A method of manufacturing an assembly with a housing part and at least two conductors of shape sheet metal parts may include providing at least one first conductor formed from at least one sheet metal part and at least one second conductor formed from at least one sheet metal part. The method may then include arranging the first and second conductors in an injection mould in such a way that the first conductor may come into mechanical contact with the second conductor in a common contact zone to produce an electrical connection. The method may then include at least partially overmoulding the first and second conductors with a plastic to form a joint housing part. The method may further include bonding the first and second conductors in a region of the common contact zone after at least partially overmoulding the first and second conductors.

A metallic holding element for absorbing or introducing a torque in a plastic housing is presented, wherein the holding element in the holding area features a profile with three, four, or five main corners, which are connected to each other via straight or convex edges, preferably the edges are generally curved in a convex manner respectively through one or more obtuse-angled intermediate corners.

Injection molded article with reduced stress whitening, said article comprises a composition of a heterophasic propylene copolymer, inorganic filler and optionally low amounts of a high density polyethylene, wherein said heterophasic propylene co polymer has a propylene copolymer as a matrix.

Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.

A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other.

An electronic device and related method that includes a metal member, a circuit board, and a shielding member. A through hole or slot is disposed on the metal member. The shielding member is fastened on the metal member. The shielding member includes a blocking portion and an enclosing portion. The blocking portion is made of an electrically conductive plastic material. The enclosing portion is made of a metal material or an electrically conductive plastic material. The blocking portion is configured to block the through hole or slot. The enclosing portion is disposed around the electronic component. One end of the enclosing portion is electrically connected to the metal member, and the other end of the enclosing portion is electrically connected to the circuit board. The metal member, the blocking portion, the enclosing portion, and the circuit board form a shielding space, and the electronic component is located in the shielding space.

In one aspect, a protective window comprising a first transparent member comprising a polymer; and a protective layer on a first surface of the first transparent member and comprising silsequioxane is provided.

A method for manufacturing an electronic device casing having a coupling structure is provided. The electronic device casing is made of a casing material including a supportive substrate and a first thermoplastic substrate. A preliminary connecting section is formed on the first thermoplastic substrate by a hot-pressing molding process, and a molding plastic material is injected onto the preliminary connecting section by an in-mold injection process. After being cooled, the molding plastic material engages with the preliminary connecting section to form a secondary connecting section for a coupling element to couple with. Thus, the coupling structure of the electronic device casing can be directly formed during a manufacturing process without any additional procedures, thereby overall manufacturing time and costs are reduced.

A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.

The present invention relates to a customization previewing system for a component for a vehicle, such as a motorcycle. In one embodiment, the system comprises paintable scaled models or prototypes for OEM motorcycle components, such as fenders, fuel tanks, saddlebags and the like. The model prototypes are configured to be between 50 and 80 percent in size of the OEM motorcycle components to enable the owner to accurately preview or visualize a customization job before the same is performed on the actual OEM motorcycle component. Each of the model prototypes is also comprised of a mounting hook for mounting the prototype to a wall or other surface. A spray painter is used to spray the paint, decoration or graphic onto the prototype and change the color thereof based on the preferences of the user.