A substrate processing apparatus configured to process a substrate includes a holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; and a modifying device configured to form, to an inside of the first substrate held by the holder, a peripheral modification layer by radiating laser light for periphery along a boundary between a peripheral portion of the first substrate as a removing target and a central portion thereof, and, also, configured to form an internal modification layer by radiating laser light for internal surface along a plane direction of the first substrate. The modifying device switches the laser light for periphery and the laser light for internal surface by adjusting at least a shape or a number of the laser light for periphery and the laser light for internal surface.

A substrate processing apparatus configured to process a substrate includes a holder configured to hold, in a combined substrate in which a first substrate and a second substrate are bonded to each other, the second substrate; and a modifying device configured to form, to an inside of the first substrate held by the holder, a peripheral modification layer by radiating laser light for periphery along a boundary between a peripheral portion of the first substrate as a removing target and a central portion thereof, and, also, configured to form an internal modification layer by radiating laser light for internal surface along a plane direction of the first substrate. The modifying device switches the laser light for periphery and the laser light for internal surface by adjusting at least a shape or a number of the laser light for periphery and the laser light for internal surface.

A laser processing method includes a laser light emitting step of emitting a pulsed laser light along a line from a back surface of a target having a functional element layer on side of a front surface. The laser light emitting step includes: a first step of irradiating the functional element layer with a first pulsed laser light along the line, to form a weakened region in the functional element layer along the line; and a second step of emitting a second pulsed laser light into the target to follow the first pulsed laser light along the line, to form a crack reaching the front surface along the line in the target. The first pulsed laser light has a pulse width that is shorter than a pulse width of the second pulsed laser light.

Joining methods and corresponding structures are disclosed. In some instances, a method for joining two or more components may include generating a shockwave in a first component to form a jet of a material of the first component directed towards a second component. The jet may penetrate the second component to connect the first component with the second component. Articles of pre-joined and joined components are also described.

Joining methods and corresponding structures are disclosed. In some instances, a method for joining two or more components may include generating a shockwave in a first component to form a jet of a material of the first component directed towards a second component. The jet may penetrate the second component to connect the first component with the second component. Articles of pre-joined and joined components are also described.

A method of manufacturing a decorative sheet includes a step of stacking a light-shielding film and a design film on a surface of a base material film and a step of removing a part of the light-shielding film and a part of the design film by radiating laser light from positions on the base material film and forming transparent portions. The design film the part of which is removed forms a design layer that displays design. The light-shielding film the part of which is removed forms a light-shielding layer that covers the design layer.

A method of manufacturing a decorative sheet includes a step of stacking a light-shielding film and a design film on a surface of a base material film and a step of removing a part of the light-shielding film and a part of the design film by radiating laser light from positions on the base material film and forming transparent portions. The design film the part of which is removed forms a design layer that displays design. The light-shielding film the part of which is removed forms a light-shielding layer that covers the design layer.

In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.

In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.

A device for fabricating a quartz microfluidic chip by a femtosecond pulse cluster. The device includes: a femtosecond pulse cluster laser source configured to output a femtosecond pulse cluster; a beam splitting and interference system, configured to split the femtosecond pulse cluster into a plurality of parts, and to converge split parts to form a femtosecond pulse cluster plasma or a femtosecond pulse cluster plasma grating; a sample system configured to move the electronic displacement platform where a quartz glass is placed to control a position where the parts of the femtosecond pulse cluster are converged on the quartz glass; and a hydrofluoric acid immersion system configured to immerse the quartz glass in a diluent hydrofluoric acid solution to remove an ablated part of the quartz glass to form the quartz microfluidic chip.