An ultrasonic cutter includes a tool holder and an ultrasonic oscillator. The tool holder has a lower circular air-out aisle defined by sleeving an inner ring and an outer ring. The inner ring has oppositely a first surface and a second surface, and the outer ring has oppositely a third surface and a fourth surface. A gap spacing the first surface from the third surface has an upper air inlet and a lower air outlet. The second surface has a lower inner inclined surface forming a first angle with the first surface. The fourth surface has an outer inclined surface forming a second angle with the third surface. The ultrasonic oscillator, disposed in a chamber of the tool holder spatially connected with the gap, is used for providing ultrasonic oscillation to a cutter. In addition, a cooling and chip diversion system for the ultrasonic cutter is also provided.

Described is a process for introducing perforations in a laminate that comprises a silicone gel. The process includes the following steps: bringing an array of perforating elements in contact with a deformable layer of a laminate that at least includes a substrate layer, a layer comprising a silicone gel and a deformable layer, wherein said deformable layer covers said layer including the silicone gel; applying ultrasonic energy to said laminate in order to simultaneously introduce a plurality of perforations into said laminate, while providing deformed portions in said deformable layer, wherein said deformed portions penetrate into the plurality of perforations in said laminate; after having introduced said plurality of perforations into said laminate, keeping said deformable layer in contact with said layer including the silicone gel, such that said deformed portions remain penetrating into said plurality of perforations, for at least 12 hours.

The disclosure relates to a method for producing a fiber preform, wherein: at least one dry and textile fiber material is provided; the fiber material is assembled into a plurality of individual layers; the plurality of individual layers is provided with a binder; the plurality of individual layers is layered to form a package; and a plurality of interconnected fiber preforms is formed by pressing the package. A separation of the plurality of interconnected fiber preforms and activation of the binder occur in a common process step. The disclosure furthermore relates to a corresponding system.

Described is a ultrasonic welding of laminates, more particular to the use of ultrasonic energy to create stable perforations in a laminate, in particular a laminate that includes a silicone gel. Specifically, a perforation element is provided, that is optionally part of array of perforation elements, which perforation element or array of perforation elements is advantageously used in an ultrasonic welding device and in a process for continuously introducing perforations into a laminate.

The technology as disclosed herein includes a method and apparatus for deboning a meat item, and more particular for deboning a poultry item including performing an initial shoulder cut for removing boneless breast meat from the poultry carcass or frame. The method and apparatus disclosed and claimed herein is a combination of a robotic arm including an ultrasonic knife implement and a vision system for varying the cut path based on the shape and size of the poultry item. The combination as claimed including the ultrasonic knife can perform a meat cut while penetrating the meat with less force than the typical penetration that occurs when using a traditional knife.

A wafer manufacturing method includes: a crack layer forming step of applying a laser beam of such a wavelength as to be transmitted through an ingot to the ingot, with a focal point of the laser beam positioned in a region spaced from an end face of the ingot by a distance corresponding to the thickness of the wafer to be manufactured, to form a crack layer, a cut groove forming step of positioning a cutting blade on an extension line of the crack layer and forming a cut groove continuous with the crack layer in a periphery of the ingot; and a peeling step of applying an ultrasonic wave to the end face of the ingot to peel off the wafer to be manufactured, along the crack layer.

In one embodiment, systems and methods include using an ultrasonic cutter in a ground detection system to prevent damage to a substrate. The method of detecting a substrate comprises attaching a workpiece clamp to the substrate. The method further comprises cutting a layer of coating disposed on the substrate with an ultrasonic cutter, wherein the ultrasonic cutter operates at a frequency of about 20 kHz to about 40 kHz, wherein the layer of coating is non-conductive. The method further comprises contacting the substrate with the ultrasonic cutter.

The present disclosure relates to a punching cell for punching holes in workpieces, the cell comprising an industrial robot comprising a base, a wrist and at least four robot axes between the base and the wrist; a tooling comprising a frame to be detachably attached/mounted to the wrist axis of the industrial robot, an ultrasonic puncher tool mounted on the frame, a die mounted on the frame and aligned with the puncher, and a servomotor configured to drive the puncher tool towards the die; the cell further comprising a support fixture to position the workpiece to be punched, and a control unit to control the operation of the industrial robot to punch a hole in the workpiece.

A film cutting device includes a stage which supports a circuit film, a cutter disposed on the stage to cut the circuit film, a vibration horn connected to the cutter, where the vibration horn vibrates the cutter in a first direction based on an ultrasonic wave, and a cooler which cools the cutter.

A manufacturing method includes locking a material to be cut against a cutting bed, stabilizing the material against the cutting bed, and cutting the material.