A mounting system includes a magnet core arranged for positioning inside a magnet coil. The magnet core includes a cylindrical, elongate receiving region with a central axis, a rapid-mounting mandrel arranged for insertion into the cylindrical, elongate receiving region, and a discoid workpiece driver, detachably fastened to the rapid-mounting mandrel and extending normal to the central axis. A one of the magnet core or the rapid-mounting mandrel includes a rapid-mounting device for mounting the rapid-mounting mandrel in the magnet core. Example embodiments may includes the rapid-mounting device integrated into the magnet core or integrated into the rapid-mounting mandrel.

A machining apparatus for a curved plate includes a holder that holds a main surface of a curved plate having curved surfaces on both main surfaces; a machining device that machines an outer circumference of the curved plate held by the holder; a movable frame that retains the machining device; a driver that moves the movable frame to move a machining point of the curved plate held by the holder; a controller that controls the driver; and a guide that guides the movable frame along the outer circumference of the curved plate held by the holder.

Disclosed herein is a fixture for a workpiece, a system and a method for performing a machining operation using the fixture. The fixture may include a frame, a plurality of holders, an actuator and a bracket. Each holder may be configured to receive and secure a workpiece. Each holder may be rotationally coupled to the frame. The actuator may be operatively coupled to the plurality of holders to drive rotation of the holders with respect to the frame. The bracket may allow for mounting the frame to a manipulator configured to move the fixture. The method may include the steps of loading a workpiece to the holder of the fixture, moving and/or rotating the workpiece by the actuator to perform one or more ancillary operations on the workpiece, and moving/and or rotating the workpiece by the actuator to grind the workpiece against a grinding surface.

A grinding method includes an oblique grinding step of rotating a grinding wheel about the central axis of a second shaft, tilting the second shaft to a first shaft of a rotatable chuck table such that the bottom of a first portion of the grinding wheel that is positioned above an outer circumferential portion of the chuck table is higher than the bottom of a second portion of the grinding wheel that is positioned above a central portion of the chuck table, and then moving the grinding wheel and the chuck table relatively closer to each other along a direction parallel to the first shaft, thereby forming a disk-shaped recess in the reverse side of the workpiece, and a tilt changing and grinding step of grinding the reverse side of the workpiece while gradually changing a tilt of the second shaft to orient parallel to the first shaft.

A center shaft machining apparatus includes: a grinding structure that moves on a machining central axis while rotating about the machining central axis and machines an end surface on one end side of a workpiece arranged on the machining central axis; an end portion support structure that supports an opposite end side of the workpiece; and a shaft portion support structure that supports a shaft support portion set at an intermediate portion of the workpiece. The end portion support structure includes an eccentric mechanism capable of supporting an opposite end of the workpiece in a state where a workpiece central axis of the workpiece is eccentric with respect to the machining central axis.

Various examples are provided for polishing techniques for flexible tubular workpieces. In one example, a method includes supporting a tubular workpiece on a rod that extends axially through it; positioning a turning wheel against an external surface of the tubular workpiece, where it is held by magnetic attraction; and rotating the tubular workpiece by rotating the turning wheel. The external surface of the tubular workpiece is polished by the abrasive particles during rotation of the tubular workpiece. In another example, a polishing system includes a workpiece holder including a rod configured to axially support a tubular workpiece; a turning wheel with abrasive particles distributed about an outer surface; a wheel support assembly configured to position the outer surface of the turning wheel against the an external surface of the tubular workpiece, where it is held by magnetic attraction. The external surface is polished during rotation of the tubular workpiece.

A clamping device (1) for holding a workpiece (10), in particular a cutting tool, during machining in a grinding machine, wherein peripheral grinding of the workpiece (10) is performed by means of a particularly approximately cup-shaped grinding wheel, wherein the clamping device (1) comprises a support unit (40) provided to be mounted on the grinding machine, a clamping unit (20) comprising a clamping anvil (12) supported in a clamping anvil holding element (22) and translationally drivable to apply a clamping force parallel to a clamping axis (16), and a drive unit (30) comprising a drive anvil (14) supported in a drive axis (18) and rotationally drivable for rotary orientating the workpiece (10) by means of the drive axis (18). The clamping unit (20) and the drive unit (30) are provided as individual components, which are releasably or slidably attached to the support unit (40) to form a workpiece spindle headstock of the grinding machine.

A tilt adjusting mechanism provided in a processing apparatus including a chuck table having a holding surface for holding a workpiece thereon and a processing unit having a processing surface for processing the workpiece held on the chuck table, for adjusting parallelism between the holding surface and the processing surface. The tilt adjusting mechanism includes at least three support posts supporting the chuck table, the support posts including at least one expansible and contractible support post that is provided with a piezoelectric actuator including layered piezoelectric elements, a direct current power supply electrically connected to the piezoelectric actuator, and a voltage controller for controlling a direct current voltage value of direct current electric power supplied to the piezoelectric actuator.

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

A substrate processing apparatus includes: a first holding part configured to hold a substrate; a second holding part configured to hold the substrate; a sliding member configured to rotate about a vertical axis so that the sliding member slides on a back surface of the substrate; a revolution mechanism configured to revolve the sliding member under rotation about a vertical revolution axis; and a relative movement mechanism configured to horizontally move a relative position between the substrate and a revolution trajectory of the sliding member so that when the substrate is held by the first holding part, the sliding member slides on a central portion of the back surface of the substrate, and when the substrate is held by the second holding part, the sliding member slides on the peripheral portion of the back surface of the substrate under rotation.