A wire guide module for an ultrasonic wire bonder, comprising a body made of a thermally stable metallic and/or ceramic material, wherein an elongated wire feed-through channel having a wire inlet opening and having a wire outlet opening is provided on the body, and comprising a guide tube provided in the wire feed-through channel. In addition, the invention relates to a thermosonic wire bonder having a wire guide module.

An ultrasound horn is provided which vibrates a bonding tool, attached at a tip, in a plurality of directions with a simple structure. There is provided an ultrasound horn having: a longitudinal vibration generator; a horn portion; and a torsional vibration generator. The torsional vibration generator includes a body including a polygonal pillar portion, second layered elements in which a plurality of second piezoelectric elements are layered, and which are attached to side surfaces of the polygonal pillar portion, weights, and a pressure application ring which applies a pressure by pressing the second piezoelectric elements against the polygonal pillar portion via the weights.

System and methods for using analytics and algorithms to predict weld quality are provided and include a computer having a processor and memory configured to receive weld parameter data generated during a welding process by a welder to join at least two parts with a weld, input the received weld parameter data to a data analytics model to generate at least one predicted weld quality parameter, compare the predicted weld quality parameter with a weld quality parameter threshold, and generate output indicating at least one of: the at least one predicted weld quality parameter and a result of the comparison between the at least one predicted weld quality parameter and the weld quality parameter threshold

A wire bonding device for performing a wire bonding process includes: a bonding tool for inserting a wire; an ultrasonic vibrator; a drive mechanism for moving the bonding tool; and a control part. The control part performs: a bonding step of bonding the wire to a bonding point; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps including the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire.

A method of installing a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with an installation tool; (b) engaging the wire bonding tool in an aperture of a transducer of a wire bonding system while the wire bonding tool is held by the installation tool; (c) securing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the installation tool.

Provided is a wire bonding state determination device which determines a bonding state between a pad and a wire after the wire is bonded to the pad. The wire bonding state determination device includes: a waveform detector which makes an incident wave incident to the wire, and detects a transmission waveform of the wire and a reflection waveform from a first bonding surface between the pad and the wire; and a bonding determination unit which determines the bonding state between the pad and the wire based on the transmission waveform and the reflection waveform detected by the waveform detector.

A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.

A workpiece is described, and includes a substrate, a cable, and a cover piece. A portion of the cable is joined to the substrate employing a vibration welding tool, and the cover piece is interposed between the portion of the cable and the vibration welding tool during the joining.

A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.