Provided is an apparatus configured to support resin molding, including: a prediction unit configured to generate a probability distribution of prediction values of analysis target characteristics of a resin molded body, that correspond to values of a plurality of molding factors of the resin molding; and a display processing unit configured to execute display processing for causing a display apparatus to display the probability distribution of the prediction values of the analysis target characteristics. The prediction unit is configured to calculate a change of the distribution of the prediction values of the analysis target characteristics when a value of at least one of the plurality of molding factors of the resin molding is changed within a predetermined range, and the display processing unit is configured to display the change of the probability distribution of the prediction values of the analysis target characteristics.

Provided is an apparatus configured to support resin molding, including: a prediction unit configured to generate a probability distribution of prediction values of analysis target characteristics of a resin molded body, that correspond to values of a plurality of molding factors of the resin molding; and a display processing unit configured to execute display processing for causing a display apparatus to display the probability distribution of the prediction values of the analysis target characteristics. The prediction unit is configured to calculate a change of the distribution of the prediction values of the analysis target characteristics when a value of at least one of the plurality of molding factors of the resin molding is changed within a predetermined range, and the display processing unit is configured to display the change of the probability distribution of the prediction values of the analysis target characteristics.

A hot runner process controller configured to monitor the status and operation of a hot runner system to autonomously generate information to improve the quality of injection molding process of a hot runner system having an inlet nozzle, one or more manifolds and one or more nozzles with actuator or without actuator, and one or more heating elements, the hot runner process controller is self-operating, and independent from the injection molding machine, includes: one or more sensors located on, in or at the hot runner system to detect the status and/or the operation of the hot runner system, and a processing unit and a memory. The processing unit is connected to the one or more sensors, wherein the memory stores data and program codes. The processing unit is configured to load and execute the program code to compare sensor information with the stored data and to determine if the hot runner system is in an operable status, and in case the hot runner system is in an operable status, configured to generate status information to activate the one or more heating elements and/or the one or more actuators enabling a production operation of the injection molding machine. In case the hot runner system is not in an operable status, configured to generate status information to deactivate the one or more heating elements and/or close or deactivate the one or more actuators disabling a production operation of the injection molding machine.

The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.

According to one embodiment, a substrate processing device includes a stage configured to mount a substrate, a mold having a first surface facing an upper surface of an outer peripheral edge of the substrate and a second surface facing a side surface of an outer peripheral continuous with the upper surface of the outer peripheral edge, a mold moving mechanism configured to move the mold to bring the first surface close to the upper surface of the outer peripheral edge of the substrate and the second surface close to the side surface of the outer peripheral of the substrate, and a nozzle arranged in the mold, wherein the nozzle ejects resist.

According to one embodiment, a substrate processing device includes a stage configured to mount a substrate, a mold having a first surface facing an upper surface of an outer peripheral edge of the substrate and a second surface facing a side surface of an outer peripheral continuous with the upper surface of the outer peripheral edge, a mold moving mechanism configured to move the mold to bring the first surface close to the upper surface of the outer peripheral edge of the substrate and the second surface close to the side surface of the outer peripheral of the substrate, and a nozzle arranged in the mold, wherein the nozzle ejects resist.

A mold apparatus for forming a molded part includes a mold body, a mold cavity formed in said mold body, a plurality of valve gates associated with said mold body, and a controller in communication with said plurality of valve gates. The controller is programmed to time opening of each valve gate based on a selected flow rate required to eliminate weld lines in the product.

A mold apparatus for forming a molded part includes a mold body, a mold cavity formed in said mold body, a plurality of valve gates associated with said mold body, and a controller in communication with said plurality of valve gates. The controller is programmed to time opening of each valve gate based on a selected flow rate required to eliminate weld lines in the product.

A control device for an injection molding machine including a cylinder into which a resin is supplied and a screw that moves forward and rearward and rotates inside the cylinder, includes a metering control unit that performs metering of the resin inside the cylinder by controlling forward rotation and rearward movement of the screw until the screw has been moved rearward to a predetermined metering position, based on predetermined metering conditions, a rearward movement speed acquisition unit acquiring a rearward movement speed of the screw, a speed determination unit that determines a suck back speed for causing a resin pressure to reach a target pressure, based on the rearward movement speed acquired during metering by the rearward movement speed acquisition unit, and a suck back control unit causing the screw to move further rearward based on the suck back speed, after the screw has reached the predetermined metering position.

Provided is an injection molding apparatus including a first mold and a second mold, an ejector plate provided on the first mold to reciprocate and configured to eject an injection molded object between the first mold and the second mold, and a sensor device having a moving sensor detachably attached to the ejector plate, and configured to detect a position of the ejector plate, wherein the sensor device is detachably attached to the first mold and the ejector plate by a magnetic force.