A method of separating a substrate includes directing a laser beam into the substrate such that a focal line is formed with at least a portion of the laser beam focal line within a bulk of the substrate at an oblique angle with respect to a laser-incident surface of the substrate. The laser beam focal line is formed by a pulsed laser beam that is disposed along a beam propagation direction. The method further includes pulsing the pulsed laser beam from a first edge of the substrate to a second edge of the substrate in a single pass. The laser beam focal line generates an induced multi-photon absorption within the substrate that produces a damage track within the bulk of the substrate along the laser beam focal line, and the damage track is at an oblique angle relative to the laser-incident surface of the substrate.

A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.

A system for inspecting a part while said part is produced by additive manufacturing, includes an additive manufacturing apparatus having a build tray, the apparatus being configured to fabricate the part layer-by-layer on the tray; an automated tool holder carrying a tool configured to deposit, add or weld layer-upon-layer of material; the tool holder and tray are configured to move relative to one another along a defined path; and an inspection device attached to the tool holder and configured to scan a layer of material in situ. The tool holder alternately arranges the tool and inspection device in a working position so that the tool holder fixes the tool in the working position for depositing, adding, or welding the layer of material and thereafter the tool holder switches said tool with the inspection device into the working position for scanning and detecting defects in the layer of material.

A method for cutting a transparent brittle material using pulsed laser-radiation is disclosed. A beam of pulsed laser-radiation having an optical-axis is focused in the material by a variable-focus lens or mirror. The focus is translated along the optical-axis while the material is moved with respect to the beam to create an array of defects along a cutting path.

A laser system includes a collimator configured to output a collimated laser beam, a support member to which the collimator is mounted, and a linear rail along which the support member is movable in a first dimension such that the collimator, mounted to the support member, and the collimated laser beam, outputted from the collimator, are movable in the first dimension. The laser system further includes a lens positioned downstream of the collimator and configured to direct the collimated laser beam to a target location on a specimen.

A computerized method is provided for selecting a direction of formation of a slag puddle on a workpiece during processing of the workpiece by a thermal processing torch. The method comprises causing the torch to emit a thermal arc to gouge the workpiece at a first location without piercing through the workpiece. The method also includes translating the torch from the first location to a second location along a first direction on the workpiece while the torch is gouging the workpiece, the first direction substantially along the selected direction of slag puddle formation. The gouging and translating cause formation of a trench in a surface of the workpiece in the first direction. The method further includes causing the thermal arc emitted by the torch to pierce through the workpiece at the second location, which causes the formation of the slag puddle along the selected direction as guided by the trench.

A manufacturing method includes a first repeating step of irradiating a base material with a pulse laser, having a spot diameter S, while relatively moving a laser head and the base material in a first direction, moving the laser head by a predetermined pitch width Pin a second direction that intersects the first direction, and repeating irradiation by the pulse laser along the first direction and movement of the laser head in the second direction, and a second repeating step of irradiating the base material with the pulse laser while relatively moving the laser head and the base material in the second direction, moving the laser head by the pitch width in the first direction, and repeating irradiation by the pulse laser along the second direction and movement of the laser head in the first direction, wherein S<P<100 μm.

A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

A method and apparatus for direct writing of single crystal super alloys and metals. The method including heating a substrate to a predetermined temperature below its melting point; using a laser to form a melt pool on a surface of the substrate, wherein the substrate is positioned on a base plate, and wherein the laser and the base plate are movable relative to each other, the laser being used for direct metal deposition; introducing a superalloy powder to the melt pool; and controlling the temperature of the melt pool to maintain a predetermined thermal gradient on a solid and liquid interface of the melt pool so as to form a single crystal deposit on the substrate. The apparatus configured to generally achieve the aforementioned method.

The present invention provides an additive manufacturing (AM) processing and design approach using removable “heat sink” artifacts to tailor the mechanical properties of traditionally low strength and low ductility alloys. As an example, the design approach was demonstrated with the Fe-50 at. % Co alloy, as a model material of interest for electromagnetic applications. AM-processed components exhibited unprecedented performance, with a 300% increase in strength and an order-of-magnitude improvement in ductility relative to conventional wrought material. The method enables the design and processing of high-performance, next-generation components and alloys.