Methods disclosed herein include using additive manufacturing to create a joint between a first metallic material and a second metallic material that is different from the first metallic material, wherein the porosity of the joint is less than about 0.1 percent by volume measured according to ASTM B-962. The additive manufacturing can be performed such that no intermetallic brittle phase forms between the first metallic material and the second metallic material.

Shapeable guide wire devices and methods for their manufacture. Guide wire devices include an elongate shaft member having a shapeable distal end section that is formed from a linear pseudoelastic nickel-titanium (Ni—Ti) alloy that has linear pseudoelastic behavior without a phase transformation or onset of stress-induced martensite. Linear pseudoelastic Ni—Ti alloy, which is distinct from non-linear pseudoelastic (i.e., superelastic) Ni—Ti alloy, is highly durable, corrosion resistant, and has high stiffness. The shapeable distal end section is shapeable by a user to facilitate guiding the guide wire through tortuous anatomy. In addition, linear pseudoelastic Ni—Ti alloy is more durable tip material than other shapeable tip materials such as stainless steel.

A welded assembly includes a first object or substrate, an interlayer, and a subsequent layer deposited on the interlayer. The interlayer is an ESD coating deposited on the first object, and the subsequent layer is deposited by ESD on the interlayer. The subsequent layer is made of a different materials from the substrate. Both the interlayer and the subsequent layer are subject to peening. In one case the interlayer has a lower either a lower thermal conductivity or a lower electrical conductivity than the substrate and the subsequent layer. In another example, the subsequent layer has a cermet content of greater than 40% by wt.

A cladded article may include a first metallic layer, a clad layer, and a first solid-state welding interface region positioned between the clad layer and the first metallic layer. The clad layer may include a first clad layer region having a first clad layer thickness in a thickness direction of the clad layer and a second clad layer region having a second clad layer thickness in the thickness direction of the clad layer. The second clad layer thickness may be greater than the first clad layer thickness.

Shapeable guide wire devices and methods for their manufacture. Guide wire devices include an elongate shaft member having a shapeable distal end section that is formed from a linear pseudoelastic nickel-titanium (Ni—Ti) alloy that has linear pseudoelastic behavior without a phase transformation or onset of stress-induced martensite. Linear pseudoelastic Ni—Ti alloy, which is distinct from non-linear pseudoelastic (i.e., superelastic) Ni—Ti alloy, is highly durable, corrosion resistant, and has high stiffness. The shapeable distal end section is shapeable by a user to facilitate guiding the guide wire through tortuous anatomy. In addition, linear pseudoelastic Ni—Ti alloy is more durable tip material than other shapeable tip materials such as stainless steel.

A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, in which a specified Expression (1) is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S(102)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (102) plane is within 10°, S(101)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (101) plane is within 10°, S(111)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (111) plane is within 10°, and S(112)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (112) plane is within 10°.

A method produces at least one defined connecting layer between two components, wherein the first component is produced from a first metallic material and the second component is produced from a second metallic material and the first and/or second component has a coating of a third metallic material, the melting temperature of which is lower than the melting temperature of the first and second materials. In this case, the coating of at least one of the components is heated locally to a connecting temperature, which lies above the melting temperature of the third material and lies below the melting temperature of the first material and below the melting temperature of the second material, and is cooled down in order to form a defined connecting layer when the coating solidifies.

A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.

A bonded body is formed to configured to join a ceramic member formed of a Si-based ceramic and a copper member formed of copper or a copper alloy, in which, in a joint layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on the ceramic member side.

A method is disclosed for electrically bonding a first semiconductor component to a second semiconductor component, both components including arrays of contact areas. In one aspect, prior to bonding, layers of an intermetallic compound are formed on the contact areas of the second component. The roughness of the intermetallic layers is such that the intermetallic layers include cavities suitable for insertion of a solder material in the cavities, under the application of a bonding pressure, when the solder is at a temperature below its melting temperature. The components are aligned and bonded, while the solder material is applied between the two. Bonding takes place at a temperature below the melting temperature of the solder. The bond can be established only by the insertion of the solder into the cavities of the intermetallic layers, and without the formation of a second intermetallic layer.