A method of selective laser brazing is provided. The method includes providing a powder including a plurality of parent core particles and a plurality of braze particles, setting a temperature of an energy source, applying the energy source to the powder, and allowing the heated powder to solidify. The plurality of parent core particles are fused together by the plurality of braze material into a desired component.

The vehicle roof structure includes: a closely facing section that abuts or is adjacent to a side outer panel; a negative curved-surface section that is positioned more inwards in the vehicle width direction than the closely facing section of the roof panel, and has a recessed face that is indented downwards; and a mounting surface that is formed in the side outer panel at an inner side in the vehicle width direction to downwards of the vehicle towards, and at which the closely facing section abuts or is adjacent, in which an edge, on a side of the roof panel, of the brazing material that has solidified to join the roof panel and the side outer panel is positioned on the negative curved-surface section.

Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

A semiconductor device includes a solder supporting material above a substrate. The semiconductor device also includes a solder on the solder supporting material. The semiconductor device further includes selective laser annealed or laser ablated portions of the solder and underlying solder supporting material to form a semiconductor device having 3D features.

Welding-apparatus configured to weld base-material through wire-material melted by welding-laser, includes: laser-applicator configured to apply welding-laser to welding-area; wire-feeder configured to feed wire-material to welding-area; detector provided on wire-feeder and configured to detect feed-amount of wire-material or reaction-force from wire-material; moving-unit configured to move welding-area or wire-material; controller configured to respectively control laser-applicator, wire-feeder, and moving-unit. Controller is configured to perform: controlling wire-feeder to stop feeding wire-material to welding-area; then controlling laser-applicator to stop applying welding-laser to welding-area; then controlling moving-unit so that welding-area and wire-material are separated from each other; determining whether wire-material has been welded to base-material based on feed-amount of wire-material or reaction-force from wire-material detected by detector; and controlling laser-applicator to apply cutting-laser when it is determined that wire-material has been welded to base-material.

The present invention relates to devices with which, for example, narrow surfaces of preferably plate-like workpieces can be provided with a coating material. The device includes a laser for outputting a laser beam to a laser beam emitter, wherein the laser beam is directed onto the coating material or onto the workpiece in such a manner that the laser beam forms a plane of reference with solder on the surface of the coating material or the workpiece.

A laser soldering technique prevents generation of scorching of a substrate or heat-susceptible components in the surroundings, residues, etc. A method includes adjusting a height of the laser soldering device 1 to a position at which laser light has a preset irradiation diameter D1 larger than a diameter of a solder droplet S, irradiating the solder droplet S with the laser light to heat the solder droplet S to a temperature at which a flux solvent component volatilizes and a solder powder does not melt; adjusting the height of the laser soldering device to a position at which the laser light has a preset irradiation diameter D2 smaller than the diameter of the solder droplet S, and irradiating the solder droplet S with the laser light to heat the solder droplet S to a temperature at which the solder powder melts, and performing soldering.

Apparatus (20, 22) and a method for mechanically joining a steel sheet portion (28 or 32) of advanced high strength steel to a metallic sheet portion (30 or 34) is performed to a light-safe extent by a detector assembly (106) during the mechanical joining that may be clinching, clinch riveting, full-punch riveting or self-piercing riveting.

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

The invention relates to a method for producing a mistuning component. The method comprises the following steps: a) producing a container (34) having at least one chamber (36); b) producing a lid (32, 32′); c) inserting at least one impulse element into the chamber (36); d) joining the lid (32, 32′) and the container (36), wherein joining is carried out by soldering/brazing.