To provide a process for producing a package for mounting a semiconductor element by using a mold, said a package for mounting a semiconductor element comprising a substrate having a mounting surface for mounting a semiconductor element and a packaging body formed from a cured product of a curable resin and having a frame-shaped portion surrounding the mounting surface, and the package has a concave portion formed by the mounting surface and the packaging body, which allows it to prevent resin burrs without occurrence of dents or damage of a substrate and failure in releasing from a mold, and to provide a mold release film to be suitably used for the production process. A mold release film having a substantially constant thickness over the film, is disposed on the upper mold having a convex portion of which shape corresponds to the concave portion, the substrate is disposed on the lower portion, the upper mold and the lower mold are closed so as to be in close contact with the convex portion to the mounting portion of the substrate via the mold release film, a space formed between the upper mold and the lower mold is filled with a curable resin, followed by curing the curable resin, and the cured product is released together with the substrate, from the mold.

To provide a process for producing a package for mounting a semiconductor element by using a mold, said a package for mounting a semiconductor element comprising a substrate having a mounting surface for mounting a semiconductor element and a packaging body formed from a cured product of a curable resin and having a frame-shaped portion surrounding the mounting surface, and the package has a concave portion formed by the mounting surface and the packaging body, which allows it to prevent resin burrs without occurrence of dents or damage of a substrate and failure in releasing from a mold, and to provide a mold release film to be suitably used for the production process. A mold release film having a substantially constant thickness over the film, is disposed on the upper mold having a convex portion of which shape corresponds to the concave portion, the substrate is disposed on the lower portion, the upper mold and the lower mold are closed so as to be in close contact with the convex portion to the mounting portion of the substrate via the mold release film, a space formed between the upper mold and the lower mold is filled with a curable resin, followed by curing the curable resin, and the cured product is released together with the substrate, from the mold.

A method for manufacturing a structure by curing together a base laminate and structural components placed thereon. Particularly, the uncured structural component has a peripheral tapered foot edge so that the vacuum bag placed thereon follows all the uncured plies without an abrupt leap from the structural component foot to the base laminate.

A surfacing material includes a substrate having a top side and a bottom side. A matte surface is formed on the bottom side thereof, wherein the matte surface of the surfacing material is a coating of an electron beam radiation curable material applied to the bottom side of the substrate. The coating is an epoxy acrylic or urethane acrylic laid upon the substrate. The epoxy acrylic or urethane acrylic is irradiated with UV-radiation to produce a UV-radiation layer wherein the epoxy acrylic or urethane acrylic is neither hardened nor is an entire layer of the epoxy acrylic or urethane acrylic crosslinked but rather the epoxy acrylic or urethane acrylic only crosslinked on the surface thereof, which produces a matting surface through the effects of a micro-convolution.

A method includes: providing a mold assembly includes lower and upper molds; placing a release film on the lower mold and vacuuming a lower cavity of the lower mold; attaching a first molding member to the release film, and moving the release film and the first molding member into an upper cavity of the upper mold; placing a transfer film on the lower mold and vacuuming the lower cavity; attaching a second molding member to the transfer film; hot molding the first and second molding member into a golf club head part having a patterned surface formed by a transfer surface of the transfer film; and connecting the golf club head part to a golf head shell to obtain a golf club head.

A method includes: providing a mold assembly includes lower and upper molds; placing a release film on the lower mold and vacuuming a lower cavity of the lower mold; attaching a first molding member to the release film, and moving the release film and the first molding member into an upper cavity of the upper mold; placing a transfer film on the lower mold and vacuuming the lower cavity; attaching a second molding member to the transfer film; hot molding the first and second molding member into a golf club head part having a patterned surface formed by a transfer surface of the transfer film; and connecting the golf club head part to a golf head shell to obtain a golf club head.

A method for preparation of a mold (10) intended to form a slab from a mixture of agglomerate comprising the steps of depositing over the mold surfaces a sheet (15) of PVA-based plastic material so as to form with it a surface for subsequent contact with the mixture introduced into the mold for forming the slab, whereby in at least some areas a layer (14) of a fluid agent containing PVA in a solution is interposed between the sheet (15) and the mold surfaces. A plant for carrying out the method and a method for production of a slab are also described.

The present disclosure is directed to a method of making a composite part. The method comprises covering a mold tool for a composite part with a parting film. The method further comprises laying up at least one layer of pre-preg on the parting film covering the mold tool to form a laid-up composite part and removing the laid-up composite part from the parting film. The parting film comprises a polymer sheet having a first major surface and a second major surface; and a first adhesive disposed on the first major surface of the polymer sheet, the first adhesive adhering the polymer sheet to the mold tool.

The present disclosure is directed to a method of making a composite part. The method comprises covering a mold tool for a composite part with a parting film. The method further comprises laying up at least one layer of pre-preg on the parting film covering the mold tool to form a laid-up composite part and removing the laid-up composite part from the parting film. The parting film comprises a polymer sheet having a first major surface and a second major surface; and a first adhesive disposed on the first major surface of the polymer sheet, the first adhesive adhering the polymer sheet to the mold tool.

A die device for molding a plurality of semiconductor chips is provided. The die device includes a lower die including a moving plate that has a plurality of V-groove structures for suctioning a release film coated with a resin, and an upper die which descends to the lower die or ascends from the lower die, thereby closing/opening the dies. The upper die includes at least a plurality of suction vent units for suctioning a substrate on which the semiconductor chips are arranged, and the lower die includes a device for manually adjusting the tension of a spring that supports the moving plate.