An apparatus for preparing fruit includes a main housing with a cutting area containing a cutting assembly and a drive assembly, a removable cup assembly for inserting the fruit into the apparatus, and a removable drawer and tray for removing cut pieces of fruit from the apparatus after a cutting operation. The apparatus includes a rinsing assembly for cleaning the fruit and the cutting assembly, and a deflector configured to route cut pieces of fruit into the tray and waste material through a disposal outlet. The cutting assembly is configured to perform one or more cutting operations depending on the type of fruit detected in the cup assembly: wedging for apples, lemons, limes, and pears, and cutting/peeling for oranges and grapefruits. The apparatus quickly prepares various fruits for consumption without requiring an operator to touch the cut pieces of fruit.

A cable stripper is provided which has an adjustable bushing which can be adjusted to accept a variety of differently size cables. The cable stripper is rotated around the cable to strip the insulation from a cable. The cable stripper can be attached to an existing tool to impact rotation of the cable stripper around the cable. The cable stripper includes a bushing having an axial passageway and a plurality of spaced slots which are in communication with the passageway, a plurality of cable retention blocks attached to the bushing, and a blade member mounted on the bushing, the blade member being seated within the passageway. The cable retention blocks are moveable relative to the bushing to pass through the slots and into the passageway to engage the cable mounted within the passageway. A retaining assembly is mounted on the bushing and fixes the position of the cable retention blocks relative to the bushing.

A heat chamfering method for a glass panel includes bringing a heater into contact with an edge of a glass panel by causing the heater to approach a chamfering start point. heat-chamfering the edge by moving the heater from the chamfering start point to a chamfering end point along a chamfering line. and bringing the heater into non-contact with the glass panel by causing the heater to depart from the chamfering end point. The heat-chamfering may include maintaining contact pressure between the heater moving along the chamfering line and the glass panel within a predetermined range of change. In the approaching. an angle defined by a chamfering start point approach line and the chamfering line at the chamfering start point ranges from 155 to 175. In the departure, an angle defined by the chamfering line and a chamfering end point departure line ranges from 155 to 175.

A wafer manufacturing method includes: a crack layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot, with a focal point of the laser beam positioned in a region spaced from an end face of the ingot by a distance corresponding to the thickness of the wafer to be manufactured, to form a crack layer, a cut groove forming step of positioning a cutting blade on an extension line of the crack layer and forming a cut groove continuous with the crack layer in a periphery of the ingot; and a peeling step of applying an ultrasonic wave to the end face of the ingot to peel off the wafer to be manufactured, along the crack layer.

In a method of removing a protecting synthetic coating (1) from an elongated element (2), the elongated element (2) including an optical fiber (3) surrounded by the coating, a cut (8) is created into the coating by knife edges (6). The element (2) is displaced with respect to the knife edges in a longitudinal direction of the element (2) for displacing coating material (17) by the knives. At least one drop of liquid (12) with wetting properties is supplied to the cut for being sucked into a space created between the coating and the optical fiber during the displacement of the coating for acting as a lubricant for a sliding of the coating to be removed along the fiber.

A lottery tool that is a rectangular chip with a plurality of holes which may overlay a grid of numbers on a lottery gaming slip, allowing a user to select numbers for the lottery game. The lottery tool has a randomly generated pattern of 5-10 holes and is used by randomly placing the tool over the gaming slip, by direct placement, by dropping the tool onto the betting slip, or by spinning the tool on a hub. The user then fills in the lottery slip and repeats the process until a requisite amount of numbers are selected. Opposed edges of the tool are serrated to form teeth for use in removing coatings from hidden number lottery tickets.

A rotational cutting device is provided for the removal of material (101) from an insulation sheath (3, 4, 5) of a power cable (1). The device has a knife assembly (301) and a rotation mechanism (308) for rotational movement of the knife assembly (301) relative to the power cable (1). The knife assembly (301) has a knife (300) including a cutting edge for peeling off material (101) of the insulation sheath (3, 4, 5). The cutting edge is provided by a removable cutting blade (303) that can be detached from the knife (300) in order to replace it.

A backing film removal system comprises a separating mechanism configured to separate a first portion of a first backing film on a first side of a material segment and a second portion of a second backing film on a second side of the material segment from a material layer of the material segment, wherein the second side is opposite the first side. The backing film removal system also includes a clamping mechanism that is actuatable to apply a clamping force to secure the material layer and the second portion together. A separator assembly includes a gripping mechanism configured to grip the first portion. At least one of the gripping mechanism or the clamping mechanism is movable to draw the first portion gripped by the gripping mechanism away from the material layer to remove a remaining portion of the first backing film from the material layer.

A heat chamfering apparatus includes a heated body configured to peel an edge of a glass panel by applying thermal shock to the glass panel while being in contact with the edge of the glass panel and a heater heating the heated body. The heated body includes a heated region and a contact region in a longitudinal direction thereof, the heated region being heated by the heater, and the contact region being configured to be in contact with the glass panel. The cross-sectional area of the contact region is smaller than the cross-sectional area of the contact region. A heat chamfering method includes peeling an edge of a glass panel by applying thermal shock to the edge of the glass panel by moving a heated body heated by a heater relatively with respect to the glass panel along and in contact with the edge of the glass panel.

An object is to provide a wire stripper. The wire stripper includes: a wire stripper body having a first member, a second member and a first passage; a blade body attached to the second member and configured to separate the sheathed wire into a sheath layer and a core wire; a press plate part arranged to the first member so as to face the blade body and having a press surface configured to press the sheathed wire against the blade body; and a distance adjusting member configured to adjust the distance between the first member and the second member. The first member has a first guide part defining a part of the first passage and configured to guide relative motion of the wire stripper body relative to the sheathed wire. The press plate part protrudes on the first passage side from the first guide part.