PROCESS FOR INTRODUCING PERFORATIONS INTO LAMINATES COMPRISING SILICONE GELS
20220152861 · 2022-05-19
Inventors
Cpc classification
B23K20/10
PERFORMING OPERATIONS; TRANSPORTING
B32B3/266
PERFORMING OPERATIONS; TRANSPORTING
A61F13/0276
HUMAN NECESSITIES
B26D7/086
PERFORMING OPERATIONS; TRANSPORTING
B32B2274/00
PERFORMING OPERATIONS; TRANSPORTING
B32B27/306
PERFORMING OPERATIONS; TRANSPORTING
International classification
B26D7/08
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Described is a process for introducing perforations in a laminate that comprises a silicone gel. The process includes the following steps: bringing an array of perforating elements in contact with a deformable layer of a laminate that at least includes a substrate layer, a layer comprising a silicone gel and a deformable layer, wherein said deformable layer covers said layer including the silicone gel; applying ultrasonic energy to said laminate in order to simultaneously introduce a plurality of perforations into said laminate, while providing deformed portions in said deformable layer, wherein said deformed portions penetrate into the plurality of perforations in said laminate; after having introduced said plurality of perforations into said laminate, keeping said deformable layer in contact with said layer including the silicone gel, such that said deformed portions remain penetrating into said plurality of perforations, for at least 12 hours.
Claims
1. A process for introducing a plurality of perforations into a laminate, wherein said process comprises at least the following steps: i. providing a laminate, said laminate comprising at least one substrate layer, said substrate layer being in contact with at least one layer comprising a silicone gel: said laminate further comprising, in contact with said layer comprising silicone gel layer, at least one deformable layer; ii. providing an ultrasonic welding device comprising an array of perforating elements suitable for introducing perforations into at least said substrate and said layer comprising silicone gel; iii. bringing said array of perforating elements in contact with said deformable layer of said laminate; iv. applying ultrasonic energy to said laminate in order to simultaneously introduce a plurality of perforations into at least said substrate and said layer comprising silicone gel, while introducing deformed portions in said deformable layer, wherein said deformed portions essentially correspond to the shape of the perforating elements, further wherein said deformed portions at least partly penetrate into the perforations so created; v. after having introduced said plurality of perforations into said laminate, keeping said deformable layer in contact with said layer comprising silicone layer, such that said deformed portions remain penetrating into said plurality of perforations, for at least 12 hours.
2. The process according to claim 1, wherein said substrate layer of the laminate is a polymer layer.
3. The process according to claim 1, wherein the thickness of said substrate layer is from 5 μm to 200 μm.
4. The process according to claim 1, wherein said substrate layer is in contact with at least one further layer that is positioned farther away from said layer comprising silicone gel.
5. The process according to claim 1, wherein a silicone composition, precursor or silicone gel is brought into contact with the substrate layer in a process step (0) that occurs prior to step (i).
6. The process according claim 5, wherein the time from the moment of joining said substrate layer with a silicone composition, precursor or silicone gel in a step (0) and the moment of applying ultrasonic energy to the laminate in order to simultaneously introduce a plurality of perforations into said laminate is not more than 12 hours.
7. The process according to claim 1, wherein said layer comprises the silicone gel, wherein the silicone gel is based on a two-component silicone composition.
8. The process according to claim 1, wherein atho softness/penetration depth of said silicone gel is from 3 mm to 20 mm.
9. The process according to claim 1, wherein the amount of silicone gel per square meter is from 10 g/m.sup.2 to 500 g/m.sup.2.
10. The process according to claim 1, wherein said perforations have a diameter of from 0.5 mm to 20 mm.
11. The process according to claim 1, wherein the melting point of said deformable film is from 120 to 230° C.
12. The process according to claim 1, wherein said deformable layer comprises a material selected from the group consisting of polypropylene, polyester, polycarbonate, and polyamide or a combination thereof.
13. The process according to claim 1, wherein after the time period indicated in step (v), the process further comprises the step of removing said deformable layer from said layer comprising silicone gel.
Description
DESCRIPTION OF THE FIGURES
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[0073] As is apparent from
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[0075] All perforated products discussed above were analysed visually using polarized light microscopy. The distance between two perforations (in all analysed products) is approximately 3 mm (centre-to centre distance). All microscopic images in the above examples have been taken from the polyurethane film side of the laminate.