Various techniques are provided to enclose at least a portion of a thermal imaging system in a thermoplastic material to create a waterproof thermal imaging system and encapsulate associated electrical components. In one example, a method includes placing at least a portion of a thermal imaging system comprising a plurality of exposed electronic components into a mold. The method also includes injecting a thermoplastic material into the mold to deposit the thermoplastic material onto the electronic components and encapsulate the electronic components in an overmolded solid enclosure formed by the thermoplastic material. Additional methods and systems are also provided.

The invention relates to a method for the ultrasonic welding of two plastic components using a sonotrode, wherein the energy for the welding is introduced into the plastic components via at least one or more pins of the sonotrode, wherein the two plastic components are welded to one another step by step, wherein the respectively subsequent step of the welding is carried out in a region which has already been loaded and relieved of tension as a result of the preceding step of the welding.

A display module is disclosed. The display module includes a planar display area and a curved display area bending and extending from an edge of the planar display area. The display module includes a curved cover plate, a flexible display panel attached to the curved cover plate, and a backplate. The backplate includes a thinning part, and a thickness of the thinning part is gradually reduced from an edge area of the planar display area to the curved display area. The present disclosure can reduce forces undergone by the flexible display panel in the curved display area and prevent curved sides of the flexible display panel from having a cracking risk.

A plug connector housing for a plug connector, having a main body and a latching installation. The latching installation has a first connection portion integrally connecting the latching mechanism to the main body. A void extends along a longitudinal axis on the main body and is at least in portions formed between the latching installation and the main body. The plug connector housing furthermore has first and second protective elements which extend in each case integrally from the main body. The latching installation is disposed between the protective elements, wherein each of the protective elements in at least one covered region covers the void in a transverse direction. Each of the protective elements moreover configures at least one access region in which the void is accessible along the transverse direction. Each of the covered regions faces a respective access region of the respective other protective element along the transverse direction.

The present invention discloses a solenoid valve for water capable of enhancing a electromagnetic suction force and an implementation method thereof. the method comprises: obtaining a plastic-sealed stator assembly by injecting plastic on a stator assembly, the plastic-sealed stator assembly; assembling the plastic-sealed stator assembly and a valve body assembly comprising a movable iron core together to form the solenoid valve for water; wherein the upper end face of the movable iron core at the initial position is set as not lower than the upper edge of lower magnetic conductive inner sleeve and not higher than ¼ of the distance from the upper edge of lower magnetic conductive inner sleeve to the lower edge of upper magnetic conductive inner sleeve, so as to enhance the electromagnetic suction force of the solenoid valve for water. The plastic-sealed stator assembly comprises a coil assembly; an upper magnetic conductive inner sleeve and a lower magnetic conductive inner sleeve mounted in a hole of the coil assembly; a water-isolating sleeve located inside the upper magnetic conductive inner sleeve and the lower magnetic conductive inner sleeve; a yoke located outside the coil assembly and connecting the upper magnetic conductive inner sleeves and the lower magnetic conductive inner sleeves; a magnetic conductive seat mounted on an inner side of the water-isolating sleeve; and a plastic-sealed layer covering the coil assembly and the yoke.

A caulking pin (15) is inserted into a mounting hole (21) provided in a metal case body (3), and the end portion of the caulking pin (15) is thermally caulked with a welding tip (24) to form a mold forming portion (17). A surplus absorption recess (31) is formed by enlarging the opening end of the mounting hole (21), and surplus resin is absorbed. The surplus absorption recess (31) is positioned inside a region of the mold forming portion (17). Therefore, the amount of molten surplus resin that protrudes outward from the welding tip (24) in the thermal caulking process is reduced.

A molded article or an electrical product facilitates layout of a wiring line from an electrical circuit of a circuit film integrally molded with a molded body to a connection terminal. The molded article includes a circuit film and a molded body. The circuit film includes an insulating film and an electrical circuit. The molded body is integrally molded with the circuit film. The circuit film includes a flexible wiring portion. The molded body has a through-hole that penetrates from a first main surface to a second main surface. In the flexible wiring portion, a connection terminal is arranged at a position of passing through the through-hole and beyond the second main surface.

An aesthetic component for a water bearing appliance. The component comprises a first polymeric material and a second polymeric material. The external surface of the component is at least partially constituted by the first polymeric material and the first polymeric material covers the second polymeric material. The second polymeric material comprises a recycled polymeric material.

An encapsulating material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression-molded body formed by compression-molding the encapsulating material for compression molding on a substrate with a silicon chip interposed, the area of the portion other than dark spots of the region corresponding to the compression-molded body on the chip is 86% or more of the area of the entire region corresponding to the compression-molded body on the chip.

Parts (10) for connection to at least one further part (30, 30′). The part (10) has at least two weld sections (11, 11′) to be welded individually to at least one of the further parts (30, 30′) by vibration welding. Each weld section (11, 11′) has at least one weld surface (13, 13′), for connection to the corresponding further part (30, 30′), and is spatially separated from each other weld section (11, 11′) by at least one vibration decoupling zone (14, 14′,23, 26). The part (10) has a particular arrangement of the weld section (11, 11′) with respect to the center of gravity (S) or has a particular mass distribution with respect to the weld section (11, 11′). Methods for connecting a part to at least one further part (30, 30′) and a composite part (90) containing a part (10) and a further part (30, 30′) are also disclosed.