An apparatus and method for embossing a substrate are disclosed. For example, the apparatus includes an embossing platform, a printhead to dispense ink on the embossing platform in a desired raised pattern on the embossing platform, a press to apply a load against a substrate placed on the desired raised pattern and the embossing platform to emboss the desired raised pattern onto the substrate, and an ink removal device to remove the ink that is dispensed on the embossing platform in the desired raised pattern.

An apparatus and method for embossing a substrate are disclosed. For example, the apparatus includes an embossing platform, a printhead to dispense ink on the embossing platform in a desired raised pattern on the embossing platform, a press to apply a load against a substrate placed on the desired raised pattern and the embossing platform to emboss the desired raised pattern onto the substrate, and an ink removal device to remove the ink that is dispensed on the embossing platform in the desired raised pattern.

A cleaning sheet is interposed between resin molding mold surfaces and cleans the resin molding mold surfaces with a cleaning resin. The cleaning sheet is composed of a paper material, and is impregnated with a thermosetting resin and cured from the front surface layer to the back surface layer of the paper material.

The invention relates to a device for cleaning the surface of a tool for shaping the surface of a large-area fiber composite material body using a highly pressurized cleaning liquid, having a nozzle support which is held on a central bearing in a rotatable manner, at least one jet nozzle which is held in an arm of the nozzle support and out of which the highly pressurized cleaning liquid exits during operation, and a control unit for controlling the cleaning liquid pressure to be applied, wherein the nozzle support is surrounded by a housing which is provided with an opening towards the tool surface to be cleaned. The housing is connected to a suction device by means of which a housing interior equipped with the nozzle support can be suctioned. The housing interior is connected to an outer surrounding area via a pressure valve, and a liquid-tight seal with a flexible shape is arranged on a housing end which forms the opening, wherein the seal can be used to seal the space between the nozzle support and the body surface to be cleaned from the outer surrounding area, and the control unit has at least two pressure range settings. The invention additionally relates to a method for cleaning a surface of a tool.

Provided is a mold cleaning system. On the basis of an identification mark assigned to a mold and detected by a mark detector when cleaning the mold, the mold cleaning system obtains shape data for the molding surface of the mold which is stored in a database, and on the basis of the obtained shape data, the mold cleaning system controls the movement of arms using the control device, moves a laser head along the molding surface thereof while irradiating with a laser beam supplied by a laser oscillator, and as a result, removes the dirt adhered to the molding surface.

Provided is a mold cleaning system. On the basis of an identification mark assigned to a mold and detected by a mark detector when cleaning the mold, the mold cleaning system obtains shape data for the molding surface of the mold which is stored in a database, and on the basis of the obtained shape data, the mold cleaning system controls the movement of arms using the control device, moves a laser head along the molding surface thereof while irradiating with a laser beam supplied by a laser oscillator, and as a result, removes the dirt adhered to the molding surface.

The present technology relates to systems and methods for cleaning a compression molding system. In particular, a system including a first roller carrying a cleaning tape is provided. The system further includes a second roller configured to dispense the cleaning tape along a compression molding structure. The tape is removably adhered to the structure and subsequently removed, thereby removing foreign debris such as dust and/or other particles from the compression molding structure.

The present technology relates to systems and methods for cleaning a compression molding system. In particular, a system including a first roller carrying a cleaning tape is provided. The system further includes a second roller configured to dispense the cleaning tape along a compression molding structure. The tape is removably adhered to the structure and subsequently removed, thereby removing foreign debris such as dust and/or other particles from the compression molding structure.

A mold separation method includes the following steps: providing a mold separation device including a carrying mechanism, a scraping mechanism, and two separation mechanisms, wherein the scraping mechanism is disposed at an edge of the carrying mechanism, and the separation mechanisms are disposed at the edge of the carrying mechanism and are located on two opposite sides of the scraping mechanism; placing a first mold and a second mold bonded to the first mold on the carrying mechanism; causing the scraping mechanism to scrape off a spilled glue produced when the first mold is bonded to the second mold; and after scraping off the spilled glue, causing the separation mechanisms to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other.

A mold separation method includes the following steps: providing a mold separation device including a carrying mechanism, a scraping mechanism, and two separation mechanisms, wherein the scraping mechanism is disposed at an edge of the carrying mechanism, and the separation mechanisms are disposed at the edge of the carrying mechanism and are located on two opposite sides of the scraping mechanism; placing a first mold and a second mold bonded to the first mold on the carrying mechanism; causing the scraping mechanism to scrape off a spilled glue produced when the first mold is bonded to the second mold; and after scraping off the spilled glue, causing the separation mechanisms to pull open the first mold and the second mold so that the first mold and the second mold are separated from each other.