Provided is an electromagnetic wave shielding material including a multilayer structure in which at least one metal foil and at least two resin layers are closely laminated, wherein both surfaces of each metal foil are closely laminated to the resin layers; wherein each metal foil satisfies the following relationship with each of the two resin layers adjacent to the metal foil: 0.02V.sub.M/V.sub.M1.2, in which: V.sub.M is a volume fraction of the metal foil relative to a total volume of the metal foil and the resin layer; V.sub.M is (.sub.R.sub.R)/(.sub.M+.sub.R.sub.R); .sub.M is a true stress (MPa) of the metal foil at breakage when a tensile stress is applied to the metal foil; .sub.R is a true stress (MPa) of the resin layer at breakage when a tensile stress is applied to the resin layer; and .sub.R is a true stress (MPa) of the resin layer when a logarithmic strain same as a logarithmic strain at breakage of the metal foil is applied to the resin layer.

A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.

A laminate which comprises a first resin layer and a second resin layer, and wherein: a resin constituting the first resin layer and a resin constituting the second resin layer are incompatible with each other, the first resin layer contains a polyolefin; the second resin layer contains a first thermoplastic resin and a second thermoplastic resin; and the first thermoplastic resin and the second thermoplastic resin are incompatible with each other, while having different solidification temperatures.

A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.

Provided are: a metal-resin composite structure, including a surface-roughened metal member and a resin member bonded to the metal member and composed of a polyarylene sulfide resin (PAS) composition; a PAS resin composition and a resin member, for use in the metal-resin composite structure; and a method. More specifically, provided are: a PAS resin composition including a PAS resin (A) and a phenol resin (B) in an amount of 0.05 to 20 parts by mass with respect to 100 parts by mass of the resin (A); a resin member obtained by melt-molding the PAS resin composition; and a metal-resin composite structure including a surface-roughened metal member and a resin member bonded to the metal member and composed of the PAS resin composition, wherein the metal member is made of aluminum, copper, magnesium, iron, titanium or an alloy containing at least one of them; and a method for producing the same.

A hybrid component has least one metal component, which has been overmolded with plastic at least in regions. A process for producing the hybrid component comprises processing a surface region of the metal component with a laser beam, and mounting and shrinking a shrink tube onto the processed surface region of the metal component or applying a sealing material to the processed surface region of the metal.

Provided are: a metal-resin composite structure, including a surface-roughened metal member and a resin member bonded to the metal member and composed of a polyarylene sulfide resin (PAS) composition; a PAS resin composition and a resin member, for use in the metal-resin composite structure; and a method. More specifically, provided are: a PAS resin composition including a PAS resin (A) and a phenol resin (B) in an amount of 0.05 to 20 parts by mass with respect to 100 parts by mass of the resin (A); a resin member obtained by melt-molding the PAS resin composition; and a metal-resin composite structure including a surface-roughened metal member and a resin member bonded to the metal member and composed of the PAS resin composition, wherein the metal member is made of aluminum, copper, magnesium, iron, titanium or an alloy containing at least one of them; and a method for producing the same.

A variety of polymeric composites with tunable mechanical stiffness and electrical conductivity are claimed herein. For example, the composite may have an elastomeric matrix, a plurality of tunable particles, and a plurality of conductive fibers embedded in the matrix. The composites may also be a tunable foam matrix and an elastomeric matrix. In some embodiments, the composites are a low melting point alloy (LMPA) foam infiltrated by an elastomer, whose stiffness can be tuned by more than two orders of magnitude through external heating. In other embodiments, the composite may be a conductive particle-fiber-matrix three-component composite capable of changing its elastic rigidity rapidly and reversibly when powered with electrical current.

A composition is composed mainly of: a component (I) (which is at least one selected from polyether ketone, polyether ether ketone, and polyether ketone ketone); a component (II) (which is polyphenylene sulfide); and, additionally if necessary, a component (III) (which is at least one selected from polyether imide, polyimide, polyamide imide, and polysulfone resins) and (IV) an inorganic filler. The composition is obtained using a conventional melt-kneading machine, for example, a single screw or twin screw extruder, Banbury mixer, or kneader in accordance with the melt-kneading method corresponding to the kneading machine. The resin composition for metal bonding has excellent metal bonding properties, and is applicable for use in automobile parts that require the composition to be bonded with metal and in electronic products such as laptop computers and mobile phones.

The temperature T ( C.) of a surface of an electroconductive mesh layer 15 in contact with a second resin layer (16), the thickness t.sub.1 of a first resin layer (14), and the thickness t.sub.2 of the second resin layer (16) satisfy expression (1). (1): T=f1(.sub.1, .sub.1, Cp.sub.1)ln(t.sub.1)+f2(.sub.2, .sub.2, Cp.sub.2)ln(t.sub.2)+C=[.sub.1/(.sub.1.Math.Cp.sub.1)] .sup.2T/x.sup.2+[.sub.2/(.sub.2.Math.Cp.sub.2)].sup.2T/x.sup.2+C=[.sub.1/(.sub.1.Math.Cp.sub.1)].Math.[(T.sup.P.sub.n+1+T.sup.P.sub.n12T.sup.P.sub.n)/(2.Math.x).sup.2]+[.sub.2/(.sub.2.Math.Cp.sub.2)].Math.[(T.sup.P.sub.n+1+T.sup.P.sub.n12T.sup.P.sub.n)/(2.Math.x).sup.2]+C.