A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.

A sheet material container includes a container body that surrounds a containing portion for accommodating a content. The container body is formed of a container body-forming sheet member formed by layering a plurality of base material films. The container body-forming sheet member includes the plurality of base material films, an attaching layer by which the base material films are attached to each other, and a filler enclosed portion that is formed between the plurality of base material films and into which a filler is to be filled. The plurality of base material films are made from the same type of resins.

Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 μm. Ideally, a surface of the fluorine resin has an O content of at least 1.0%, as observed using ESCA.

The pressure sensitive adhesive tape is superior in moisture resistance because of its high peel strength and is easy to peel from an adherend by including a filler in the adhesive layers.

A laminate including a metal substrate having a chemically etched surface and a fluoroelastomer layer laminated in contact with the chemically etched surface or laminated in contact with a surface of a fluororesin layer laminated in contact with the chemically etched surface, and a gate seal including the laminate, are provided.

Methods for fabricating Class-A components (CAC) include providing a molding precursor which includes a first and second skin layer each including a fiber reinforcing material embedded in a polymer matrix, a third layer between the first and second skin layers and including a third polymer matrix and a filler material interspersed therein. The fiber reinforcing materials include a plurality of substantially aligned carbon fibers having a plurality of low strength regions staggered with respect to the second axis. The method includes disposing a molding precursor within a die, compression molding the molding precursor in the die, wherein the die includes a punch configured to contact the second skin layer, opening the die to create a gap between the punch and an outer surface of the second skin layer, and injecting a Class-A finish coat precursor into the gap to create a class-A surface layer and form the CAC.

A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.

A high-density foam cover board, including a high-density foam layer, wherein the high-density foam layer comprise polyurethane, polyisocyanurate, a filler, and a viscosity additive.

A composite fabric laminate can include an open mesh fabric, a first continuous film comprising a fluoropolymer, and a second continuous film comprising a fluoropolymer. The fluoropolymer of the first continuous film and the fluoropolymer of the second continuous films can be in direct contact with one another. A method of forming a composite fabric laminate that includes disposing an open mesh fabric between a first continuous film and a second continuous film, each comprising an at least partially unsintered fluoropolymer film, to form a composite; laminating the composite at a pressure of at least 100 psig and a temperature of no greater than 350° C.; and sintering the laminated composite to form the composite fabric laminate.

Multi-layer films and labels are disclosed herein. In an embodiment, a multi-layer film includes a core layer, a first intermediate layer disposed on a first side of the core layer, a second intermediate layer disposed on a second side of the core layer, a first skin layer disposed on the first intermediate layer and arranged such that the first intermediate layer is disposed between the core layer and the first skin layer, and a second skin layer disposed on the second intermediate layer and arranged such that the second intermediate layer is disposed between the core layer and the second skin layer, wherein the core layer includes first particles in an amount ranging from about 8 to about 20 wt %, based on the total weight of the core layer, the opacity is about 90 or greater, and the gloss ranges from about 60 to less than about 80.