The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

In a ceramic/copper/graphene assembly, a ceramic member, a copper member formed of copper or a copper alloy, and a graphene-containing carbonaceous member containing a graphene aggregate are joined. At a joining interface between the copper member and the graphene-containing carbonaceous member, an active metal carbide layer containing a carbide of one or more kinds of active metals selected from Ti, Zr, Nb, and Hf is formed on a side of the graphene-containing carbonaceous member, and a Mg solid solution layer having Mg dissolved in a matrix phase of Cu is formed between the active metal carbide layer and the copper member.

In a ceramic/copper/graphene assembly, a ceramic member, a copper member formed of copper or a copper alloy, and a graphene-containing carbonaceous member containing a graphene aggregate are joined. At a joining interface between the copper member and the graphene-containing carbonaceous member, an active metal carbide layer containing a carbide of one or more kinds of active metals selected from Ti, Zr, Nb, and Hf is formed on a side of the graphene-containing carbonaceous member, and a Mg solid solution layer having Mg dissolved in a matrix phase of Cu is formed between the active metal carbide layer and the copper member.

A fire resistant vacuum insulating glazing assembly with at least one vacuum insulating glazing unit having first and second glass panes; a set of discrete pillars between the glass panes; a hermetically bonding seal sealing the distance between the glass panes; an internal volume defined by the glass panes and closed by the hermetically bonding seal, wherein there is a vacuum of absolute pressure of less than 0.1 mbar. The inner pane faces face the internal volume, and the glazing assembly further includes at least one intumescent unit having a layer of intumescent material, an intumescent unit glass pane, and an intumescent unit peripheral spacer. The intumescent unit glass pane and the intumescent unit peripheral spacer define an intumescent unit volume, and the layer of intumescent material and the intumescent unit peripheral spacer face one of the outer pane faces of the first or second glass panes.

A fire resistant vacuum insulating glazing assembly with at least one vacuum insulating glazing unit having first and second glass panes; a set of discrete pillars between the glass panes; a hermetically bonding seal sealing the distance between the glass panes; an internal volume defined by the glass panes and closed by the hermetically bonding seal, wherein there is a vacuum of absolute pressure of less than 0.1 mbar. The inner pane faces face the internal volume, and the glazing assembly further includes at least one intumescent unit having a layer of intumescent material, an intumescent unit glass pane, and an intumescent unit peripheral spacer. The intumescent unit glass pane and the intumescent unit peripheral spacer define an intumescent unit volume, and the layer of intumescent material and the intumescent unit peripheral spacer face one of the outer pane faces of the first or second glass panes.

Provided is a laminated film comprising a base material, an anchor layer, a metal deposition layer, and a bonding layer, the metal deposition layer comprising indium, wherein an OD value is 1.2 or less, and wherein an a* value and a b* value of a transmitted light in a L*a*b* color space satisfy the following inequality (1):

OD value×(a*.sup.2+b*.sup.2).sup.1/2≤6.7  (1)

Provided is a laminated film comprising a base material, an anchor layer, a metal deposition layer, and a bonding layer, the metal deposition layer comprising indium, wherein an OD value is 1.2 or less, and wherein an a* value and a b* value of a transmitted light in a L*a*b* color space satisfy the following inequality (1):

OD value×(a*.sup.2+b*.sup.2).sup.1/2≤6.7  (1)

The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.

The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.