Patent classifications
B29L2031/3456
Method of Forming a Shaped Article
A method of forming shaped articles by welding.
Low density microspheres
Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.
Transparent drawn article
The invention relates to a process for the production of a high strength transparent high density polyethylene article comprising the steps of (i) heating a high density polyethylene (HDPE) to a temperature above the melting temperature (T.sub.m) of the HDPE; (ii) molding the heated HDPE obtained in step (i) to form a hot molded HDPE article; (iii) cooling the hot molded HDPE article to a temperature below T.sub.m to form a melt-crystallized HDPE article; (iv) stretching the melt-crystallized HDPE article to a total draw ratio of at least 5 comprising at least one stretching step of the article at a temperature T.sub.1 below the melting temperature T.sub.m to a draw ratio (DR.sub.1) of at least 2 to form an oriented HDPE article, wherein the HDPE has a melt flow index (MFI) measured at 21.6 kg and 190° C. according to ASTM D1238 of at most 1.5 g/I Omin, an isotropic density measured according to ISO 1 183-1 A of at most 0.955 g/cm3 and a T.sub.m measured according to ISO 1 1357-3 of greater than 130° C. The invention also relates to high strength transparent HDPE articles and products comprising the high strength transparent HDPE article such as ballistic resistant articles, visors, car parts, train parts, plane parts, windshields, windows and radomes.
Device for overmolding a core
A method for manufacturing an object having a polymer part, including inserting a core through a movable element via a hole passing through the movable element, inserting the polymer part in a mould, inside which the movable element is arranged, so that the polymer part is in contact with the movable element on a first side of the movable element, displacing the movable element in the mould by exerting a force, originating from the polymer part, on the movable element in such a way that the movable element slides along the core, the movable element constraining, at an entrance of the hole on the first side, at each instant and as the movable element is displaced, the position of the portion of the core in the course of being covered with polymer at this instant.
STRUCTURE REINFORCING MATERIAL, METHOD FOR MANUFACTURING REINFORCING MATERIAL, AND METHOD FOR MANUFACTURING STRUCTURE
[Problem]
To increase rigidity.
[Solution]
Provided is a structure including a main body portion, a plurality of reinforcement members arranged on the main body portion, each of the reinforcement members including a base material formed of resin or metal. Provided is a manufacturing method of a structure which includes a main body portion having a hollow configuration surrounding an internal space thereof. The manufacturing method includes a preparation step of preparing a plurality of reinforcement members each including at least a base material formed of resin or metal, a carrying-in step of carrying the plurality of reinforcement members into the internal space from an opening arranged at the main body portion, and a step of arranging a fixing portion which fixes the plurality of reinforcement members into the main body portion.
Molding designs for helical antennas
Exemplary embodiments are provided of molding designs and methods for helical antennas. In an exemplary embodiment, a method generally includes placing an antenna element between a top mold core and a first bottom mold core, and injecting molding material into a first mold cavity defined by at least the top mold core, thereby forming a top portion of a helical antenna housing and two opposite side portions of the helical antenna housing. The method also includes removing the first bottom mold core and placing a second bottom mold core about the antenna element, and injecting molding material into a second mold cavity defined by at least the second bottom mold core, thereby forming a bottom portion of the helical antenna housing.
Method for manufacturing an electronic assembly and an electronic assembly
A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.
METHOD FOR MANUFACTURING FILM-FORMED MOLDED PRODUCT
The present invention achieves cost reduction by simplifying the manufacturing process for a film-formed molded product provided with a metal coating film capable of transmitting electromagnetic waves therethrough. This method for manufacturing a film-formed molded product which includes a molded product and a metal coating film covering the molded product comprises: forming the molded product between a movable mold and a fixed mold; and then forming the metal coating film which covers the molded product by a film-forming part of a second mold without taking the molded product out from between the movable mold and the fixed mold. The metal coating film is capable of transmitting electromagnetic waves therethrough as a result of generation of cracks after being formed.
Method for manufacturing an electronic assembly and an electronic assembly
A method, for manufacturing an electronic assembly, such as an antenna or a capacitive sensing device or a coupled inductor, comprising at least a first electrically conductive element and a second electrically conductive element is presented. The method comprises obtaining said electrically conductive elements, such as patch elements, arranging said electrically conductive elements, such as inside of a cavity defined by a mold structure, at a pre-defined distance from each other for establishing an electromagnetic coupling between said electrically conductive elements, and molding, such as injection molding, a molding material layer at least between said electrically conductive elements, wherein the molding material layer has a thickness between said electrically conductive elements defined by the pre-defined distance. In addition, electronic assemblies, antennas, capacitive sensing devices and coupled inductors are presented.
Radio-wave transparent cover
The radio-wave transparent cover includes a plastic transparent layer, a decorative layer provided on the rear-side surface of the transparent layer, and a plastic base layer provided on the rear-side surface of the decorative layer. The transparent layer has a peripheral part having a protrusion extending rearward. The protrusion defines a peripheral edge of the transparent layer. The protrusion has an inner circumferential surface forming a part of an engaging end projecting rearward from the protrusion. The decorative layer is provided in a region of the rear-side surface of the transparent layer adjoining the inner circumferential surface of the engaging end.