An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10.sup.−6/K to 3.4×10.sup.−6/K. The interposer further includes a number of holes having diameters ranging from 20 μm to 200 μm. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.

A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.

A method for forming a three-dimensional article through successive fusion of parts of a metal powder bed is provided, comprising the steps of: distributing a first metal powder layer on a work table inside a build chamber, directing at least one high energy beam from at least one high energy beam source over the work table causing the first metal powder layer to fuse in selected locations, distributing a second metal powder layer on the work table, directing at least one high energy beam over the work table causing the second metal powder layer to fuse in selected locations, introducing a first supplementary gas into the build chamber, which first supplementary gas comprising hydrogen, is capable of reacting chemically with or being absorbed by a finished three-dimensional article, and releasing a predefined concentration of the gas which had reacted chemically with or being absorbed by the finished three dimensional article.

A method is disclosed for additive manufacturing a three-dimensional object layer-by-layer including depositing a layer of material on a bed surface or a previously deposited layer of the object to form the object layer-by-layer; providing energy to the material after each layer is deposited with the energy being provided by an energy source that forms an energized beam directed at the material; altering a property of a gas surrounding the material and through which the energized beam extends to alter a property of the object constructed from the material; melting the material with the energized beam to form a melted pool of liquefied material; and allowing the material to solidify to bond the material to a previous layer of material of the object.

The present invention discloses a composite device for high-precision laser additive/subtractive manufacturing, which consists of a sealed shaping chamber, an inert protective gas source and a machine-shaping platform; wherein, the inert protective gas source is connected to the sealed shaping chamber; and the machine-shaping platform is arranged in the sealed shaping chamber, as well as there is a light path selection system is arranged right above the machine-shaping platform; in addition, there is a machining position is equipped on the machine-shaping platform, meanwhile, there are lead screws are arranged under the machine-shaping platform.

Embodiments of the present disclosure provide a thermal process chamber that includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate alters temperature profile. The shape of the beam spot produced by the spot heating module can be modified without making changes to the optics of the spot heating module.

A dry cleaning apparatus includes a chamber, a substrate support supporting a substrate within the chamber, a shower head arranged in an upper portion of the chamber to supply a dry cleaning gas toward the substrate, the shower head including an optical window transmitting a laser light therethrough toward the substrate support, a plasma generator generating plasma from the dry cleaning gas, and a laser irradiator irradiating the laser light on the substrate through the optical window and the plasma to heat the substrate.

A process for producing an aluminum member, including irradiating a surface of an aluminum raw material member including, as a component, aluminum or aluminum alloy and unavoidable impurities with a top-hat laser beam at an intensity of from 110 MW/cm2 to 320 MW/cm2. The aluminum member includes, in sequence, a base layer containing, as a component, aluminum or aluminum alloy and having unavoidable impurities; an oxide layer containing an aluminum oxide; and a porous layer containing a porous aggregate of aluminum metal particles.

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support during processing. Localized heating of the substrate improves temperature profile, which in turn improves deposition uniformity.

A laser processing apparatus according to the present disclosure includes a placement base on which a processing receiving object is placed, an optical system that guides laser light to the processing receiving object, a gas supply port via which a gas is supplied to a laser light irradiated region of the processing receiving object, a gas recovery port via which the supplied gas is recovered, a mover that moves the irradiated region, and a controller that controls, in accordance with the moving direction of the irradiated region, the direction of the flow of the gas flowing from the gas supply port to the gas recovery port, and the controller changes the direction of the gas flow in response to a change in the moving direction of the irradiated region in such a way that the gas flows in the direction opposite the moving direction of the irradiated region.