of the nozzle to fill the lower segment of the tube with the first solvent and to produce a gap in the middle segment of the tube between the resist material and the first solvent. The middle segment includes resist material residues on an inner surface wall of the tube and vapor of the first solvent. The vapor of the first solvent prevents the resist material residues from drying.
Organic pigment coating for electronic devices, perovskite solar cells, and methods
Methods of passivating a surface. The methods may include providing a mixture including a liquid and a derivative of quinacridone, applying the mixture to a first surface of a film that includes a metal halide perovskite, and annealing the film for a time and a temperature effective to convert the derivative of quinacridone to quinacridone. Composite materials and electronic devices also are provided.
Nanocomposite films and methods for producing the same
A method of producing a nanocomposite film includes generating a bilayer film including at least a first layer of at least one nanoparticle and a second layer of at least one material and annealing the bilayer film. A uniform nanocomposite film includes a plurality of nanoparticles dispersed in a polymer matrix, wherein the plurality of nanoparticles form at least 60% by volume of the polymer nanocomposite film.
THERMAL BARRIER COATING COMPOSITIONS, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME
Disclosed herein is a process for coating a component, comprising applying a bond coat on a substrate of a component; applying a thermal barrier material to the bond coat; and applying a coating containing polynuclear aluminum oxide/hydroxide clusters, to the thermal barrier material. Disclosed herein too is a gas turbine engine component, comprising a superalloy substrate; a bond coat on the substrate; a thermal barrier material on the bond coat; and a coating containing polynuclear aluminum oxide/hydroxide clusters on the thermal barrier material.
METHOD AND SYSTEM FOR MOLDING OF THERMOPLASTIC OPTICAL POLYMERS
Provided herein are methods of molding thermoplastic polymers into optical elements. The optical elements in the form of cylindrical discs, semi-finished lens blanks or finished lenses are compression molded at high temperature typically above thermoplastic polymers softening temperature and under high pressure. The semi-finished lens blanks and finished lenses are molded using front and back glass molds inside a mold assembly which reshapes the cylindrical discs that are either previously molded or cut out from thick slab. Also provided are methods for producing single vision and progressive addition lens prescriptions.
Metal nanowire ink for the formation of transparent conductive films with fused networks
Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.
Spin dispenser module substrate surface protection system
A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.
Dynamic thermal infrared stealth composite material based on dual phase change and preparation method thereof
A dynamic thermal infrared stealth composite material based on dual phase change is a VO.sub.2/mica-based phase change thermal storage thin layer composite material composed of a VO.sub.2 nanoparticle coating and a mica-based phase change thermal storage thin layer, wherein the mica-based phase change thermal storage thin layer consists of stearic acid and a vanadium-extracted mica substrate in a mass ratio of 3-5:5-7. The composite material based on dual phase change is prepared by extracting vanadium from vanadium mica using a roasting and acid leaching process to prepare VO.sub.2 nanoparticles and a vanadium-extracted mica, embedding a phase change functional body into the vanadium-extracted mica as a support substrate to prepare a mica-based phase change thermal storage thin layer, and coating the VO.sub.2 nanoparticles on the mica-based phase change thermal storage thin layer. The dynamic thermal infrared stealth composite material can synergistically reinforce thermal infrared stealth performance.
METHOD FOR MANUFACTURING WAFER HAVING FUNCTIONAL FILM
A method for manufacturing a wafer having a functional film, with an outer peripheral part of a top face of the wafer annularly exposed, the method including: spin-coating a high-viscosity coating material that contains a functional film constituent over the top face of the wafer to form a coating film; subsequently, supplying a cleaning liquid to the outer peripheral part of the top face of the wafer and kept rotated to remove the coating film on the outer peripheral part of the top face of the wafer; subsequently, heating the coating film on the wafer to form a fluidity suppressed film; subsequently, supplying a cleaning liquid to the outer peripheral part of the top face of the wafer having the fluidity suppressed film and kept rotated to remove the fluidity suppressed film on the top face of the wafer; and subsequently, heating the fluidity suppressed film on the wafer.
Thin film coating packaging for device having meltable and wetting links
A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.