A heat chamfering apparatus includes a heated body configured to peel an edge of a glass panel by applying thermal shock to the glass panel while being in contact with the edge of the glass panel and a heater heating the heated body. The heated body includes a heated region and a contact region in a longitudinal direction thereof, the heated region being heated by the heater, and the contact region being configured to be in contact with the glass panel. The cross-sectional area of the contact region is smaller than the cross-sectional area of the contact region. A heat chamfering method includes peeling an edge of a glass panel by applying thermal shock to the edge of the glass panel by moving a heated body heated by a heater relatively with respect to the glass panel along and in contact with the edge of the glass panel.

One aspect of the invention provides a jacket-stripping tool including: a reference stop adapted and configured to contact an end of corrugated stainless steel tubing; and one or more cutting blades arranged substantially perpendicular to a central axis of the tool and adapted and configured to create one or more cuts through one or more external jacket layers of the corrugated stainless steel tubing. At least one of the one or more cutting blades is positioned relative to the reference stop such that the at least one of the one or more cutting blades is a multiple of a distance between adjacent corrugation valleys of the corrugated stainless steel tubing.

A method and device for stripping the insulation from and peeling pre-insulated pipe ends by means of a peeling and cutting tool.

Machines are provided for removing masking from regions of glazing panes. Also provided are methods of removing masking from regions of glazing panes. The machines can include a head assembly and a processing station. The head assembly can have various combinations and/or configurations of features, including one or more of a plurality of cutters, a plurality of belts, and at least one pressurized gas nozzle.

A cutting device and a cutting method are provided. The cutting device includes a cutting platform, a cutting blade assembly, a peeling device, and a cutter wheel. The cutting blade assembly, the peeling device, and the cutter wheel are disposed above the cutting platform and are sequentially disposed from right to left. The cutting platform is configured to support a flexible substrate. The cutting blade assembly is configured to cut a flexible material layer. The peeling device is configured to peel off a cutted flexible material layer from the glass substrate. The cutter wheel is configured to form a cutting mark on the glass substrate exposed outside after peeling of the flexible material layer.

A food spiral cutting machine includes a base, a drive unit, a screw, a cutter assembly and a locking device. The drive unit comprises a motor, a gearbox and an open drive nut. The gearbox comprises a planetary gear reduction group and a pair of bevel gears. A first bevel gear connects to the output of the planetary gear set, and the first bevel gear drives a second bevel gear which is provided with a spline inside the gear center hole. The first bevel gear meshes with the second bevel gear at right angle. An open drive nut rests on the underside of the screw. A screw is provided with a slot along the screw axis. The spline of the second bevel gear keys with the slot of the screw.

An apparatus for preparing fruit includes a main housing with a cutting area containing a cutting assembly and a drive assembly, a removable cup assembly for inserting the fruit into the apparatus, and a removable drawer and tray for removing cut pieces of fruit from the apparatus after a cutting operation. The apparatus includes a rinsing assembly for cleaning the fruit and the cutting assembly, and a deflector configured to route cut pieces of fruit into the tray and waste material through a disposal outlet. The cutting assembly is configured to perform one or more cutting operations depending on the type of fruit detected in the cup assembly: wedging for apples, lemons, limes, and pears, and cutting/peeling for oranges and grapefruits. The apparatus quickly prepares various fruits for consumption without requiring an operator to touch the cut pieces of fruit.

A coating removing device includes a main body that includes a blade used for coating removal; a gripping section that grips an optical fiber; and a slider that connects the main body and the gripping section together so as to be able to approach or separate from each other. The coating removing device removes a coating from the optical fiber by separating the main body and the gripping section after an incision has been made in the coating of the optical fiber using the blade. The slider includes a retention unit to retain the main body and the gripping section in a maximum separation state.

In a method of removing a protecting synthetic coating (1) from an elongated element (2) in the form of an optical fibre (3) surrounded by the coating a cut (8) is created into the coating by knife edges (6). The element is displaced with respect to the knife edges in the longitudinal direction of the element for displacing coating material (17) by said knives. At least one drop of liquid (12) with wetting properties is supplied to the cut for being sucked into a space created between the coating and the optical fibre during said displacement for acting as a lubricant for a sliding of the coating to be removed along the fibre.

A method for enhancing the reliability of contacting the conductive layers in a laminated electrochromic device structure is disclosed (FIG. 7). The laminate structure (10), typically fabricated in the form of a sheet, comprises: two polymer substrates (21, 22); two conductive layers (31, 32)one arranged on each substateand facing each other; an electrochromic layer (41) and a counter-electrode layer (42) each arranged on different conductive layers; and an electrolyte layer (50) interposed between the electrochromic layer and the counter-electrode layer. Either an incision with an undulating cutting depth or perforations of predetermined sizes, depths (through at least most of one substrate) and separations are prefabricated along a desired tear line in the structure (step 220)once the final shape of the device is definedto facilitate the tearing away of the one polymer substrate to reveal the conductive layer to be contacted on the underlying substrate.