An inline thermal treatment system for thermally treating a continuous product includes a gas supply system configured to supply a first gas flow and a power source configured to supply power. The system includes a plasma torch configured to receive the first gas flow from the gas supply system and power from the power source to form a plasma arc, wherein the plasma arc heats a portion of the continuous product disposed near the plasma arc.

A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an air stream is utilized to carry the particles off the surface of the wafer.

The invention concerns a device (100) for cleaning the optical surface (162) of at least one optical sensor (160) for a motor vehicle. The cleaning device (100) includes a source (110) for emitting a laser beam and means for guiding the laser beam onto at least a part of the optical surface (162) of an optical sensor (160) so as to clean it.

A method of cleaning an ion source. The method includes: at a first reflective surface of a mirror, reflecting light that has a wavelength in a first wavelength band onto a surface of the ion source so that contaminant material is desorbed from the surface of the ion source; at a second reflective surface of the mirror, reflecting light that has a wavelength in a second wavelength band and that comes from the surface of the ion source towards an imaging apparatus for producing an image of the surface of the ion source, wherein the light that has a wavelength in the second wavelength band passes through the first reflective surface of the mirror before being reflected at the second reflective surface of the mirror.

Laser cleaning equipment and a cleaning method for a shaft component are provided. The equipment includes: a supporting base assembly; two driving wheel structures on the supporting base assembly, driving wheels of each of which is configured for being close to or away from each other, and the shaft component to be cleaned is placed between the two driving wheel structures; a friction wheel structure that is tangent to driving wheel structure(s) and uses a friction force thereof to drive driving wheel structure(s) to rotate; a connection shaft assembly that coaxially passes through the friction wheel structure; a power driving mechanism, one end of which that faces toward the connection shaft assembly is in drive connection with the connection shaft assembly and is configured to drive the connection shaft assembly to rotate; and a laser cleaning mechanism configured for performing laser cleaning on the shaft component to be cleaned.

The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a laser unit that irradiates a laser beam to the substrate supported by the support unit, the laser unit includes an irradiation member that irradiates the laser beam, a lens disposed on a travel path of the laser beam irradiated by the irradiation member to be rotatable, and a reflection member having an inclined surface for changing the travel path of the laser beam that passed through the lens.

The structure of a laser cleaning machine contains a laser generation device for cleaning a to-be-cleaned object, a platform for supporting the to-be-cleaned object under a projection path of the laser generation device, an image capture device configured on the laser generation device, and a cleaning and control device inside the image capturing device for setting a traversal path of the laser generation device and for processing information obtained by the image capturing device. The image capturing device contains a first capturing element and a second capturing element to a side of the first capturing element. The cleaning and control device obtains the location distribution and the precise coordinate of each contactor element on the to-be-cleaned object, and then determines an optimized traversal path and instructs the laser generation device to conduct cleaning accordingly so as to achieves high-quality and highly efficient cleaning.

A boroscope includes a working head having first and second ends. A first optical fiber extends through the boroscope to a position between the first and second ends. A second optical fiber extends through the boroscope to the second end of the working head. A laser optical fiber extends through the boroscope. At least one lens is arranged between the first end and the second end of the working head and a mirror is gimballed to the second end of the working head. The laser optical fiber directs laser light transmitted through the laser optical fiber onto the lens and then onto the mirror. A first LED is arranged at a position between the first end and the second end of the working head and a second LED is arranged at the second end of the working head and an actuator devices adjust the position of the mirror.

An apparatus for cleaning a mask includes a chamber in which material deposition is performable on a substrate using the mask, the chamber including a transmission window through which light used in cleaning the mask within the chamber is irradiated into the chamber from outside thereof; within the chamber: a stage on which the substrate is disposed, the stage disposed in a plane defined by first and second directions crossing each other; and a material deposition unit from which a deposition material is provided to the substrate; and a light irradiation unit from which is provided the light used in cleaning the mask within the chamber. The light irradiation unit is disposed outside the chamber and irradiates the light into the chamber through the transmission window. The material deposition unit disposed within the chamber and the light irradiation unit disposed outside the chamber are reciprocally movable in the first direction.

A tire vulcanization mold in which a surface roughness in the groove molding portion of the tread molding surface is made smaller than a surface roughness in the land portion molding portion, in which a surface roughness in the groove molding portion is minimized to 0.12 μm or less in a range including at least a main groove molding portion, and in which a surface roughness in the land portion molding portion is made to be 3.2 μm or more, is used to manufacture a tire, and when cleaning the tread molding surface, the tread molding surface is irradiated with a laser beam to remove contaminant adhered to the tread molding surface.