Patent classifications
B32B17/061
Copper-alloy capping layers for metallization in touch-panel displays
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
Sliding laminated glazing unit with interior projection
An automotive glazing unit includes a glazing and a system for allowing the glazing to be moved translationally with respect to a door of the vehicle. The glazing is curved and laminated and includes an exterior and an interior glass sheet and a plastic sheet located between the exterior and interior glass sheets. Each sheet has a peripheral edge face. The interior glass sheet is a glass sheet that has undergone a chemical tempering operation and has a thickness included between 0.40 and 2.10 mm and the edge face of the interior glass sheet is located beyond the edge face of the plastic sheet and beyond the edge face of the exterior glass sheet over at least one portion of the length of the edge face of the interior glass sheet.
THREE-DIMENSIONAL COLD FORMED CURVED COMPOSITES
The disclosure relates to composites comprising: a cold-formed decorated or non-decorated glass substrate having first and second major surfaces; a metal or polymeric substrate having first and second major surface; and at least one adhesive located between the glass substrate first major surface and the metal or polymeric substrate first major surface; the glass substrate first and second major surfaces and the metal or polymeric substrate first and second major surfaces defining at least one curvature, the at least one curvature having a bend radius of about 60 mm or greater; wherein the composite maintains adhesion between the glass substrate and the metal or polymeric substrate following physical testing according to a modified GMW3172 environmental and durability test.
GLASS LAMINATE ARTICLE AND METHOD OF MANUFACTURING THE SAME
A glass laminate article includes an adhesive film attached to a base material, and a glass substrate layer attached to the adhesive film, wherein the glass substrate layer has a side surface that is inclined with respect to an upper surface thereof by an obtuse angle. According to the glass laminate article and a method of manufacturing the glass laminate article, the glass laminate article has an excellent appearance and safety and may be easily manufactured at a low cost.
Laminated glass in which a single glass sheet has a through-hole
A laminated glazing includes a first sheet of glass and a second sheet of glass which are bonded together via an adhesive interlayer, in which the second sheet of glass has a through-hole, wherein over the surface of the hole and a peripheral surface around same, a thin sheet of a thickness of between 0.01 and 0.5 mm, made from a material compatible with the manufacture and the mechanical stresses and the aging of the laminated glazing, is interposed between the adhesive interlayer and the second sheet of glass.
CALIBRATION OBJECT FOR AN X-RAY SYSTEM
Disclosed is a calibration object for an x-ray system and an optical system, the calibration object comprising: a first part made of a first material having a matte surface, the first material having a first attenuation coefficient of x-rays; a second part made of a second material having a second attenuation coefficient of x-rays different from the attenuation coefficient of the first material; wherein the first part is attached to the second part so that one or more features are detectable by one or more optical cameras.
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
MANUFACTURING METHOD FOR ELECTROMAGNETIC SHIELDING FILM AND ELECTROMAGNETIC SHIELDING WINDOW
Provided is a method for manufacturing an electromagnetic shielding film, which includes: step 1), coating a photoresist on a conductive substrate, and then forming a pattern structure on the conductive substrate through a photolithography process; step 2), growing a metal layer in the pattern structure through a selective electrodeposition process to form a metal pattern structure; and step 3), embedding the metal pattern structure in a flexible base material through an imprinting process to form an electromagnetic shielding film. A method for manufacturing an electromagnetic shielding window is also provided.
LAMINATED GLASS STRUCTURES WITH ENHANCED THERMAL AND MOISTURE-RESISTANCE
A laminated glass structure is provided that includes: a substrate, a flexible glass sheet, a buffer layer, a first adhesive and a second adhesive. The substrate has a thickness from about 2.5 mm to about 50 mm and primary surfaces. The buffer layer has a thickness from about 0.1 mm to about 2.5 mm and is laminated to the substrate with the first adhesive. The flexible glass sheet has a thickness of no greater than 0.3 mm and is laminated to the buffer layer with the second adhesive. Further, the buffer layer is characterized by an elastic modulus of at least 70 GPa and a coefficient of thermal expansion between about 4 and 25 ppm*° C..sup.−1.
Siloxane plasma polymers for sheet bonding
Described herein are glass articles and methods of making glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier or bonded together using a coating layer, which is preferably an organosiloxane polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on the thin sheet, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The coating layer bonds the thin sheet and carrier together to prevent a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.