Patent classifications
B24B55/03
Cooling Water Circulation System and Cooling Water Circulation Control Method
Disclosed are a cooling water circulating system and a cooling water circulating control method. The cooling water circulating system comprises a main tank (2) disposed as a water supply, and a first return pipeline (9) allowing water in a glass edge grinding machine (1) to return to the main tank (2); the main tank (2) is communicated with the glass edge grinding machine (1) through a water supply pipeline; the cooling water circulating system further comprises a filtering mechanism which is configured to filter and collect glass powder in circulating water.
Cooling Water Circulation System and Cooling Water Circulation Control Method
Disclosed are a cooling water circulating system and a cooling water circulating control method. The cooling water circulating system comprises a main tank (2) disposed as a water supply, and a first return pipeline (9) allowing water in a glass edge grinding machine (1) to return to the main tank (2); the main tank (2) is communicated with the glass edge grinding machine (1) through a water supply pipeline; the cooling water circulating system further comprises a filtering mechanism which is configured to filter and collect glass powder in circulating water.
SYSTEM FOR ADJUSTING PAD SURFACE TEMPERATURE AND POLISHING APPARATUS
A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).
SYSTEM FOR ADJUSTING PAD SURFACE TEMPERATURE AND POLISHING APPARATUS
A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).
Grinding liquid trough arrangement
A grinding liquid trough arrangement for a grinding machine having a grindstone, wherein said grinding liquid trough arrangement comprises: a trough for grinding liquid formed by a trough wall, wherein the trough is configured to be arranged at a grinding machine having a grindstone such that the trough encloses a portion of a grindstone, wherein, the trough wall comprises at least one metal element which is attractable to magnets, and that, the grinding liquid trough arrangement comprises at least one magnetic element which is configured to be detachable attached to an external side of the trough wall by means of magnetic attraction between the magnetic element and the metal element.
Grinding liquid trough arrangement
A grinding liquid trough arrangement for a grinding machine having a grindstone, wherein said grinding liquid trough arrangement comprises: a trough for grinding liquid formed by a trough wall, wherein the trough is configured to be arranged at a grinding machine having a grindstone such that the trough encloses a portion of a grindstone, wherein, the trough wall comprises at least one metal element which is attractable to magnets, and that, the grinding liquid trough arrangement comprises at least one magnetic element which is configured to be detachable attached to an external side of the trough wall by means of magnetic attraction between the magnetic element and the metal element.
LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND IMPROVING PAD ASPERITY
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.
LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND IMPROVING PAD ASPERITY
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.
Coolant supply device
A coolant supply device includes a coolant tank having first and second coolant reservoirs arranged in parallel with a predetermined space therebetween and a communicating part arranged between the first and second coolant reservoirs to allow them to communicate with each other, and formed to have a U-shaped overall shape. The coolant supply device further includes pumps pumping up coolant from the second coolant reservoir and supplying the coolant to predetermined destinations. The coolant supplied by the pumps is returned to the first coolant reservoir and flows into the second coolant reservoir through the communicating part. The first coolant reservoir has a first agitating nozzle body disposed therein for discharging coolant to assist a flow of coolant flowing toward the communicating part, and the second coolant reservoir has a second agitating nozzle body disposed therein for discharging coolant to assist a flow of coolant flowing therein from the communicating part.
Coolant supply device
A coolant supply device includes a coolant tank having first and second coolant reservoirs arranged in parallel with a predetermined space therebetween and a communicating part arranged between the first and second coolant reservoirs to allow them to communicate with each other, and formed to have a U-shaped overall shape. The coolant supply device further includes pumps pumping up coolant from the second coolant reservoir and supplying the coolant to predetermined destinations. The coolant supplied by the pumps is returned to the first coolant reservoir and flows into the second coolant reservoir through the communicating part. The first coolant reservoir has a first agitating nozzle body disposed therein for discharging coolant to assist a flow of coolant flowing toward the communicating part, and the second coolant reservoir has a second agitating nozzle body disposed therein for discharging coolant to assist a flow of coolant flowing therein from the communicating part.