A system can include a head of a computer numerically controlled machine configured to deliver electromagnetic energy sufficient to cause a change in a material at least partially contained within an interior space of the computer numerically controlled machine. The system can further include an optical system comprising a plurality of optical elements in the computer numerically controlled machine. The plurality of optical elements can be oriented at a fixed angle to each other to deliver the electromagnetic energy from the head to the material.

A laser machining system for machining a workpiece uses a laser beam, preferably for cutting or welding a workpiece using a laser beam. The laser machining system includes a machining head with a housing having an opening for emitting the laser beam from the machining head, a measuring device configured to direct an optical measurement beam through the opening, and an optical unit for aligning the laser beam and the optical measurement beam, the optical unit being settable to adjust the laser beam and the optical measurement beam perpendicular to the optical axis of the machining head in the region of the opening. The measuring device is further configured to determine a setting of the optical unit corresponding to the central alignment of the laser beam on the basis of measurement values based on reflections of the optical measurement beam for different settings of the optical unit.

A laser machining system for machining a workpiece uses a laser beam, preferably for cutting or welding a workpiece using a laser beam. The laser machining system includes a machining head with a housing having an opening for emitting the laser beam from the machining head, a measuring device configured to direct an optical measurement beam through the opening, and an optical unit for aligning the laser beam and the optical measurement beam, the optical unit being settable to adjust the laser beam and the optical measurement beam perpendicular to the optical axis of the machining head in the region of the opening. The measuring device is further configured to determine a setting of the optical unit corresponding to the central alignment of the laser beam on the basis of measurement values based on reflections of the optical measurement beam for different settings of the optical unit.

A method for adjusting a laser beam includes, following passage of the laser beam through a beam-shaping device, measuring, via a detector of a detector device, a beam profile of the laser beam. The method further includes determining a beam quality property of the laser beam based on the measured beam profile and altering an adjustable optical unit for modifying at least one property of the laser beam prior to the entry into the beam-shaping device. For adjusting the laser beam, the adjustable optical unit is altered based on the determined beam quality property.

Embodiments of systems and methods for dicing a bonded structure are provided. A method for dicing a bonded structure includes thinning a top surface and a bottom surface of a bonded structure. The bonded structure may have a first wafer and a second wafer bonded with a bonding interface. The method may also include forming a series of ablation structures in the first wafer and the second wafer. The series of ablation structures may be between a first part and a second part of the bonded structure. The method may also include separating the first part and the second part of the bonded structure along the series of ablation structures.

Embodiments of systems and methods for dicing a bonded structure are provided. A method for dicing a bonded structure includes thinning a top surface and a bottom surface of a bonded structure. The bonded structure may have a first wafer and a second wafer bonded with a bonding interface. The method may also include forming a series of ablation structures in the first wafer and the second wafer. The series of ablation structures may be between a first part and a second part of the bonded structure. The method may also include separating the first part and the second part of the bonded structure along the series of ablation structures.

A method for adjusting a laser beam includes, following passage of the laser beam through a beam-shaping device, measuring, via a detector of a detector device, a beam profile of the laser beam. The method further includes determining a beam quality property of the laser beam based on the measured beam profile and altering an adjustable optical unit for modifying at least one property of the laser beam prior to the entry into the beam-shaping device. For adjusting the laser beam, the adjustable optical unit is altered based on the determined beam quality property.

Laser beam welding a workpiece includes: generating first and second beam areas on the workpiece by first and second laser beams, respectively. The beam areas are guided in a feed direction relative to the workpiece. Centroids of the beam areas are not coinciding. The first beam area runs ahead of the second beam area. A length of the first beam area, measured transversely to the feed direction, is greater than or equal to that of the second. A surface area of the first beam area is greater than that of the second. A width of the first beam area, measured in the feed direction, is greater than or equal to that of the second. A laser power of the first laser beam is greater than that of the second. The second laser beam is irradiated into a weld pool generated by the first laser beam.

Laser beam welding a workpiece includes: generating first and second beam areas on the workpiece by first and second laser beams, respectively. The beam areas are guided in a feed direction relative to the workpiece. Centroids of the beam areas are not coinciding. The first beam area runs ahead of the second beam area. A length of the first beam area, measured transversely to the feed direction, is greater than or equal to that of the second. A surface area of the first beam area is greater than that of the second. A width of the first beam area, measured in the feed direction, is greater than or equal to that of the second. A laser power of the first laser beam is greater than that of the second. The second laser beam is irradiated into a weld pool generated by the first laser beam.

A method of calibrating a laser galvanometer to an XY stage by directing a defocused laser beam through a galvanometer and onto an XY stage and re-centering the laser beam at subsequent positions on the XY stage. Offsets are calculated based on the required movement of the galvanometer to recenter the laser beam at each of the positions on the XY stage. The laser beam may be defocused by focusing the laser beam at a distance Z both above or below the XY stage for each position and then calculating the offset for each position by averaging the values calculated at the focus distances Z above and below the XY stage. The laser beam may also be defocused by passing it through a pinhole.