A capacitor containing a solid electrolytic capacitor element including a sintered porous anode body and a relatively large diameter anode lead wire is provided. The lead wire is electrically connected to the anode body for connection to an anode termination. Further, the lead wire has a diameter that is at least about 10% of the height of the porous anode body to improve the points of contact between the anode body and wire to reduce ESR. A portion of the lead wire extends from a surface of the anode body in a longitudinal direction. At least one notch can be formed in the portion of the lead wire that extends from the anode body. The notch can be formed via a laser or by cutting, punching, or sawing and can serve as the point of electrical connection between the anode termination and the lead wire.

A method for laser welding a pair of metal pins delivers a laser beam to a work-side of the pair of metal pins where a respective pair of surfaces of the metal pins are adjacent to each other and face in the same direction. The laser beam first traces a first path on the work-side to form a melt pool by keyhole welding. The first path crosses an interface between the metal pins. After tracing the first path, the laser beam is switched to trace a second path on the work-side with the laser beam at a delivered rate of energy per unit path length that is less than the one used for the first path. The second path crosses the interface and is within the first path. The method is well-suited for welding of hairpin and I-pin stators.

According to one aspect of the present invention, a silver nanowire mesh (Ag NW-mesh) electrode and a fabricating method thereof. The Ag NW-mesh electrode includes a flexible substrate; and a mesh pattern layer which is disposed on the flexible substrate and in which a plurality of first meal lines and a plurality of second metal lines are composed of Ag NWs and intersect each other in an orthogonal or diagonal direction to form a grid pattern, wherein the first metal lines and the second metal lines of the mesh pattern layer form an angle of 35 degrees to 55 degrees with respect to a bending direction.

A cutting system is disclosed. The cutting system comprises a moving mechanism, a cutter mounted on the moving mechanism, a support table having a material plate disposed thereon, and a fixation device including a pressing plate having a row of teeth defining a row of teeth slots. The row of teeth press the material plate on the support table while the moving mechanism drives the cutter to move along edges of the row of teeth slots. The cutter cuts a plurality of workpieces out of the material plate by a single cutting process.

A semiconductor device includes an integrated circuit die having bond pads and a bond wires. The bond wires are connected to respective ones of the bond pads by a ball bond. An area of contact between the ball bond and the bond pad has a predetermined shape that is non-circular and includes at least one axis of symmetry. A ratio of the ball bond length to the ball bond width may be equal to a ratio of the bond pad length to the bond pad width.

A laser welding machine includes: an elevator that is capable of sliding an elevating platform; a pressing actuator that is fixed to the elevating platform at a base part of the pressing actuator and has a tip slidably connected to the base part and pressing a conductive upper terminal toward a conductive lower terminal; a laser oscillator; a machining optical device that is fixed to the elevating platform and has a lens to focus the laser light emitted from the laser oscillator; a position detector that detects a vertical positioning of the pressing actuator; a counter that receives an output of the position detector and delivers position information; and a control circuit that controls, based on the received signal from the counter, the elevator, the pressing actuator, and the machining optical device, and controls operation of the laser oscillator.

An object of the present invention is to suppress blow holes in welding using tough pitch copper.

A welding method includes a first step of heating at least a portion of a first conductor and a second conductor containing copper, and a second step of adding a filler metal containing phosphorus while melting the first conductor and the second conductor so that a phosphorus content rate in a welded portion at which an end portion of the first conductor and an end portion of the second conductor are connected to each other is equal to or more than 0.1%.

The present disclosure provides a welding electrode and methods of manufacturing the same. The welding electrode can include a composite body having a tip portion and an end portion. The composite body can include a shell defining a cavity through the end portion, the shell comprising a first metal that includes one or more of the following: a precipitation hardened copper alloy, copper alloy, and carbon steel. The composite body can also include a core within the shell, the core extending through the shell from the tip portion to the cavity, the core comprising a second metal that includes dispersion strengthened copper. The core and the shell have a metallurgical bond formed from co-extrusion.

A temperature sensor having a structure in which electrode wires are butted against signal wires with their weld portions and a method for manufacturing the temperature sensor. In a temperature sensor (1), outer circumferential portions (57a) and (57b) of each of weld portions (55) between electrode wires (25) and sheath core wires (3) are located outward of a first straight line D1 and a second straight line D2, respectively. A forward end-side length L1 is set to be longer than a rear end-side length L2. In addition, the sheath core wires (3) are larger in diameter than the electrode wires (25).

A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 μm. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.