A heat exchanger includes multiple aluminum heat transfer tubes through which a heat medium flows, and multiple aluminum connection pipes brazed to end portions of the heat transfer tubes. A heat equalizing member formed of a heat conductor is disposed to be in contact with at least two of the connection pipes and be capable of transferring heat therebetween. A method for producing the heat exchanger includes brazing the heat transfer tubes to the connection pipes in a state where the heat equalizing member is in contact with the at least two of the connection pipes.

A braze preform includes a filler metal, a flux in communication with the filler metal, and a luminescent material covering at least a portion of the filler metal. The luminescent material is equal to or less than 0.15% total weight of the braze ring. Further, the luminescent material includes at least one of a luminescent ink, a solvent, and a binder. The solvent may be one of a bromide-based solvent or a non-chlorine-based solvent. The binder may be an acrylic resin.

The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlF.sub.4 and low in K.sub.3AlF.sub.6.

Disclosed are a hollow pipe-sandwiching metal plate and applications thereof. The hollow pipe-sandwiching metal plate comprises a first panel, a second panel, and multiple hollow pipes between the first panel and the second panel; gaps are arranged among the hollow pipes, and the hollow pipes are connected to the first panel and the second panel by brazing. The present disclosure further includes the applications of the hollow pipe-sandwiching metal plate. The hollow pipe-sandwiching metal plate has advantages, such as light weight, high strength, low stress, high temperature resistance, pressure bearing, thermal insulation and vibration isolation. The metal plate will not deform due to thermal difference, thereby providing permanent service life of the metal plate.

A solder preform is provided, at least one surface of the solder preform (C) is provided with a plurality of protruding portions and/or recessing portions provided at a certain interval.

A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

An electronic device includes a substrate having top side contact pads including metal pillars thereon or a laminate substrate having land pads with the pillars thereon. A solder including layer stack is on the pillars, the solder including layer stack having a bottom solder material layer including in physical contact with a top surface of the pillars, a metal material layer, and a capping solder material layer on the metal material layer. The metal material layer is primarily a copper layer or an intermetallic compound (IMC) layer including copper.

Embodiments of the present disclosure relate to an alloy as a brazing alloy for an electric switch braze joint, an electric switch braze joint, an electric switch and a method of producing an electric switch braze joint. The alloy composition of said the alloy consists of at least one element selected from each of group I and group II listed below, and a balance of impurities, Ag, and at least one of Cu, and Zn. Group I encompasses Cd, Mn, Ni, P, Sb, Si, Sn, Ti, and oxides thereof in a total amount of 0.5 to 45.0 wt. %. Group II encompasses Bi, Mo, Te, W, and oxides thereof, oxides of Cu and Zn in a total amount of 0.1 to 15.0 wt. %.

An inspection system is configured to inspect the condition of a braze joint formed within a structure, wherein the braze joint is formed from a braze filler material having a tracer material disposed therein. The inspection system includes an energy source for directing energy towards the structure, an energy detector for detecting information regarding the structure following interaction with the energy directed from the energy source, and a data analysis system for analyzing the information detected by the energy detector. The data analysis system is configured to distinguish the tracer material from the remaining materials forming the structure in order to determine a suitability of the braze joint.

A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.