A method for manufacturing a biomass molded floor includes steps of: (1) preparing a PVC (polyvinyl chloride) board and a wood-plastic board, wherein a density of the wood-plastic board is in a range of 0.87-0.90 g/cm.sup.3; (2) coating an upper surface of the wood-plastic board with an adhesive, bonding the wood-plastic board with the PVC board, wherein an area of the wood-plastic board is in a range of 1000 mm×1200 mm-1000 mm×1800 mm; and (3) performing molding after bonding, wherein parameters of the molding are: temperature in a range of 35-40° C., pressure in a range of 10-12 MPa, time in a range of 50-60 s.

A method of imprinting a substrate (180), comprising affixing a flexible stamp (104) carrying an imprinting pattern (106) to a first carrier (102) comprising an array of apertures (112) which, by gas pressure, either pull the flexible stamp towards the first carrier or push it away; pushing it to a second carrier (170) carrying a substrate (180) with a resist layer (182), leaving a gap (190) for creating a controllable contact area between the flexible stamp and the substrate and space (196) between the first carrier and the flexible stamp; progressively pushing areas of the flexible stamp into the resist layer to imprint it; developing the resist layer; and progressively releasing the flexible stamp by applying suction through successive apertures whilst controlling the inward flow of gas to the space (196) through the apertures that are not yet under suction in order to maintain the space (196) there above ambient but below a pre-determined maximum pressure.

Pattern forming method includes, for each shot area group (SAG) in the following order: discretely dropping curable composition droplets to layer the droplets on a plurality of shot areas included in a certain SAG on substrate; waiting for a time of (m.sub.max−m)×Td, where Td is a time for the dropping on one shot area, m is the number of shot areas included in the certain SAG, and m.sub.max is the maximum value of m; and imprinting in order that the dropping is performed on the plurality of shot areas. The time Td and a time Ti for the imprinting on one shot area are equal to each other. The number of shot areas included in at least one SAG is different from the number of shot areas included in another at least one SAG. In the waiting, the dropping and the imprinting are not performed.

Embodiments provided herein provide for amorphous encapsulation of nanoparticle imprint films for optical devices. In one embodiment provided herein, a device is provided. The device includes a plurality of optical device structures disposed on a surface of a substrate. The plurality of optical device structures include a nanoparticle imprint material. The plurality of optical device structures further include an encapsulation layer disposed over at least a top surface and one sidewall of each optical device structure of the plurality of optical device structures. The encapsulation layer is amorphous or substantially amorphous. The encapsulation layer includes a niobium oxide. The niobium oxide is selected from the group consisting of niobium monoxide (NbO), niobium dioxide (NbO.sub.2), niobium pentoxide (Nb.sub.2O.sub.5), Nb.sub.12O.sub.29, Nb.sub.47O.sub.116, or Nb3n.sub.+1O.sub.8n−2, where n is 5 to 8.

An imprinting apparatus includes a silicon master having a plurality of nanofeatures defined therein. An anti-stick layer coats the silicon master, the anti-stick layer including a molecule having a cyclosiloxane with at least one silane functional group. A method includes forming a master template by: depositing a formulation on a silicon master including a plurality of nanofeatures defined therein, the formulation including a solvent and a molecule having a cyclosiloxane with at least one silane functional group; and curing the formulation, thereby forming an anti-stick layer on the silicon master, the anti-stick layer including the molecule. The method further includes depositing a silicon-based working stamp material on the anti-stick layer of the master template; curing the silicon-based working stamp material to form a working stamp including a negative replica of the plurality of nanofeatures; and releasing the working stamp from the master template.

There are provided a composition having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting, includes a compound 1 or a compound group 2; and a solvent, in which the compound 1 and the like is a compound decomposable into two or more compounds in a case where a polarity conversion group is treated, and at least one compound has a molecular weight of 30 to 400, and at least one compound has a molecular weight of 1,000 or more, the compound 1: a compound is a resin having a polymerizable group and a polarity conversion group, in which the resin has the polarity conversion group in at least a main chain or a side chain, the polarity conversion group is bonded to the main chain of the resin via a linking group in a case where the polarity conversion group is provided in the side chain, and the number of atoms constituting a chain of the linking group is 8 or more; and the compound group 2: a compound that has a polymerizable group and does not have a polarity conversion group, and a compound that does not have a polymerizable group and has a polarity conversion group.

The method for producing a skin material includes heat-pressing a raw material using an embossing die to obtain a skin material having a concave part formed on a front surface side and a flat back surface. The raw material is heat-pressed between the embossing die and an elastic mat to form, as the concave part, at least one of a plurality of concave parts for intensity display having different depths of a bottom and a concave part for gradation display in which the depth of the bottom gradually changes.

A substrate processing method includes a first process configured to process a substrate with a top plate disposed nearer an upper surface of the substrate, the substrate being held by a substrate holding unit of a first substrate holding apparatus, a second process configured to raise the substrate with the top plate disposed on the first substrate holding apparatus to make a space between the substrate holding unit and the substrate, a third process configured to insert a substrate conveyance apparatus for conveying the substrate with the top plate disposed on the first substrate holding apparatus to a second substrate holding apparatus into the space, and a fourth process configured to convey the substrate to the second substrate holding apparatus.

A medical device component is provided. The medical device component may include a body having a first surface being at least partially formed from a markable material having a first color, the markable material having a characteristic that an area exposed to laser irradiation of a predetermined wavelength of ultraviolet light changes to a second color different from the first color; a film covering at least a portion of the first surface of the body, the film having a transmittance at the predetermined wavelength of ultraviolet light of at least 5%; and a visible mark on the markable material at the first surface of the body covered by the film. The visible mark may include one or more areas of the markable material at the first surface having the second color. Methods of manufacturing the medical device component are also provided.

A method for the continuous in-register embossing of a stretchable film is provided where a repeating printed image or a laminate may be formed by way of the stretchable film in an embossing station. The embossing station may include a rotating embossing roll having an embossed image and an associated rotating counter-roll. The printed image length of the film may be stretched longitudinally before the embossing contact with the embossing roll to a length greater than or equal to or smaller than or equal to the embossed image length or the circumference of the embossing roll. The maintenance of register of the embossing may be achieved by way of a relative speed between the circumferential speed of the embossing roll and the web speed of the film in the embossing station.