The present disclosure discloses a specially packaged relay and a packaging method thereof. The relay includes an electromagnetic relay and an injection molded body. The injection molded body is injection molded outside the electromagnetic relay and wraps the electromagnetic relay therein. A plurality of conventional terminals of the electromagnetic relay are respectively exposed, or the conventional terminals of the electromagnetic relay are respectively located within the injection molded body, and each of the conventional terminals of the electromagnetic relay is connected with an external terminal that is exposed. The electromagnetic relay of the present disclosure is completely wrapped and sealed by the injection molded body, and is completely isolated from external liquid, which can effectively prevent the external liquid from flowing into the electromagnetic relay and ensure the electromagnetic relay to work stably for a long time in a liquid environment.

The present invention provides an imprint apparatus for performing an imprint process of molding an imprint material on a substrate with a mold to form a pattern on the substrate, the apparatus including a supply device configured to supply, to a space between the imprint material on the substrate and the mold, a penetrating gas that penetrates at least one of the mold, the imprint material and the substrate and a condensable gas that is liquefied by pressure rise due to the molding, and a controller configured to control the supply device so as to change at least one of a supply amount of the penetrating gas and a supply amount of the condensable gas based on information on a recipe for the imprint process.

Embodiments herein describe deformable controllers that rely on piezoelectric material embedded in the controllers to detect when the input device is being manipulated into a particular deformation or gesture. The computing system may perform different actions depending on which deformation is detected. The embodiments herein describe design techniques for optimizing the placement of the piezoelectric material in the controller to improve the accuracy of a mapping function that maps sensor responses of the material to different controller deformations. In one embodiment, the user specifies the different deformations of the controller she wishes to be recognized by the computing system (e.g., raising a leg, twisting a torso, squeezing a hand, etc.). The design optimizer uses the locations of the desired deformations to move the location of the piezoelectric material such that the sensor response of the material can be uniquely mapped to these locations.

An inductor includes a support having first and second coils formed on first and second surfaces thereof, respectively; a body embedding the support therein so that end portions of the first and second coils are exposed through first and second surfaces of the body opposing each other, and including a first magnetic part disposed in cores of the first and second coils and on upper and lower surfaces of the first and second coils, respectively, and second magnetic parts disposed on upper and lower surfaces of the first magnetic part, respectively; and first and second external electrodes formed on outer surfaces of the body to be electrically connected to the end portions of the first and second coils, respectively. The second magnetic part has a content of a hardening accelerator greater than that of the first magnetic part.

The invention relates to a method for manufacturing an optoelectronic component substrate (12) comprising a stack of layers, the method comprising a step of: preforming a substrate (12) comprising a face which has a pattern with at least one zone made of a first material and one zone made of a second material, the two materials being thermosetting or thermoplastic materials, the first material being an electrically conductive material and the second material being an electrically insulating material, and molding by compression the face of the substrate (12) with a face of a reference element (22) having a surface roughness less than or equal to 50 nanometers.

There is provided an imprint apparatus for forming a pattern of an imprint material on a substrate by using a mold, the imprint apparatus including a mold holding unit configured to hold the mold, and a substrate holding unit configured to hold the substrate, in which a particle is captured by generating a first region and a second region charged to different polarities in at least either one of a peripheral region of a region covered by the mold of the mold holding unit and a peripheral region of a region covered by the substrate of the substrate holding unit.

Provided is a sealing structure including a housing that houses a heat generating member or a heat dissipation member thereinside, and a resin that is filled in the housing. In a sectional view, the housing includes a first recess portion in a position facing the heat generating member or the heat dissipation member.

The present invention provides a functional film structure and a method of manufacturing the same. The functional film structure has a sensor button arranged on a film substrate and can be formed into a three-dimensional shape by thermal forming processes such as vacuum deep-drawing or high-pressure moulding. The functional film structure is preferably flexible and preferably has transparent and illuminated sections.

Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to the flexible substrate film, preferably by element of printed electronics and/or surface mounting, a protective layer (104) laminated onto at least first surface of the substrate film, the protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of the number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded over at least second surface of the substrate film opposite to the first surface. A corresponding method of manufacture is presented.

A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.