A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

The present disclosure relates to methods of manufacture, apparatus, and fixtures. An apparatus comprising an inner liner having a hollow chamber extending the length of the inner liner, at least two guide rings disposed collectively along the inner liner, and at least one lumen portion extending through each of the at least two guide rings and being parallel with the hollow chamber, wherein the at least two components are fixed by welding is provided. Further provided is a fixture and a method of manufacture.

A processing system includes: a processing apparatus for processing an object; a rotation apparatus for rotating a holding part holding the object; a movement apparatus for moving at least one of the processing apparatus and the holding part; a measurement apparatus for measuring at least a part of the object held by the holding part; and a control apparatus for controlling the movement apparatus and the rotation apparatus based on a measured result by the measurement apparatus to rotate the holding part and to move at least one of the processing apparatus and the holding part

A machining device for duplex gear of high-precision reducer for robot includes a laser welding device, a laser rotary support, a rotary mechanism and a rotary platform, the rotary mechanism being installed with a reducer body, wherein a center of a central gear is fixedly connected with a rotating shaft; sets of duplex gears are evenly disposed around the central gear; the gear of each set of duplex gear which is connected with the central gear are connected to an output gear ring from outside; a fixed gear ring is disposed above the output gear ring; a rotating frame is disposed at ends, close to the top of the reducer, of rotating shafts of the sets of duplex gears and the rotating shaft of the central gear.

A laser cutting system for cutting articles, such as tubes, and method of using the same. The laser cutting system can cut slots, holes, and/or pores into each article or tube to form filtration tubes, for example. The system includes a delivery system for delivering a laser beam from a laser source, at least one mirror, a focusing objective lens, a gas source, and a delivery nozzle. A first stage holds each article in a longitudinal direction, and may rotate the article axially during delivery of the gas and laser beam towards the article and move the article longitudinally relative to the delivery nozzle. A second stage is provided in the system for moving the delivery nozzle relative to the article being held by the first stage. A controller controls actuation of the laser beam and the gas source, and movement of the first stage and the second stage.

Devices and methods are provided for continuous measurement of an analyte concentration. The device can include a sensor having a plurality of sensor elements, each having at least one characteristic that is different from other sensor(s) of the device. In some embodiments, the plurality of sensor elements are each tuned to measure a different range of analyte concentration, thereby providing the device with the capability of achieving a substantially consistent level of measurement accuracy across a physiologically relevant range. In other embodiments, the device includes a plurality of sensor elements each tuned to measure during different time periods after insertion or implantation, thereby providing the sensor with the capability to continuously and accurately measure analyte concentrations across a wide range of time periods. For example, a sensor system 180 is provided having a first working electrode 150 comprising a first sensor element 102 and a second working electrode 160 comprising a second sensor element 104, and a reference electrode 108 for providing a reference value for measuring the working electrode potential of the sensor elements 102, 104.

A laser processing apparatus includes: a chuck table for holding a single-crystal SiC ingot on a holding surface thereof; a laser beam applying unit for applying a laser beam to the single-crystal SiC ingot held on the holding surface of the chuck table; and a camera unit configured to capture an image of the single-crystal SiC ingot held on the holding surface of the chuck table. The chuck table includes a porous material making up the holding surface and a glass frame made of a non-porous material and having a recess defined therein and receiving the porous material fitted therein, and a negative pressure transfer path for transferring a negative pressure to the porous material fitted in the recess.

A manufacturing method of a protective film agent for laser dicing that includes a solution preparation step of preparing a solution in which at least a water-soluble resin, an organic solvent, and an ultraviolet absorber are mixed; and an ion-exchange treatment step of carrying out ion exchange of sodium ions in the solution by using a cation-exchange resin.

A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object, and a control unit configured to control at least the irradiation unit and the image capturing part. A plurality of lines is set in the object. The control unit performs a first process of irradiating the object with the laser light for each of the plurality of lines by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object.

A method for slicing an ingot column is provided, including the following steps: immersing the column into a solution; rotating the column; focusing the rotating column with a focusing device; and using a laser device to cut the rotating column into sliced wafers. The slicing equipment of the present invention has a simple structure, easy operation, small kerf of the column, and fast slicing speed.